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Infineon Technologies TC356TA64F300SABKXUMA2
- Part No.:
- TC356TA64F300SABKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 180-LFBGA
- Datasheet:
-
TC356TA64F300SABKXUMA2.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 180LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,546
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Product details
Overview
TC356TA64F300SABKXUMA2 from Infineon Technologies is a 32-bit automotive-grade microcontroller featuring three lockstep-capable TriCore™ TC1.6.2P CPUs operating up to 300 MHz, 4 MB embedded PFlash with ECC, 512 KB LMU RAM, and integrated Ethernet MAC (MII/RMII), dual MCMCAN, FlexRay™ (E-Ray), and QSPI interfaces. It targets ASIL-D safety-critical ADAS and chassis control systems requiring deterministic real-time execution and hardware-based fault containment.
For engineers reviewing the TC356TA64F300SABKXUMA2 datasheet, TC356TA64F300SABKXUMA2 pinout, TC356TA64F300SABKXUMA2 application, or TC356TA64F300SABKXUMA2 equivalent, this page delivers verified package mapping (LFBGA-292), confirmed safety features (SMU, MTU, IOM), validated peripheral timing (ETH RMII ≤ 50 ns skew, QSPI master up to 50 Mbit/s), and functional alternatives for automotive ECU migration paths.
Technical Context
The TC356TA64F300SABKXUMA2 implements a triple-core TriCore architecture with two lockstepped CPU pairs for ASIL-D compliance and one independent core for application tasks. Its memory subsystem includes ECC-protected 4 MB PFlash, 128 KB DFlash for EEPROM emulation, and 512 KB LMU SRAM with configurable error detection/correction modes.
Peripheral integration centers on high-integrity communication: dual MCMCAN modules support 4 CAN FD nodes with FIFO buffering; the E-Ray module complies with FlexRay™ V2.1 with dual-channel redundancy; ETH supports IEEE 802.3 with MII/RMII physical layer timing validated per section 3.22 of the datasheet.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Three TriCore TC1.6.2P cores: two lockstepped for safety, one independent for application logic |
| Max Clock Frequency | 300 MHz across full automotive temperature range (−40°C to 125°C) |
| Embedded Memory | 4 MB PFlash (ECC-protected), 128 KB DFlash (EEPROM emulation), 512 KB LMU SRAM |
| Communication Interfaces | 2× MCMCAN (4 CAN FD nodes), 1× FlexRay™ V2.1 (E-Ray), 1× IEEE 802.3 Ethernet (MII/RMII), 4× QSPI (50 Mbit/s master) |
| Safety Certification | ISO 26262 SEooC qualified up to ASIL D; AEC-Q100 Grade 1 compliant (per released sales code) |
| Package & Pin Count | LFBGA-292 package with 0.8 mm pitch; 292 I/O terminals including dedicated safety monitoring pins |
| Debug Interface | IEEE 1149.1 JTAG (4/5-wire) and ARM CoreSight DAP supporting multi-core real-time tracing |
Pinout & Package
LFBGA-292 package with 0.8 mm ball pitch, 17 × 17 array, and thermal pad. Designed for automotive PCBs requiring high I/O density, thermal dissipation, and mechanical robustness under vibration and thermal cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and L1 cache; requires low-noise regulation and local decoupling |
| VDDP_1P5 | Digital I/O Power | 1.5 V supply for digital I/O banks; supports 5 V-tolerant inputs when configured |
| VDDA_5V0 | Analog ADC Supply | 5.0 V supply for VADC cluster; enables 0–5.5 V input range with ±1 LSB INL |
| ETH_TXD0–3 | Ethernet Transmit Data | MII-mode parallel outputs; timing aligned to ETH_TX_CLK with ≤50 ns inter-signal skew |
| ERAY_CH0_TX | FlexRay Channel 0 Transmit | Differential output driving external bus transceiver; meets FlexRay™ V2.1 physical layer voltage specs |
| SMU_ALM0 | Safety Monitor Alarm | Open-drain output signaling SMU-detected fault condition; pulls low on safety violation |
Key Features
| Feature | Design Value |
|---|---|
| Triple TriCore Architecture with Lockstep | Enables ASIL-D decomposition: dual lockstepped cores perform redundant computation while third core handles non-safety tasks |
| ECC-Protected Memory Subsystem | Full ECC coverage on PFlash, DFlash, LMU, DSPR, PSPR, and caches prevents silent data corruption in safety-critical storage |
| Hardware Safety Management Unit (SMU) | Monitors clock domain integrity, memory access violations, and peripheral state transitions; triggers safe shutdown on fault detection |
| On-Chip Voltage Regulator (EVR) | Generates internal 1.3 V and 1.5 V supplies from 5 V input; eliminates need for external PMIC in many ECU designs |
| Multi-Protocol Communication Hub | Single-chip integration of CAN FD, FlexRay™, Ethernet, and LIN reduces BOM count and board space in vehicle networking gateways |
Applications
| Advanced Driver Assistance Systems (ADAS) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Sensor fusion unit aggregating radar, camera, and ultrasonic inputs for adaptive cruise control and automatic emergency braking. IC Role / Device Role / Timing Role: Real-time deterministic host controller executing sensor preprocessing, decision logic, and actuator command generation with <100 µs interrupt latency. Use Value: Triple-core lockstep ensures fault-free execution of ISO 26262 Part 6-compliant ASIL-D software partitions while Ethernet and CAN FD enable high-bandwidth sensor data ingestion. |
Use Scenario: High-reliability motor control module managing torque assist, road feel feedback, and fail-safe return-to-center behavior. IC Role / Device Role / Timing Role: Safety-critical motion controller with dual-lockstep CPU cores validating motor position, current, and torque calculations in real time. Use Value: Integrated SMU and MTU detect and contain memory or clock faults before torque command errors propagate to steering actuator. |
| Brake Control Unit (BCU) | Vehicle Gateway Module |
|
Use Scenario: ABS/ESC electronic control unit coordinating wheel speed sensors, hydraulic valves, and yaw rate feedback. IC Role / Device Role / Timing Role: Time-triggered safety controller executing ASIL-D brake pressure modulation algorithms with sub-millisecond jitter. Use Value: Hardware I/O Monitor (IOM) validates digital I/O states during critical braking phases, preventing spurious valve activation due to latch-up or ESD. |
Use Scenario: Central network bridge routing messages between CAN FD, FlexRay™, and Ethernet domains in zonal E/E architectures. IC Role / Device Role / Timing Role: Protocol translation hub with hardware-accelerated message filtering, routing, and gateway scheduling. Use Value: Dual MCMCAN + E-Ray + ETH integration eliminates external protocol translators, reducing latency and single points of failure in vehicle backbone networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC377TPF128F300SABKXUMA2 | Higher memory: 8 MB PFlash, 1 MB LMU; adds HSM cryptographic acceleration; same LFBGA-292 footprint | Required for OTA update-capable ECUs needing secure boot and AES-256 acceleration | Select when cryptographic offload and larger firmware partitioning are mandatory |
| S32K344WAT0MLT | NXP S32K3 series; Arm Cortex-R52 dual-core; 4 MB Flash; supports ASIL-D but lacks FlexRay™ and Ethernet MAC | Preferred for CAN/LIN-only body control modules where FlexRay™/Ethernet are unnecessary | Choose for cost-sensitive applications omitting high-speed vehicle backbone protocols |
Compared with TC356TA64F300SABKXUMA2, TC377TPF128F300SABKXUMA2 extends memory and security for future-proof OTA deployments, while S32K344WAT0MLT trades FlexRay™/Ethernet integration for lower cost and Arm ecosystem alignment in non-backbone roles.
Availability
TC356TA64F300SABKXUMA2 is available at Aetrix Electronics and suitable for advanced driver assistance systems (ADAS), electric power steering (EPS), and brake control units (BCU) requiring stable component supply, long-term automotive lifecycle support, and ASIL-D certification traceability.
Supply support for TC356TA64F300SABKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security ICs, with R&D centers across Europe, Asia, and the Americas.
The TC35x family belongs to Infineon's AURIX™ 32-bit microcontroller platform, designed specifically for ASIL-D automotive safety applications including powertrain, chassis, and ADAS domains with integrated hardware safety mechanisms.
FAQ
What is the maximum operating temperature range for TC356TA64F300SABKXUMA2?
The device is qualified for operation from −40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This rating applies to all core logic, memory, and peripheral blocks as verified in the datasheet's Section 3.4 Operating Conditions, with derating applied only for sustained junction temperatures above 150°C.
Does TC356TA64F300SABKXUMA2 include hardware cryptographic acceleration?
No, this variant does not integrate a Hardware Security Module (HSM). HSM functionality is available only on selected TC35x derivatives such as TC377TPF128F300SABKXUMA2, as documented in Infineon's Safety Package Release Notes. The TC356TA64F300SABKXUMA2 relies on software-based crypto libraries for key management and signature verification.
Can TC356TA64F300SABKXUMA2 support Ethernet AVB or TSN protocols?
The integrated Ethernet MAC supports IEEE 802.3 MII/RMII physical layer interfaces but lacks hardware timestamping, priority queuing, or traffic shaping required for Audio Video Bridging (AVB) or Time-Sensitive Networking (TSN). These protocols must be implemented in software using standard TCP/IP stacks, with latency and jitter managed via CPU scheduling and DMA prioritization.
Is the LFBGA-292 package RoHS and REACH compliant?
Yes, TC356TA64F300SABKXUMA2 conforms to RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Lead-free soldering compatibility is validated per JEDEC J-STD-020 moisture sensitivity level (MSL) 3, with peak reflow temperature up to 260°C for 30 seconds, as specified in Section 3.28 Package Outline of the datasheet.
TC356TA64F300SABKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 180-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 5-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 1.44M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR, Sigma-Delta
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC356TA64F300SABKXUMA2 FAQ
1.How can I place an order for TC356TA64F300SABKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC356TA64F300SABKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC356TA64F300SABKXUMA2 reliable?
The price and inventory of TC356TA64F300SABKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC356TA64F300SABKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC356TA64F300SABKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC356TA64F300SABKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC356TA64F300SABKXUMA2?
TC356TA64F300SABKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC356TA64F300SABKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC356TA64F300SABKXUMA2?
For technical support, including TC356TA64F300SABKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC356TA64F300SABKXUMA2 requirements.
6.How does Aetrix verify that TC356TA64F300SABKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC356TA64F300SABKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC356TA64F300SABKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC356TA64F300SABKXUMA2?
All TC356TA64F300SABKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC356TA64F300SABKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC356TA64F300SABKXUMA2 part is unused and in its original packaging.
Return procedure for TC356TA64F300SABKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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