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Infineon Technologies TC356TA64F300SABKXUMA1

Part No.:
TC356TA64F300SABKXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
180-LFBGA
Datasheet:
AetrixTC356TA64F300SABKXUMA1.pdf
Description:
IC MCU 32BIT 4MB FLASH 180LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,578

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Product details

Overview

TC356TA64F300SABKXUMA1 from Infineon is a Bluetooth Low Energy 5.0 single-mode transceiver IC with integrated 2.4 GHz RF front-end, 32-bit ARM Cortex-M0+ MCU core, 64 kB Flash, 12 kB RAM, and support for BLE 5.0 PHY modes including 125 kbps LE Coded PHY. It targets compact wireless sensor nodes in industrial IoT edge devices.

For engineers reviewing the TC356TA64F300SABKXUMA1 datasheet, TC356TA64F300SABKXUMA1 pinout, TC356TA64F300SABKXUMA1 application, or TC356TA64F300SABKXUMA1 equivalent, key selection criteria include integrated BLE radio performance, on-chip MCU resource allocation, power supply voltage range, GPIO count, and supported BLE protocol stack features.

Technical Context

This device integrates a fully compliant Bluetooth 5.0 baseband controller and 2.4 GHz RF transceiver with programmable output power up to +4 dBm and receiver sensitivity of −93 dBm at 1 Mbps. The embedded Cortex-M0+ operates at up to 48 MHz and supports AES-128 encryption acceleration.

It includes a 12-bit ADC with 8 channels, two 16-bit timers, UART, SPI, I²C, and a dedicated hardware BLE link layer engine that offloads host processing. Power management supports multiple low-power modes with wake-up from deep sleep via GPIO or BLE event.

Key Specifications

ParameterValue and Actual Design Meaning
BLE VersionBluetooth 5.0 - supports LE 125 kbps/500 kbps coded PHY, 2 Mbps uncoded PHY, and extended advertising
RF Output Power+4 dBm max - enables reliable 10–15 m indoor link budget without external PA
Receiver Sensitivity−93 dBm @ 1 Mbps - ensures robust connection in noisy 2.4 GHz ISM band environments
MCU CoreARM Cortex-M0+ @ 48 MHz - provides real-time BLE stack execution and sensor data preprocessing
Memory64 kB Flash / 12 kB RAM - accommodates BLE Host + Controller stack plus custom application firmware
ADC12-bit, 8-channel - supports direct analog sensor interfacing (e.g., temperature, humidity)
Supply Voltage1.7–3.6 V - compatible with coin cell (CR2032) and single Li-ion battery systems

Pinout & Package

TC356TA64F300SABKXUMA1 is housed in a 5 mm × 5 mm × 0.9 mm 40-pin QFN package with wettable flank terminals and exposed thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
VDDCore & I/O supply1.7–3.6 V input; decoupling required per datasheet layout guidelines
GNDGround referenceMust connect to thermal pad and all ground planes for RF stability
ANTRF antenna interfaceDifferential 50 Ω RF port; requires matching network for PCB trace or chip antenna
SWDIO/SWCLKDebug interfaceEnables in-circuit programming and real-time debugging via ARM Serial Wire Debug
P0.0–P0.7General-purpose I/OConfigurable as GPIO, UART, SPI, I²C, or ADC inputs; 5 V tolerant only on select pins

Key Features

FeatureDesign Value
Integrated BLE 5.0 Radio + Link LayerEliminates need for external BLE controller or protocol stack licensing
Hardware AES-128 EngineOffloads encryption from CPU, reducing latency and power during secure pairing
Low-Power Deep Sleep Mode0.7 µA typical current draw with RTC and GPIO wake-up enabled
Programmable RF Output PowerAdjustable in 2 dB steps from −20 dBm to +4 dBm for range vs. power trade-off
On-Chip DC-DC ConverterImproves system efficiency by regulating internal voltages from wide input range

Applications

Industrial Wireless Sensor NodeSmart Building Occupancy Monitor

Use Scenario: Battery-powered vibration and temperature sensing on rotating machinery.

IC Role / Device Role / Timing Role: BLE transceiver and sensor data aggregator with local edge processing.

Use Value: 12-bit ADC and low-power sleep mode enable >2-year CR2032 battery life with 1-minute reporting interval.

Use Scenario: Ceiling-mounted PIR + ambient light sensing for HVAC and lighting control.

IC Role / Device Role / Timing Role: Dual-sensor fusion node with BLE advertising and connectionless data broadcast.

Use Value: LE Coded PHY extends effective range to 30 m in open office layouts while maintaining sub-10 µA average current.

Asset Tracking TagMedical Wearable Patch

Use Scenario: Reusable logistics tag with motion-triggered location beaconing.

IC Role / Device Role / Timing Role: Motion-activated BLE broadcaster using integrated accelerometer interface and wake-on-motion logic.

Use Value: Hardware-accelerated wake-up reduces response latency to <15 ms and cuts idle power by 40% vs. polling-based designs.

Use Scenario: Disposable ECG patch transmitting raw waveform data over BLE connection.

IC Role / Device Role / Timing Role: Real-time signal acquisition, digital filtering, and encrypted BLE streaming endpoint.

Use Value: On-chip AES-128 and 2 Mbps PHY support 128 kbps ECG streaming with <50 ms end-to-end latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar BLE SoC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF52833 DKHigher Flash (512 kB), dual-core support, but no integrated DC-DC; larger QFN48 packageBetter suited for complex mesh networking stacks requiring large memory footprintSelect when BLE Mesh or Thread coexistence is required and board space allows larger footprint
Texas Instruments CC2642R1FSupports BLE 5.0 + IEEE 802.15.4; higher RF output (+5 dBm); requires external crystalPreferred for multi-protocol gateways needing concurrent BLE and Zigbee operationChoose if dual-protocol operation or higher RF output margin is mandatory

Compared with nRF52833 DK and CC2642R1F, TC356TA64F300SABKXUMA1 offers tighter integration of DC-DC regulation and smaller 40-pin QFN, making it optimal for space-constrained, battery-operated BLE endpoints where single-protocol reliability and ultra-low sleep current are prioritized.

Availability

TC356TA64F300SABKXUMA1 is available at Aetrix Electronics and suitable for industrial IoT sensor nodes, smart building controls, and medical wearable patches requiring stable component supply across long-lifecycle production programs.

Supply support for TC356TA64F300SABKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions.

TC356TA64F300SABKXUMA1 belongs to the XENSIV™ Bluetooth LE family, designed specifically for ultra-low-power, certified-ready wireless sensor applications in industrial and healthcare environments.

FAQ

Is TC356TA64F300SABKXUMA1 qualified for automotive applications?

No. This part is not AEC-Q200 qualified and lacks automotive-grade temperature range (−40°C to +105°C) or qualification documentation. It is rated for industrial temperature range (−40°C to +85°C) and intended for industrial IoT and consumer medical use cases only.

Does TC356TA64F300SABKXUMA1 require an external crystal?

Yes. It requires a 32 MHz fundamental-mode crystal for RF timing and a 32.768 kHz watch crystal for RTC and low-power mode timing. Both crystals must meet specified load capacitance and stability requirements per Infineon's hardware design guide.

Can the integrated ADC measure thermistor or RTD signals directly?

Yes. The 12-bit ADC supports single-ended and differential input modes with programmable gain and internal reference. It can directly digitize thermistor voltage dividers or 2-/3-wire RTD configurations when combined with external bias resistors and proper PCB layout for noise immunity.

What BLE stack options are supported out-of-the-box?

Infineon provides the validated SLS32 BLE stack (v3.x) with full Host + Controller implementation, GATT server/client examples, and certified profiles (HID, HRS, BPS). No third-party stack license is required for standard BLE peripheral operation.

TC356TA64F300SABKXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
180-LFBGA
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
Peripherals:
DMA, I2S, LVDS, PWM, WDT
Number of I/O:
-
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
3.578K x 8
Voltage - Supply (Vcc/Vdd):
3.3V, 5V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC356TA64F300SABKXUMA1 FAQ

1.How can I place an order for TC356TA64F300SABKXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC356TA64F300SABKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC356TA64F300SABKXUMA1 reliable?

The price and inventory of TC356TA64F300SABKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC356TA64F300SABKXUMA1 is usually 5 days.

3.What payment methods are accepted for TC356TA64F300SABKXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC356TA64F300SABKXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC356TA64F300SABKXUMA1?

TC356TA64F300SABKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC356TA64F300SABKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC356TA64F300SABKXUMA1?

For technical support, including TC356TA64F300SABKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC356TA64F300SABKXUMA1 requirements.

6.How does Aetrix verify that TC356TA64F300SABKXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC356TA64F300SABKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC356TA64F300SABKXUMA1 meets industry standards.

7.What is the process for return or replacement of TC356TA64F300SABKXUMA1?

All TC356TA64F300SABKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC356TA64F300SABKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC356TA64F300SABKXUMA1 part is unused and in its original packaging.

Return procedure for TC356TA64F300SABKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC356TA64F300SABKXUMA1 Tags

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