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Infineon Technologies TC357TA64F300SABKXUMA2
- Part No.:
- TC357TA64F300SABKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC357TA64F300SABKXUMA2.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,849
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Product details
Overview
TC357TA64F300SABKXUMA2 from Infineon is a 32-bit AURIX™ TriCore™ multicore microcontroller with six CPU cores (3× lockstep safety cores + 3× application cores), 6 MB on-chip flash, 4.5 MB SRAM, and integrated safety mechanisms including ASIL-D compliance per ISO 26262. It integrates dual MCMCAN, GETH Ethernet MAC, FlexRay, QSPI, and hardware security modules. Used in automotive powertrain and chassis control units requiring functional safety certification.
For engineers reviewing the TC357TA64F300SABKXUMA2 datasheet, TC357TA64F300SABKXUMA2 pinout, TC357TA64F300SABKXUMA2 application, or TC357TA64F300SABKXUMA2 equivalent, key selection criteria include ASIL-D decomposition support, dual-core lockstep architecture, real-time interrupt latency ≤ 100 ns, integrated HSM for secure boot, and qualification per AEC-Q100 Grade 1 (-40°C to +125°C).
Technical Context
The TC357TA64F300SABKXUMA2 implements a heterogeneous multicore architecture: three TriCore™ TC1.6.2 CPUs operate in lockstep pairs for safety-critical tasks (CPU0/1, CPU2/3), while CPU4 runs independently for application processing. All cores share a coherent L2 cache and access unified memory via a 128-bit crossbar switch.
Its safety infrastructure includes end-to-end ECC on all memories, lockstep comparator monitoring, SMU-based alarm management, and dedicated safety channels for clock, voltage, and temperature monitoring - enabling full ASIL-D decomposition across software and hardware layers per ISO 26262-5 Annex D.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | TriCore™ TC1.6.2 (32-bit), 6 cores: 3 lockstep pairs + 1 independent core |
| Max Clock Frequency | 300 MHz - enables deterministic real-time response with ≤100 ns interrupt latency |
| On-chip Flash | 6 MB PFlash with ECC, sector erase capability, and 100k write/erase cycles |
| RAM Capacity | 4.5 MB SRAM (including 2 MB safety RAM with lockstep/ECC) |
| Safety Certification | ISO 26262 ASIL-D compliant, with integrated Safety Manual v2.0 and FMEDA data |
| Interface Peripherals | Dual MCMCAN (ISO 11898-1:2015), GETH 10/100 Mbps MAC, FlexRay v2.1A, QSPI x2, ASC x12 |
| Operating Temp | AEC-Q100 Grade 1: −40 °C to +125 °C ambient - qualified for engine bay and transmission ECU placement |
Pinout & Package
TC357TA64F300SABKXUMA2 is housed in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignment follows Infineon's standardized AURIX™ TC3xx pinout layout for mechanical and thermal compatibility across AB-step derivatives.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP3 / VDDP2 | Core Power Supply | 1.3 V ±5% supply for CPU/SRI domains; requires low-noise regulation and local decoupling |
| VDDM | Memory Power Supply | 1.2 V ±5% supply for flash/SRAM; must ramp before VDDP3 during cold start per PMS_TC.006 erratum |
| PORST | Power-On Reset Input | Active-low reset asserted until VDDM stabilizes - delay critical for safe initialization sequence |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Supports 20–40 MHz fundamental-mode crystals; internal PLL generates fSYS = 300 MHz |
| ETH_MDIO / ETH_MDC | IEEE 802.3 Management Interface | Configures external PHY registers; operates at ≤10 MHz, compatible with standard PHYs (e.g., LAN8742A) |
| MCAN0_TX / MCAN0_RX | High-Speed CAN Physical Layer I/O | Direct connection to CAN transceiver (e.g., TJA1044); supports bit rates up to 5 Mbps |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Security Module (HSM) | Integrated cryptographic accelerator supporting AES-128/256, SHA-256, RSA-2048, and secure boot with certificate chain validation |
| End-to-End ECC Protection | SECDED ECC on all SRAM, PFlash, and DFlash - detects single-bit and corrects double-bit errors in real time |
| Dual Lockstep Core Pairs | CPU0/1 and CPU2/3 operate in lockstep with continuous comparator monitoring and automatic error containment per ISO 26262 CLA |
| Flexible Safety Monitoring Unit (SMU) | Configurable alarm routing with 64 independent alarms, programmable reaction (reset/interrupt/shutdown), and traceable status logging |
| Multi-Channel Memory Protection Unit (MPU) | 16 regions with read/write/execute permissions per core - enforces memory isolation between safety and application partitions |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection, and knock control under transient load conditions. IC Role / Device Role / Timing Role: Primary ASIL-D controller executing safety-critical torque calculation and actuator command arbitration. Use Value: Sub-100 ns interrupt latency and lockstep core redundancy ensure deterministic response to misfire detection within 2 crankshaft degrees. | Use Scenario: Torque overlay, assist compensation, and fault-tolerant motor current control during steering maneuvers. IC Role / Device Role / Timing Role: Dual-lockstep core pair manages motor FOC loop (≤10 µs cycle) while independent core handles CAN FD diagnostics and HMI interface. Use Value: Integrated MCMCAN and GETH enable simultaneous vehicle network communication and OTA firmware update without external bridge ICs. |
| Brake-by-Wire System | Vehicle Domain Controller |
Use Scenario: Pressure modulation, wheel slip detection, and fail-operational hydraulic valve control during ABS/EBD activation. IC Role / Device Role / Timing Role: Safety-certified execution environment for ISO 26262 Part 10-compliant brake actuation algorithms. Use Value: On-chip safety mechanisms (SMU, ECC, lockstep) eliminate need for external safety monitor, reducing BOM count and PCB area by ≥35%. | Use Scenario: Centralized coordination of ADAS sensor fusion, gateway routing, and over-the-air update orchestration. IC Role / Device Role / Timing Role: Application core (CPU4) hosts Linux-based middleware; safety cores manage secure boot, crypto offload, and watchdog supervision. Use Value: Hardware-enforced memory partitioning prevents untrusted applications from accessing safety-critical memory regions, satisfying ASIL-B to ASIL-D partitioning requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC377TP160F300SBJXUMA1 | Same AB-step silicon, but 160-pin TQFP; adds 2x additional ASC, 1x additional QSPI, and 512 kB extra SRAM | Targeted at higher peripheral density use cases (e.g., multi-sensor gateway) where pin count and memory headroom exceed TC357 requirements | Select when needing >12 ASC channels or dual QSPI masters for parallel flash expansion |
| TC387QP200F300SBJXUMA1 | Higher integration: adds HSMv2 (AES-GCM, ECDSA), 8 MB flash, and enhanced GETH with IEEE 1588 timestamping | Required for secure OTA updates with signed firmware images and time-synchronized sensor networks (e.g., radar fusion) | Choose when cryptographic acceleration beyond AES-128 or sub-100 ns PTP timestamp resolution is mandatory |
Compared with TC357TA64F300SABKXUMA2, TC377 offers peripheral scalability without safety feature reduction, while TC387 delivers hardened security and precision timing - making TC357 the optimal balance of ASIL-D capability, cost, and footprint for mainstream powertrain ECUs.
Availability
TC357TA64F300SABKXUMA2 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, and brake-by-wire systems requiring stable component supply, long-term lifecycle support, and ASIL-D certified silicon.
Supply support for TC357TA64F300SABKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D centers and AEC-Q100-qualified wafer fabs.
The AURIX™ TC3xx product line was designed specifically for ASIL-D automotive safety applications - integrating lockstep cores, hardware safety monitors, and certified toolchains to reduce functional safety certification effort for Tier 1 suppliers.
FAQ
What is the significance of the 'AB' marking in TC357TA64F300SABKXUMA2?
The 'AB' denotes the device's silicon revision step, corresponding to the TC35x AB-Step Data Sheet V1.1 (2021-03) and Errata Sheet v2.4 (2024-09-09). This step includes documented functional deviations (e.g., MCMCAN_AI.017 retransmission issue) and parametric corrections (e.g., FLASH_TC.P003 erase timing), which must be addressed in hardware design and software initialization sequences.
Does TC357TA64F300SABKXUMA2 support JTAG debugging?
No - it uses DAP (Debug Access Port) over SWD (Serial Wire Debug) exclusively. The device lacks JTAG TAP controller logic; debug access requires Infineon's DAPLink-compatible probes (e.g., MemTool or iLLD-based debuggers) and adherence to the ED Target Specification v3.2.0 for trace and memory access.
How does the erratum PER_PLL_TC.001 affect system clock configuration?
PER_PLL_TC.001 prohibits use of the Peripheral PLL Divider Bypass mode. Attempting to bypass causes undefined behavior in peripheral clock domains. Designers must configure the PER_PLL with integer K-dividers only and verify fPER = fSYS / K in all operating modes using SCU_PLLCONx registers before enabling peripherals.
Is external flash required for booting TC357TA64F300SABKXUMA2?
No - it boots directly from on-chip 6 MB PFlash using the Boot ROM (BROM) with configurable boot sources (CAN, SPI, UART). External flash is optional for firmware updates or data logging; the BROM supports secure boot verification against HSM-signed images stored in internal flash.
TC357TA64F300SABKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 5-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 1.44M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR, Sigma-Delta
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC357TA64F300SABKXUMA2 FAQ
1.How can I place an order for TC357TA64F300SABKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC357TA64F300SABKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC357TA64F300SABKXUMA2 reliable?
The price and inventory of TC357TA64F300SABKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC357TA64F300SABKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC357TA64F300SABKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC357TA64F300SABKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC357TA64F300SABKXUMA2?
TC357TA64F300SABKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC357TA64F300SABKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC357TA64F300SABKXUMA2?
For technical support, including TC357TA64F300SABKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC357TA64F300SABKXUMA2 requirements.
6.How does Aetrix verify that TC357TA64F300SABKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC357TA64F300SABKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC357TA64F300SABKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC357TA64F300SABKXUMA2?
All TC357TA64F300SABKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC357TA64F300SABKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC357TA64F300SABKXUMA2 part is unused and in its original packaging.
Return procedure for TC357TA64F300SABKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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