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Infineon Technologies TC357TH64F300SABKXUMA2
- Part No.:
- TC357TH64F300SABKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC357TH64F300SABKXUMA2.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,872
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Product details
Overview
TC357TH64F300SABKXUMA2 from Infineon Technologies is a 32-bit automotive-grade microcontroller featuring three lockstep-capable TriCore™ TC1.6.2P CPUs operating up to 300 MHz, 4 MB embedded PFlash with ECC, 512 KB LMU RAM, dual MCMCAN (4 CAN nodes), FlexRay™ v2.1, IEEE 802.3 Ethernet MAC (MII/RMII), and ISO 26262 ASIL-D-ready safety architecture - deployed in ADAS domain controllers and vehicle gateway modules.
For engineers reviewing the TC357TH64F300SABKXUMA2 datasheet, TC357TH64F300SABKXUMA2 pinout, TC357TH64F300SABKXUMA2 application, or TC357TH64F300SABKXUMA2 equivalent, key selection criteria include triple-core lockstep timing integrity, on-chip HSM support for secure boot, 300 MHz real-time execution at -40°C to +125°C, and integrated Ethernet/FlexRay/CAN coexistence for centralized vehicle networking.
Technical Context
The TC357TH64F300SABKXUMA2 implements a safety-critical multi-core architecture where two TriCore CPUs operate in lockstep mode with third core as checker or independent application processor. Its System PLL delivers stable 300 MHz core clocks while Peripheral PLL independently drives high-speed interfaces including Ethernet MAC and QSPI.
Memory subsystem includes ECC-protected 4 MB PFlash, 128 KB DFlash for EEPROM emulation, and 512 KB LMU SRAM with configurable retention. Safety features include SMU, MTU (MBIST/ECC initialization), IOM for I/O monitoring, and OCDS Level 1 debug with real-time tracing across all three cores.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Three 32-bit TriCore TC1.6.2P CPUs; two in lockstep + one independent for ASIL-D safety-critical applications |
| Max Core Frequency | 300 MHz across full industrial temperature range (-40°C to +125°C) with guaranteed timing closure |
| Embedded Flash | 4 MB Program Flash (PFLASH) with ECC protection and 128 KB Data Flash (DFLASH0) for EEPROM emulation |
| On-chip RAM | 512 KB Local Memory Unit (LMU) SRAM + 240 KB DSPR + 64 KB PSPR + 32 KB ICACHE + 16 KB DCACHE |
| Communication Peripherals | 2× MCMCAN (4 CAN nodes), 1× FlexRay v2.1 (2 channels), 1× IEEE 802.3 Ethernet MAC (MII/RMII), 4× QSPI, 4× ASCLIN |
| Safety Certification | ISO 26262 SEooC certified up to ASIL D; AEC-Q100 Grade 1 qualified (−40 °C to +125 °C ambient) |
| Debug Interface | Four/five-wire JTAG (IEEE 1149.1) and Device Access Port (DAP) supporting multi-core real-time tracing and calibration |
Pinout & Package
LFBGA-292 package (15 × 15 mm, 0.8 mm pitch) with 292 I/O terminals; supports 5 V / 3.3 V switchable I/Os, high-performance LVDS pads, and dedicated power/ground ball mapping per supply domain (VDDP, VDDIO, VDDA, VSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0–VDDP_7 | Core Power Supply | Eight dedicated 1.25 V core supply pins for CPU clusters and SRI interconnect; decoupling required per Infineon layout guidelines |
| VDDIO_A–VDDIO_D | I/O Bank Power | Four independent 3.3 V/5 V switchable I/O supply domains enabling mixed-voltage interface routing (e.g., CAN transceivers + Ethernet PHY) |
| ETH_MDC/MDIO | Ethernet Management | Dedicated MDIO/MDC pins compliant with IEEE 802.3 clause 22; support auto-negotiation and PHY register access without software overhead |
| ERAY_TX0/RX0 | FlexRay Channel 0 | Differential pair for FlexRay v2.1 communication at up to 10 Mbps; internal termination and slew rate control enabled by default |
| ASC0_TX/ASC0_RX | ASCLIN LIN Interface | Hardware-supported LIN v2.1 physical layer with automatic sync-break detection and checksum generation for body control modules |
Key Features
| Feature | Design Value |
|---|---|
| Triple-Core Lockstep Execution | Two TriCore CPUs run identical code with cycle-accurate comparison; third core handles non-safety tasks or acts as redundant checker |
| Integrated Hardware Security Module (HSM) | Optional HSM enables secure boot, cryptographic acceleration (AES-128/256, SHA-256), and key provisioning without external secure element |
| On-Chip Memory Test Unit (MTU) | Automated ECC initialization, memory built-in self-test (MBIST), and fault injection testing for ISO 26262 FMEDA compliance |
| Flexible Clock Generation | Independent SYS_PLL (core clock) and PER_PLL (peripheral clock) allow asynchronous operation of Ethernet, CAN, and FlexRay domains |
| Dual MCMCAN with FIFO Buffering | Each MCMCAN supports 4 CAN nodes with hardware message filtering, timestamping, and 32-entry TX/RX FIFOs reducing CPU interrupt load by >70% |
Applications
| ADAS Domain Controller | Vehicle Gateway Module |
|---|---|
|
Use Scenario: Centralized sensor fusion unit aggregating radar, camera, and ultrasonic data for L2+ autonomous driving functions. IC Role / Device Role / Timing Role: Primary compute engine executing real-time perception stack with deterministic latency under ASIL-D constraints. Use Value: Triple-core lockstep ensures fault-detection coverage >99% for safety-critical path; 300 MHz sustained throughput meets 100 ms sensor-to-actuator loop budget. |
Use Scenario: High-bandwidth communication hub bridging CAN FD, FlexRay, Ethernet, and LIN networks across chassis, powertrain, and infotainment domains. IC Role / Device Role / Timing Role: Network protocol translator and firewall enforcing domain isolation with hardware-accelerated packet filtering. Use Value: Integrated MCMCAN (4 nodes), FlexRay v2.1, and IEEE 802.3 MAC eliminate external bridge ICs; reduces BOM cost by $2.10/unit and PCB area by 38 mm². |
| Radar Signal Processor | Electric Powertrain Control |
|
Use Scenario: 77 GHz automotive radar ECU performing FFT-based object detection and tracking using raw ADC samples from RF front-end. IC Role / Device Role / Timing Role: Real-time DSP accelerator leveraging TriCore's MAC units and VADC cluster for synchronous sampling at 5 MSPS. Use Value: On-chip VADC with 0–5.5 V input range directly interfaces radar IF signals; 240 KB DSPR enables full chirp processing in scratchpad without DRAM latency. |
Use Scenario: Inverter control unit managing IGBT/SiC gate drivers, current sensing, and torque calculation in 800 V EV traction systems. IC Role / Device Role / Timing Role: Safety-certified motor controller executing field-oriented control (FOC) loops at 25 kHz with <1 µs jitter tolerance. Use Value: CCU6 capture/compare timers deliver sub-microsecond PWM dead-time control; SMU monitors voltage/current faults and triggers safe shutdown within 10 µs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC377TP64F300SABKXUMA2 | Same AB-step silicon but with enhanced HSM (full AES-GCM, ECDSA); no change in core count or peripheral set | Required when TLS 1.3 handshake or asymmetric crypto signing is needed in OTA update flow | Select if cryptographic offload beyond basic secure boot is mandated by OEM security policy |
| S32K344UAT0VLQY | NXP S32K3 series with Arm Cortex-R52 cores; single-core lockstep only; no FlexRay or Ethernet MAC | Targeted at mid-tier body electronics where CAN/LIN dominance reduces need for high-speed domain networking | Choose for cost-sensitive gateway designs omitting FlexRay/Ethernet, prioritizing Arm ecosystem tooling over TriCore legacy support |
Compared with TC357TH64F300SABKXUMA2, TC377TP64F300SABKXUMA2 adds production-grade HSM features without sacrificing performance or safety certification, while S32K344UAT0VLQY trades FlexRay/Ethernet integration for lower unit cost and Arm-based development familiarity - making it suitable only where those interfaces are excluded from system architecture.
Availability
TC357TH64F300SABKXUMA2 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, vehicle gateway modules, radar signal processors, and electric powertrain control units requiring stable component supply across extended product lifecycles.
Supply support for TC357TH64F300SABKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich with global R&D and manufacturing operations.
The TC35x family belongs to Infineon's AURIX™ platform - designed specifically for safety-critical automotive applications demanding ASIL-D compliance, real-time determinism, and multi-protocol networking in centralized E/E architectures.
FAQ
What is the maximum operating temperature range for TC357TH64F300SABKXUMA2?
The TC357TH64F300SABKXUMA2 is qualified for operation from −40 °C to +125 °C ambient temperature per AEC-Q100 Grade 1 requirements. All electrical specifications, including 300 MHz core frequency and Ethernet MAC timing, are guaranteed across this full range with appropriate thermal design and board-level decoupling.
Does TC357TH64F300SABKXUMA2 include hardware support for secure boot?
Yes - the device integrates an optional Hardware Security Module (HSM) that performs cryptographic verification of boot images using SHA-256 and RSA-2048 signatures. When enabled, HSM enforces immutable root-of-trust before releasing CPU cores from reset, meeting UNECE R155 and ISO/SAE 21434 cybersecurity requirements.
Can TC357TH64F300SABKXUMA2 support simultaneous CAN FD and Classic CAN communication?
Yes - each of the two MCMCAN modules supports mixed-mode operation: one node can run CAN FD (up to 5 Mbps) while others operate in Classic CAN (1 Mbps) on the same module. Hardware message filtering and separate TX/RX FIFOs enable concurrent handling without CPU intervention or arbitration delay.
Is external RAM required for typical TC357TH64F300SABKXUMA2 applications?
No - the device integrates 512 KB of on-chip LMU SRAM, plus 240 KB DSPR and 64 KB PSPR, eliminating need for external RAM in most automotive applications. Only memory-intensive radar FFT or deep-learning inference workloads may require external DDR via optional EMIF interface - not implemented in this specific variant (SABKXUMA2).
TC357TH64F300SABKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 5-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 960K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR, Sigma-Delta
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC357TH64F300SABKXUMA2 FAQ
1.How can I place an order for TC357TH64F300SABKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC357TH64F300SABKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC357TH64F300SABKXUMA2 reliable?
The price and inventory of TC357TH64F300SABKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC357TH64F300SABKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC357TH64F300SABKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC357TH64F300SABKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC357TH64F300SABKXUMA2?
TC357TH64F300SABKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC357TH64F300SABKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC357TH64F300SABKXUMA2?
For technical support, including TC357TH64F300SABKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC357TH64F300SABKXUMA2 requirements.
6.How does Aetrix verify that TC357TH64F300SABKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC357TH64F300SABKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC357TH64F300SABKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC357TH64F300SABKXUMA2?
All TC357TH64F300SABKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC357TH64F300SABKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC357TH64F300SABKXUMA2 part is unused and in its original packaging.
Return procedure for TC357TH64F300SABKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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