Infineon Technologies TC367DP64F300SAALXUMA1
- Part No.:
- TC367DP64F300SAALXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC367DP64F300SAALXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:932
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC367DP64F300SAALXUMA1 from Infineon is a 300 MHz AURIX™ TC36x dual-core TriCore™ microcontroller with 4 MB program flash, 576 KB SRAM, 4/32 primary ADC channels, 2 CAN modules (2×4 nodes), and integrated HSM for automotive security. It implements ASCLIN (12 modules), QSPI (4 modules), FlexRay (1×2 channels), and PSI5-S in a PG-LFBGA-292 package rated for −40°C to +125°C ambient operation.
For engineers reviewing the TC367DP64F300SAALXUMA1 datasheet, TC367DP64F300SAALXUMA1 pinout, TC367DP64F300SAALXUMA1 application, or TC367DP64F300SAALXUMA1 equivalent, key selection criteria include dual-core lockstep safety architecture, 1 Gbit/s Ethernet support, HSSL interface, and AURIX™-specific peripheral mapping for ADAS and chassis control systems.
Technical Context
The TC367DP64F300SAALXUMA1 integrates two TriCore™ CPUs operating at up to 300 MHz with hardware lockstep checking, supporting ISO 26262 ASIL-D compliance. Its memory subsystem includes 4 MB on-chip program flash with ECC, 128 KB data flash, and 576 KB SRAM distributed across CPU-local and shared domains.
Peripheral integration includes 2 CAN FD controllers (each supporting 4 nodes), 1 FlexRay module (2 channels), 12 ASCLIN modules (with ASC, LIN, and 3-wire SPI modes), and 4 QSPI interfaces (1 with LVDS). The device supports 1 Gbit/s Ethernet via RMII/PHY interface and includes HSSL for high-speed sensor connectivity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual TriCore™ CPU with lockstep checker cores, enabling ASIL-D safety-critical execution. |
| Max Clock Frequency | 300 MHz - determines real-time interrupt latency and deterministic control loop performance. |
| Program Flash | 4 MB with ECC - sufficient for complex AUTOSAR-based ECU firmware with OTA update partitions. |
| ADC Configuration | 4 primary groups / 32 channels + 2 secondary groups / 28 channels - supports multi-sensor analog acquisition in chassis and powertrain systems. |
| CAN Interface | 2 modules, each supporting 4 nodes - enables scalable CAN FD networking for domain controller topologies. |
| Ethernet Support | 1 Gbit/s (RMII) - enables high-bandwidth communication for camera fusion, radar preprocessing, or gateway routing. |
| HSM Integration | Hardware Security Module present - provides secure boot, key management, and cryptographic acceleration per EVITA Full requirements. |
Pinout & Package
TC367DP64F300SAALXUMA1 is housed in a PG-LFBGA-292 package with 0.8 mm ball pitch, optimized for automotive PCB thermal and mechanical reliability under extended temperature operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0 | Core Power Supply (1.3 V) | Supplies CPU and local memory domains; requires low-noise regulation and decoupling. |
| VDDA_0 | Analog Power Supply (5 V) | Powers ADC, DAC, and analog comparators; isolated from digital supply to minimize noise coupling. |
| ETH_RXD0–3 | Ethernet Receive Data Lines | LVCMOS inputs for 1 Gbit/s RMII interface; require controlled impedance routing and length matching. |
| ASC0_TX / ASC0_RX | ASCLIN Module 0 UART Signals | Configurable as ASC, LIN, or SPI; supports bootloader, diagnostics, and sensor interfacing. |
| CAN0_TX / CAN0_RX | CAN FD Transceiver Interface | Differential pair for CAN FD physical layer; connects to external transceiver (e.g., TJA1044). |
| HSSL_CLK / HSSL_DATA[0:7] | High-Speed Sensor Link Clock & Data | Source-synchronous 8-bit parallel interface for radar or LiDAR sensors at up to 1.2 Gbps aggregate. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Enables real-time fault detection and recovery without software overhead, meeting ASIL-D requirements. |
| Integrated Hardware Security Module (HSM) | Accelerates AES-128/256, SHA-256, RSA-2048, and ECDSA; supports secure boot and key provisioning. |
| 12 ASCLIN modules | Each configurable as ASC, LIN, or 3-wire SPI - eliminates need for external protocol translators in multi-interface ECUs. |
| 4 QSPI interfaces (1 with LVDS) | Supports daisy-chained flash expansion and high-speed sensor streaming (e.g., radar raw data capture). |
| PSI5-S compliant interface | Enables direct connection to PSI5-S sensors (e.g., wheel speed, suspension position) without external level-shifting. |
Applications
| Electric Power Steering (EPS) | Brake-by-Wire Control Unit |
|---|---|
|
Use Scenario: Real-time torque assist calculation and motor current control under ASIL-D functional safety requirements. IC Role / Device Role / Timing Role: Primary safety controller executing motor control loops at ≤100 µs intervals with lockstep core monitoring. Use Value: Dual TriCore™ cores with hardware checker ensure fail-operational behavior during transient faults, while 32-channel ADC supports multi-axis torque and position sensing. |
Use Scenario: Closed-loop hydraulic pressure modulation and redundancy validation for electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Safety-certified domain controller managing CAN FD communication with master ECU and local solenoid drivers. Use Value: Integrated 2×4-node CAN FD and HSM enable secure, time-deterministic actuator command delivery and diagnostic reporting per ISO 26262 Part 10. |
| Radar Signal Preprocessor | Zonal Gateway Controller |
|
Use Scenario: Front-end processing of FMCW radar baseband data before transmission to central ADAS domain. IC Role / Device Role / Timing Role: High-throughput sensor interface hub using HSSL and QSPI to buffer and format radar point clouds. Use Value: HSSL interface delivers up to 1.2 Gbps sensor data bandwidth; 1 Gbit/s Ethernet enables low-latency forwarding to central compute. |
Use Scenario: Aggregation and firewalling of vehicle-wide communications between body, chassis, and infotainment domains. IC Role / Device Role / Timing Role: Secure network bridge with firewall policy enforcement and OTA update handling via HSM-verified signatures. Use Value: On-chip HSM validates firmware updates and enforces TLS 1.2 for cloud-to-vehicle secure channel establishment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC377TP-64F300N | Same AA-step silicon, but LQFP-176 package and no HSSL; EMEM not available. | Lacks HSSL and 1 Gbit/s Ethernet - suitable for non-radar zonal controllers where sensor bandwidth is lower. | Select when footprint compatibility with legacy LQFP layouts is required and HSSL/Ethernet are unused. |
| TC397QP-128F300S | Higher-tier variant: 6-core, 128 MB flash, EMEM, and ADAS peripherals (SPU/RIF) enabled. | Supports full ADAS cluster functions including sensor fusion and motion planning - exceeds TC367 scope. | Choose for next-generation ADAS domain controllers requiring SPU-accelerated computer vision pre-processing. |
Compared with TC377TP-64F300N, TC367DP64F300SAALXUMA1 adds HSSL and 1 Gbit/s Ethernet for radar and camera edge processing; versus TC397QP-128F300S, it trades ADAS-specific accelerators for cost-optimized safety control in chassis and powertrain domains.
Availability
TC367DP64F300SAALXUMA1 is available at Aetrix Electronics and suitable for electric power steering, brake-by-wire, radar preprocessing, and zonal gateway applications requiring stable component supply across automotive production lifecycles.
Supply support for TC367DP64F300SAALXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security ICs, with global R&D and manufacturing infrastructure.
The AURIX™ TC36x product line targets ASIL-D automotive safety applications including chassis control, electrification, and ADAS sensor preprocessing, emphasizing functional safety, real-time determinism, and secure communication.
FAQ
What is the maximum operating temperature range for TC367DP64F300SAALXUMA1?
The TC367DP64F300SAALXUMA1 is rated for ambient operation from −40°C to +125°C (SAK grade), validated per AEC-Q100 Grade 2 requirements. This range supports placement in engine bay, transmission, and brake control modules where thermal stress is critical.
Does TC367DP64F300SAALXUMA1 support AUTOSAR OS and MCAL?
Yes - Infineon provides certified AUTOSAR 4.3+ MCAL drivers and OS configuration tools for TC367DP64F300SAALXUMA1, including CAN, ETH, ADC, and ICU modules. These are qualified for use with ETAS RTA-OS and Vector DaVinci.
Is external RAM required for typical TC367DP64F300SAALXUMA1 applications?
No - the device integrates 576 KB of on-chip SRAM (excluding cache), sufficient for AUTOSAR BSW stacks, application tasks, and safety monitor buffers. External RAM is optional only for large data logging or radar FFT buffers beyond internal capacity.
How is functional safety certification documented for this part?
TC367DP64F300SAALXUMA1 is certified to ISO 26262:2018 ASIL-D at the hardware level (FMEDA report available), with safety manual, FIT rate (122 FIT), and diagnostic coverage metrics published in Infineon's TC36x Safety Manual v2.3.
TC367DP64F300SAALXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
- Peripherals:
- DMA, I2S, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 672K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC367DP64F300SAALXUMA1 FAQ
1.How can I place an order for TC367DP64F300SAALXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC367DP64F300SAALXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC367DP64F300SAALXUMA1 reliable?
The price and inventory of TC367DP64F300SAALXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC367DP64F300SAALXUMA1 is usually 5 days.
3.What payment methods are accepted for TC367DP64F300SAALXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC367DP64F300SAALXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC367DP64F300SAALXUMA1?
TC367DP64F300SAALXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC367DP64F300SAALXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC367DP64F300SAALXUMA1?
For technical support, including TC367DP64F300SAALXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC367DP64F300SAALXUMA1 requirements.
6.How does Aetrix verify that TC367DP64F300SAALXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC367DP64F300SAALXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC367DP64F300SAALXUMA1 meets industry standards.
7.What is the process for return or replacement of TC367DP64F300SAALXUMA1?
All TC367DP64F300SAALXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC367DP64F300SAALXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC367DP64F300SAALXUMA1 part is unused and in its original packaging.
Return procedure for TC367DP64F300SAALXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC367DP64F300SAALXUMA1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

