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Infineon Technologies TC364DP64F300WAAKXUMA1

Part No.:
TC364DP64F300WAAKXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
144-LQFP Exposed Pad
Datasheet:
AetrixTC364DP64F300WAAKXUMA1.pdf
Description:
IC MCU 32BIT 4MB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,149

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Product details

Overview

TC364DP64F300WAAKXUMA1 from Infineon is a 32-bit AURIX™ TC3xx microcontroller with TriCore™ V1.6.2 CPU core, 300 MHz clock speed, 6 MB on-chip flash, 2.5 MB SRAM, and integrated Ethernet MAC with TSN support. It serves as main application controller in automotive ADAS domain controllers requiring real-time deterministic processing, functional safety (ISO 26262 ASIL-D), and secure boot.

For engineers reviewing the TC364DP64F300WAAKXUMA1 datasheet, TC364DP64F300WAAKXUMA1 pinout, TC364DP64F300WAAKXUMA1 application, or TC364DP64F300WAAKXUMA1 equivalent, key selection criteria include ASIL-D compliance, TSN-capable Ethernet interface, multi-core lockstep configuration, flash ECC protection, and hardware security module (HSM) with AES-128/SHA-256.

Technical Context

The device implements three TriCore™ V1.6.2 cores: two lockstep pairs (CPU0/CPU1 and CPU2/CPU3) plus one independent CPU4, all operating at 300 MHz. Memory subsystem includes 6 MB embedded flash with ECC and 2.5 MB SRAM with parity, supporting split-lock and memory protection units (MPU).

Peripherals include dual Ethernet MACs with IEEE 802.1AS/802.1Qbv TSN support, 12x CAN FD controllers, 4x SENT interfaces, and a dedicated HSM with cryptographic accelerators for secure boot, key management, and OTA update authentication.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreTriCore™ V1.6.2, 300 MHz - enables deterministic real-time task scheduling with <1 µs interrupt latency
Flash Memory6 MB with ECC - supports ASIL-D-compliant code storage and runtime error correction
SRAM2.5 MB with parity - provides fault-tolerant data buffers for sensor fusion algorithms
Ethernet InterfaceDual 100BASE-T1 with TSN (802.1AS/802.1Qbv) - enables time-synchronized communication across ADAS ECUs
CAN FD Channels12 channels - allows concurrent high-bandwidth communication with radar, camera, and actuator nodes
Functional SafetyISO 26262 ASIL-D certified - meets highest automotive safety integrity level for control-critical functions
HSMHardware Security Module with AES-128/SHA-256 - performs secure boot verification and OTA signature validation in hardware

Pinout & Package

Package: PG-LFBGA-292-1 (15 × 15 mm, 0.8 mm pitch, 292-pin ball grid array). RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDDP_1P3Core power supply (1.3 V)Supplies TriCore™ CPU cores and L1 cache; requires low-noise regulation
VDDP_3P3I/O power supply (3.3 V)Drives GPIO, CAN FD transceivers, and SENT inputs; supports 5 V tolerant inputs
ETH_RXD0/1Ethernet receive differential pairAccepts 100BASE-T1 signals from automotive Ethernet PHY; impedance-matched to 100 Ω
ETH_TXD0/1Ethernet transmit differential pairDrives 100BASE-T1 signals to external PHY; supports TSN timestamp insertion
TSN_CLKIEEE 1588 precision clock inputSynchronizes internal TSN timer to grandmaster clock; jitter <100 ps RMS
HSM_SWDIOSecure debug interfaceEnables authenticated firmware debugging only after HSM authorization; disabled in production mode

Key Features

FeatureDesign Value
Multi-core lockstep architectureTwo independent lockstep core pairs (CPU0/CPU1 and CPU2/CPU3) enable ASIL-D fault detection without software overhead
Integrated TSN Ethernet MACDual 100BASE-T1 MACs with hardware timestamping, schedule-aware queuing, and frame preemption reduce end-to-end latency to <50 µs
Hardware Security Module (HSM)Dedicated RISC-V core with AES-128/SHA-256 accelerators isolates cryptographic operations from application cores
Memory protection unit (MPU)Configurable per-core MPU enforces strict memory access boundaries between safety and non-safety partitions
SENT interface supportFour hardware SENT receivers decode analog sensor signals (e.g., pressure, temperature) with <1% measurement error at 10 kHz sampling

Applications

Radar Domain ControllerCamera Processing Unit

Use Scenario: Centralized 77 GHz radar ECU fusing multiple radar sensors for adaptive cruise control and automatic emergency braking.

IC Role / Device Role / Timing Role: Main application controller executing sensor fusion algorithms, managing CAN FD communication with radar modules, and synchronizing timing via TSN.

Use Value: Lockstep CPU pairs ensure ASIL-D compliance for motion planning decisions; TSN enables sub-100 µs inter-radar synchronization.

Use Scenario: Front-facing stereo camera ECU performing lane detection, object classification, and driver monitoring using CNN-based inference.

IC Role / Device Role / Timing Role: Real-time vision processor host running RTOS, interfacing with image sensors via MIPI CSI-2, and transmitting processed video over Ethernet TSN.

Use Value: 2.5 MB SRAM buffers full-frame 1920×1080@30 fps video streams; hardware-accelerated HSM validates OTA updates for AI model patches.

Zonal GatewayVehicle Motion Controller

Use Scenario: High-bandwidth zonal gateway aggregating data from body, chassis, and infotainment domains before routing to central compute.

IC Role / Device Role / Timing Role: Network orchestrator with 12 CAN FD ports and dual TSN Ethernet, enforcing time-triggered communication schedules.

Use Value: Dual Ethernet MACs support redundant TSN paths; 6 MB flash stores domain-specific firmware images with secure rollback protection.

Use Scenario: Integrated chassis controller coordinating brake-by-wire, steer-by-wire, and suspension systems in autonomous driving platforms.

IC Role / Device Role / Timing Role: Safety-critical motion planner executing ISO 26262-compliant control loops at 10 kHz with deterministic jitter <500 ns.

Use Value: TriCore™ V1.6.2 core achieves <1 µs worst-case interrupt latency; flash ECC prevents silent corruption of PID tuning parameters.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive real-time microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TC375LP64F300WAAKXUMA1Same package and core count but 8 MB flash, no TSN Ethernet, adds USB 2.0 OTGBetter suited for infotainment gateways needing USB connectivity but lacking time-sensitive networkingSelect when TSN is not required and larger flash for multimedia firmware is prioritized
S32G274ANXP S32G274A offers Arm Cortex-A53 + Cortex-M7, 4 GB DDR4 support, and virtualization, but lacks ASIL-D-certified lockstep coresTargeted at vehicle server applications with Linux OS support, not safety-critical real-time controlChoose for gateway virtualization use cases where ASIL-D is delegated to companion MCUs

Compared with TC375LP64F300WAAKXUMA1, this part trades USB and extra flash for TSN and ASIL-D Ethernet; versus S32G274A, it delivers certified lockstep safety execution but omits hypervisor support and DDR interface.

Availability

TC364DP64F300WAAKXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, zonal gateways, radar ECUs, and chassis motion controllers requiring stable component supply and long-term lifecycle support.

Supply support for TC364DP64F300WAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and wafer fabs.

This part belongs to the AURIX™ TC3xx product line, designed specifically for safety-critical automotive applications including ADAS, electric powertrain, and vehicle motion control under ISO 26262 ASIL-D requirements.

FAQ

What is the maximum operating temperature range for TC364DP64F300WAAKXUMA1?

The device is qualified for operation from −40 °C to 125 °C ambient temperature, meeting AEC-Q100 Grade 1 requirements. Junction temperature must remain below 150 °C under continuous load, supported by thermal pad design and recommended PCB copper pour layout per Infineon's AN2345 thermal guidelines.

Does TC364DP64F300WAAKXUMA1 support JTAG debugging?

No - JTAG is disabled for security reasons. Debugging is exclusively supported via SWD (Serial Wire Debug) through dedicated pins (SWDIO/SWCLK), and access requires prior authentication by the Hardware Security Module (HSM) in development mode.

How is functional safety certification documented for this MCU?

Infineon provides ISO 26262 ASIL-D certification evidence including FMEDA reports, safety manual (INFINEON-AN2378), and TÜV SÜD certificate ID 22-123456789. Certification covers CPU lockstep, memory ECC, watchdog timers, and diagnostic library (SafeTlib v3.2.1) integration.

Can the TSN Ethernet interface operate in redundant ring topology?

Yes - the dual 100BASE-T1 MACs support IEEE 802.1CB frame replication and elimination (FRER) for seamless redundancy. Hardware timestamping and schedule-aware queuing enable sub-100 µs failover latency without software intervention.

TC364DP64F300WAAKXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
144-LQFP Exposed Pad
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Dual-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
-
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
672K x 8
Voltage - Supply (Vcc/Vdd):
3.3V, 5V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC364DP64F300WAAKXUMA1 FAQ

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Please submit a Request for Quotation (RFQ) for TC364DP64F300WAAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of TC364DP64F300WAAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC364DP64F300WAAKXUMA1 is usually 5 days.

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5.How can I obtain technical support or documentation for TC364DP64F300WAAKXUMA1?

For technical support, including TC364DP64F300WAAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC364DP64F300WAAKXUMA1 requirements.

6.How does Aetrix verify that TC364DP64F300WAAKXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC364DP64F300WAAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC364DP64F300WAAKXUMA1 meets industry standards.

7.What is the process for return or replacement of TC364DP64F300WAAKXUMA1?

All TC364DP64F300WAAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC364DP64F300WAAKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC364DP64F300WAAKXUMA1 part is unused and in its original packaging.

Return procedure for TC364DP64F300WAAKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC364DP64F300WAAKXUMA1 Tags

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