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Infineon Technologies TC357TA64F300SABKXUMA1
- Part No.:
- TC357TA64F300SABKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC357TA64F300SABKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,619
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Product details
Overview
TC357TA64F300SABKXUMA1 from Infineon Technologies is a 32-bit automotive-grade microcontroller featuring three lockstep-capable TriCore™ TC1.6.2P CPUs operating up to 300 MHz, 4 MB embedded PFlash with ECC, 512 KB LMU RAM, dual MCMCAN (4 CAN nodes), FlexRay™ v2.1, IEEE 802.3 Ethernet MAC (MII/RMII), and hardware safety support for ASIL D per ISO 26262. It targets high-integrity powertrain and chassis control systems requiring deterministic real-time execution and functional safety.
For engineers reviewing the TC357TA64F300SABKXUMA1 datasheet, TC357TA64F300SABKXUMA1 pinout, TC357TA64F300SABKXUMA1 application, or TC357TA64F300SABKXUMA1 equivalent, this device demands attention to its triple-core lockstep architecture, safety management unit (SMU), HSM option, E-Ray timing compliance, and 292-pin LFBGA package layout for PCB routing and thermal design.
Technical Context
The TC357TA64F300SABKXUMA1 implements a tri-core TriCore™ architecture with two cores in lockstep for ASIL D fault detection and one independent core for application tasks. Its System PLL delivers up to 300 MHz CPU clock, while the Peripheral PLL independently clocks ETH, E-Ray, and QSPI modules at precise frequencies required by protocol specifications.
It integrates a 64-channel DMA controller with safe data transfer, ECC-protected memories (PFlash, DFlash, SRAM), and a Safety Management Unit (SMU) that monitors CPU, memory, and peripheral health. The on-chip Hardware Security Module (HSM) supports secure boot, cryptographic acceleration (AES-128/256, SHA-256), and key lifecycle management - all verified per EVITA Full and ISO 21434 alignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Three TriCore™ TC1.6.2P cores: two lockstepped for ASIL D, one independent for application logic |
| Max Clock Frequency | 300 MHz across full automotive temperature range (−40 °C to 125 °C) |
| Embedded Memory | 4 MB PFlash (ECC-protected), 128 KB DFlash (EEPROM emulation), 512 KB LMU RAM |
| Communication Interfaces | 2× MCMCAN (4 CAN nodes), 1× FlexRay™ v2.1 (2 channels), 1× IEEE 802.3 Ethernet (MII/RMII), 4× QSPI, 4× ASCLIN (LIN v2.1) |
| Analog Peripherals | VADC with 2 independent kernels, 0–5.5 V input range, up to 12-bit resolution |
| Safety Certification | ISO 26262 SEooC certified up to ASIL D; AEC-Q100 Grade 1 qualified (per released sales code) |
| Debug & Trace | OCDS Level 1 support, multi-core debugging, real-time tracing via DAP/JTAG (IEEE 1149.1) |
Pinout & Package
This device uses a 292-pin LFBGA package (15 mm × 15 mm, 0.8 mm pitch) with exposed thermal pad for automotive thermal management. Pin assignment follows Infineon's standardized TC35x AB-Step pinout layout optimized for signal integrity, power distribution, and functional safety partitioning.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0 – VDDP_15 | Core Power Supply (1.25 V) | Dedicated 16 pins for low-noise CPU/SRAM power delivery; decoupling critical for 300 MHz operation |
| VDDA_0 – VDDA_3 | Analog Power Supply (5 V) | Isolated analog domain supply for VADC and reference circuitry; enables 0–5.5 V input range |
| ETH_TXD0–ETH_TXD3 | Ethernet Transmit Data (RGMII) | 4-bit RGMII transmit bus supporting 100/1000 Mbps; requires matched-length routing and 50 Ω termination |
| ERAY_TxD_A / ERAY_RxD_A | FlexRay™ Channel A Differential I/O | High-speed differential pair (10 Mbps) with integrated termination; routed as controlled-impedance pair |
| TRSTN / TCK / TMS / TDI / TDO | JTAG Debug Interface | IEEE 1149.1-compliant boundary-scan and debug access; supports OCDS Level 1 for multi-core visibility |
Key Features
| Feature | Design Value |
|---|---|
| Triple-Core Lockstep Architecture | Enables continuous comparison of primary and shadow core outputs to detect transient faults - foundational for ASIL D compliance |
| Hardware Security Module (HSM) | Offloads secure boot verification, AES-128/256 encryption, and SHA-256 hashing from main cores - preserves real-time latency |
| ECC-Protected Memory Subsystem | Full coverage across PFlash, DFlash, DSPR, PSPR, and LMU ensures single-bit error correction and double-bit error detection |
| Safety Management Unit (SMU) | Centralized monitoring of CPU lockstep mismatches, memory BIST failures, watchdog timeouts, and peripheral health flags |
| Flexible Clock Generation | Dual PLLs (SYS_PLL + PER_PLL) allow independent frequency domains: 300 MHz for CPU, 50 MHz for QSPI, 80 MHz for ETH, etc. |
Applications
| Engine Control Unit (ECU) | Brake Control Module (BCM) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection sequencing, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL D software partitions with lockstep CPU validation and SMU-monitored memory. Use Value: Deterministic 300 MHz execution enables sub-microsecond response to crankshaft position events and closed-loop torque control. |
Use Scenario: ABS, ESC, and electronic parking brake actuation with fail-operational redundancy. IC Role / Device Role / Timing Role: Dual-lockstep core handles safety-critical braking logic; independent core manages diagnostics and CAN gateway functions. Use Value: Integrated MCMCAN and FlexRay™ support concurrent communication with wheel speed sensors, hydraulic modulators, and vehicle networks. |
| Advanced Driver Assistance Systems (ADAS) Domain Controller | Electric Powertrain Inverter Control |
|
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for adaptive cruise and automatic emergency braking. IC Role / Device Role / Timing Role: High-bandwidth Ethernet (RMII/MII) interfaces connect to radar SoCs; VADC samples analog sensor signals with 12-bit precision. Use Value: 4 MB PFlash stores multiple neural network inference models; HSM secures OTA update authentication and key provisioning. |
Use Scenario: Closed-loop motor control for traction inverters using space-vector PWM and current sensing feedback. IC Role / Device Role / Timing Role: CCU6 timer units generate precise PWM waveforms; GPT120 measures rotor position via encoder signals. Use Value: VADC cluster captures shunt-based phase currents with <1 μs sampling jitter - essential for field-oriented control stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-integrity automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC377TP64F300SABKXUMA1 | Same AB-step silicon, but includes integrated HSM enabled by default and enhanced crypto accelerators (RSA-2048, ECC NIST-P256) | Required where secure boot, TLS offload, or PKI-based key exchange is mandatory (e.g., OTA-updatable ECUs) | Select when cryptographic throughput >100 kbps AES-GCM or RSA signing latency <5 ms is required |
| TC337G64F300SABKXUMA1 | Reduced feature set: no Ethernet MAC, no FlexRay™, only 2 MByte PFlash, 256 KB LMU, and single MCMCAN (2 nodes) | Suitable for cost-sensitive ASIL B/C applications like body control modules or HVAC controllers | Choose for non-networked, lower-compute automotive functions where footprint and BOM cost outweigh protocol flexibility |
Compared with TC357TA64F300SABKXUMA1, TC377 offers higher security throughput at identical real-time performance, while TC337 trades protocol breadth and memory for reduced package size and cost - enabling tiered platform scaling across vehicle domains.
Availability
TC357TA64F300SABKXUMA1 is available at Aetrix Electronics and suitable for engine control units, brake control modules, ADAS domain controllers, and electric powertrain inverter control systems requiring stable component supply, long-term automotive qualification, and functional safety traceability.
Supply support for TC357TA64F300SABKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The AURIX™ TC3xx product line was designed specifically for ASIL D automotive applications - integrating lockstep cores, safety peripherals, and hardware security to replace discrete safety mechanisms with integrated silicon-level assurance.
FAQ
What is the maximum operating temperature range for TC357TA64F300SABKXUMA1?
The TC357TA64F300SABKXUMA1 is rated for −40 °C to +125 °C ambient temperature, validated per AEC-Q100 Grade 1 requirements. This range applies to all core, memory, and peripheral functions including 300 MHz CPU operation, Ethernet PHY interface timing, and VADC conversion accuracy - confirmed in Section 3.4 of the 2021-03 datasheet.
Does TC357TA64F300SABKXUMA1 include an integrated Ethernet PHY?
No, TC357TA64F300SABKXUMA1 integrates only the IEEE 802.3 Media Access Control (MAC) layer with MII and RMII interfaces. An external PHY (e.g., Infineon's TLF35584 or third-party 100BASE-TX PHY) is required for physical layer signaling, transformer coupling, and ESD protection - as specified in Section 3.22 of the datasheet.
How is functional safety implemented in the TC357TA64F300SABKXUMA1?
Functional safety is implemented via hardware-enforced mechanisms: dual lockstep CPU cores with continuous output comparison, ECC on all memories, Safety Management Unit (SMU) monitoring CPU exceptions and peripheral errors, Memory Test Unit (MTU) for startup and runtime BIST, and Hardware I/O Monitor (IOM) validating digital pin states - all documented in Sections 1 and 3.14–3.16 of the datasheet.
Can TC357TA64F300SABKXUMA1 support simultaneous CAN FD and Classical CAN communication?
Yes - each of its two MCMCAN modules supports both Classical CAN (up to 1 Mbps) and CAN FD (up to 5 Mbps) in independent configurations. One module can operate in CAN FD mode for high-bandwidth radar data, while the other handles Classical CAN for legacy body networks - verified in Section 3.23 and the MCMCAN user manual.
TC357TA64F300SABKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
- Peripherals:
- DMA, I2S, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 3.6M x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC357TA64F300SABKXUMA1 FAQ
1.How can I place an order for TC357TA64F300SABKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC357TA64F300SABKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC357TA64F300SABKXUMA1 reliable?
The price and inventory of TC357TA64F300SABKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC357TA64F300SABKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC357TA64F300SABKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC357TA64F300SABKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC357TA64F300SABKXUMA1?
TC357TA64F300SABKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC357TA64F300SABKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC357TA64F300SABKXUMA1?
For technical support, including TC357TA64F300SABKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC357TA64F300SABKXUMA1 requirements.
6.How does Aetrix verify that TC357TA64F300SABKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC357TA64F300SABKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC357TA64F300SABKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC357TA64F300SABKXUMA1?
All TC357TA64F300SABKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC357TA64F300SABKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC357TA64F300SABKXUMA1 part is unused and in its original packaging.
Return procedure for TC357TA64F300SABKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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