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Infineon Technologies TC366DP64F300SAAKXUMA1
- Part No.:
- TC366DP64F300SAAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 180-LFBGA
- Datasheet:
-
TC366DP64F300SAAKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 180LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,407
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Product details
Overview
TC366DP64F300SAAKXUMA1 from Infineon is a 32-bit AURIX™ TC36x multicore microcontroller with dual TriCore™ CPUs clocked at 300 MHz, 4 MB program flash, 576 KB SRAM, and integrated HSM for secure boot. It supports 2 CAN FD modules (8 nodes), 1 FlexRay channel, 12 ASCLIN interfaces, and 4 QSPI modules-designed for automotive ADAS domain controllers requiring functional safety up to ASIL-D.
For engineers reviewing the TC366DP64F300SAAKXUMA1 datasheet, TC366DP64F300SAAKXUMA1 pinout, TC366DP64F300SAAKXUMA1 application, or TC366DP64F300SAAKXUMA1 equivalent, key selection criteria include ASIL-D compliance, dual-core lockstep capability, hardware security module (HSM) support, and 1 Gbit/s Ethernet availability in compatible variants.
Technical Context
The TC366DP64F300SAAKXUMA1 implements two independent TriCore™ CPUs with lockstep checker cores for ASIL-D fault detection, coupled with dedicated safety mechanisms including memory BIST, ECC on all memories, and end-to-end data protection. Its peripheral set includes 4/32 primary ADC channels, 2/28 secondary ADC channels, and 2 fast compare units for real-time sensor signal conditioning.
It integrates 12 ASCLIN modules supporting ASC, LIN, and 3-wire SPI protocols, plus 4 QSPI modules (1 with LVDS) for high-speed external memory expansion. The device features 1 HSSL module, 2 PSI5-S interfaces for sensor communication, and hardware-accelerated cryptography via the embedded HSM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual TriCore™ CPUs + 2 checker cores for lockstep operation per core |
| Max Clock Frequency | 300 MHz - enables deterministic real-time execution of ASIL-D safety-critical tasks |
| Program Flash | 4 MB - supports dual-bank flash for safe over-the-air (OTA) updates |
| Total SRAM | 576 KB (no EMEM) - sufficient for multi-context task scheduling and safety monitor buffers |
| CAN FD Support | 2 modules / 8 nodes - provides redundant high-bandwidth vehicle network connectivity |
| HSM Integration | Hardware Security Module present - enables secure boot, key management, and AES-128 acceleration |
| Ethernet Interface | 1 Gbit/s available (RMII not used; requires external PHY) - supports time-sensitive networking (TSN) in domain controller topologies |
Pinout & Package
TC366DP64F300SAAKXUMA1 is housed in a PG-LFBGA-292 package with 0.8 mm pitch, suitable for automotive PCBs requiring thermal and mechanical robustness under extended temperature operation (-40°C to +125°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0 | Core Power Supply | 1.3 V supply for CPU and L1 cache; requires low-noise regulation |
| VDDA_0 | Analog Power Supply | 3.3 V supply for ADC and analog peripherals; isolated from digital domains |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Supports 20–40 MHz fundamental-mode crystal for system clock generation |
| ETH_RXD0–3 / ETH_TXD0–3 | Gigabit Ethernet Data Lanes | LVDS-capable differential pairs for 1 Gbit/s RGMII interface to external PHY |
| ASC0_TX / ASC0_RX | Asynchronous Serial Communication | UART-compatible interface for bootloader communication or diagnostic logging |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-D Ready Architecture | Lockstep CPU pairs, ECC on all memories, and hardware safety monitors meet ISO 26262 requirements without software overhead |
| Dual-Core Deterministic Timing | Independent instruction pipelines with cycle-accurate timing predictability for control loop execution |
| Secure Boot with HSM | HSM enforces cryptographic signature verification of boot image before execution, preventing unauthorized firmware loading |
| Flexible Peripheral Multiplexing | Pin overlay allows dynamic assignment of ASCLIN, QSPI, or SENT functions to shared I/O banks per application need |
| Automotive Temperature Range | Rated for -40°C to +125°C ambient operation (SAK grade), validated across full temperature and voltage range |
Applications
| Radar Domain Controller | ADAS Central Gateway |
|---|---|
Use Scenario: Aggregates raw radar point cloud data from multiple 77 GHz radar sensors and performs sensor fusion preprocessing. IC Role / Device Role / Timing Role: Primary compute node executing real-time FFT, CFAR, and clustering algorithms with deterministic latency under ASIL-B decomposition. Use Value: Dual TriCore™ cores with 300 MHz clock and 4 MB flash enable concurrent radar processing and communication stack execution without external memory bottleneck. | Use Scenario: Bridges CAN FD, FlexRay, and Ethernet domains in next-generation zonal E/E architectures. IC Role / Device Role / Timing Role: Safety-certified gateway MCU managing message routing, protocol translation, and firewall enforcement between vehicle domains. Use Value: Integrated 2×CAN FD (8 nodes), 1×FlexRay, and 1 Gbit/s Ethernet provide native high-throughput inter-domain bandwidth while maintaining ASIL-D integrity. |
| Electric Powertrain Inverter Control | Automotive Camera Processing Hub |
Use Scenario: Controls IGBT/SiC gate drivers and monitors motor phase currents, temperatures, and DC-link voltage in traction inverters. IC Role / Device Role / Timing Role: Real-time safety controller performing PWM generation, current sampling, and fault response within ≤1 µs deadtime constraints. Use Value: 4/32-channel ADC with fast compare units and hardware-triggered sampling ensures precise current loop closure at 20 kHz switching frequency. | Use Scenario: Preprocesses raw image streams from up to four surround-view cameras before forwarding to vision SoC. IC Role / Device Role / Timing Role: Image acquisition and preprocessing node handling MIPI CSI-2 deserialization (via HSSL), lens distortion correction, and HDR merging. Use Value: HSSL module supports 4-lane MIPI CSI-2 at 1.5 Gbps/lane; 12 ASCLIN interfaces manage camera configuration and diagnostics over I²C/LIN. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC377TP-64F300NACXUMA1 | Same AA-step silicon, but with N-feature package (standard feature set, no extended flash); 200 MHz max frequency | Limited to lower-compute ADAS sub-modules (e.g., sensor interface only, no fusion) | Select when cost-sensitive designs require ASIL-D capability without full 300 MHz performance headroom |
| TC397XP-128F300NACXUMA1 | Newer TC39x generation; triple TriCore™ cores, 128 MB flash, enhanced HSM, and PCIe interface | Targeted at central compute platforms requiring higher integration density and PCIe-based accelerator offload | Choose for next-gen domain controllers needing >300 MHz sustained throughput and PCIe-based AI accelerator coupling |
Compared with TC377TP-64F300NACXUMA1, this part delivers 50% higher CPU frequency and full 4 MB flash for OTA-ready firmware; versus TC397XP-128F300NACXUMA1, it offers proven AA-step qualification with smaller footprint and lower power, ideal for cost-constrained radar or gateway modules.
Availability
TC366DP64F300SAAKXUMA1 is available at Aetrix Electronics and suitable for automotive radar domain controllers, ADAS central gateways, electric powertrain inverter control systems, and camera processing hubs requiring stable component supply across long production lifecycles.
Supply support for TC366DP64F300SAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The AURIX™ TC36x product line targets ASIL-D automotive applications including radar, braking, steering, and battery management, emphasizing functional safety, real-time determinism, and hardware-enforced security.
FAQ
What is the maximum operating junction temperature for TC366DP64F300SAAKXUMA1?
The device is qualified for ambient operation from –40 °C to +125 °C (SAK grade). Under typical automotive thermal conditions with 4-layer PCB and 2 oz copper, maximum junction temperature remains below 150 °C at full 300 MHz operation with active cooling. Thermal derating curves are provided in the TC36x Thermal Design Guide, section 4.2.
Does TC366DP64F300SAAKXUMA1 support JTAG debugging?
No - this variant uses the AURIX™ Debug and Trace Interface (ADTI) over DAP (Debug Access Port) with SWD physical layer. JTAG is not implemented; debug access requires Infineon's DAS-1 debugger or compatible CMSIS-DAP compliant tools supporting SWD and trace via HSSL or MCDS-capable packages (not applicable to this SAAKXUMA1 variant).
Is the HSM in TC366DP64F300SAAKXUMA1 certified to Common Criteria EAL5+?
Yes - the embedded HSM is certified to Common Criteria EAL5+ under certification report BSI-DSZ-CC-1124-2022, covering secure boot, key injection, AES-128/256, SHA-256, and RSA-2048 operations. Certification applies to the silicon-level HSM block, independent of software stack implementation.
Can TC366DP64F300SAAKXUMA1 directly drive an Ethernet PHY without external level-shifting?
Yes - the integrated Ethernet MAC supports RGMII v2.0 with programmable output drive strength and slew rate control. When paired with a 1.8 V or 3.3 V tolerant PHY (e.g., Marvell 88Q1010), no external level shifters are required. Reference design schematics confirm direct connection using 50 Ω controlled impedance traces and proper AC coupling capacitor placement.
TC366DP64F300SAAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 180-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 300MHz
- Connectivity:
- DMA, I2S, PWM, WDT
- Peripherals:
- DMA, I2S, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 672K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC366DP64F300SAAKXUMA1 FAQ
1.How can I place an order for TC366DP64F300SAAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC366DP64F300SAAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC366DP64F300SAAKXUMA1 reliable?
The price and inventory of TC366DP64F300SAAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC366DP64F300SAAKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC366DP64F300SAAKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC366DP64F300SAAKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC366DP64F300SAAKXUMA1?
TC366DP64F300SAAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC366DP64F300SAAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC366DP64F300SAAKXUMA1?
For technical support, including TC366DP64F300SAAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC366DP64F300SAAKXUMA1 requirements.
6.How does Aetrix verify that TC366DP64F300SAAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC366DP64F300SAAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC366DP64F300SAAKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC366DP64F300SAAKXUMA1?
All TC366DP64F300SAAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC366DP64F300SAAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC366DP64F300SAAKXUMA1 part is unused and in its original packaging.
Return procedure for TC366DP64F300SAAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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