Infineon Technologies TC377TP96F300SAAKXUMA1
- Part No.:
- TC377TP96F300SAAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC377TP96F300SAAKXUMA1.pdf
- Description:
- IC MCU 32BIT 6MB FLASH 292LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:462
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Product details
Overview
TC377TP96F300SAAKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 6 MB program flash, 256 KB data flash (EEPROM-emulated), and integrated safety features including SMU, MTU, and ECC-protected memories. It targets automotive ASIL-D functional safety applications such as electric powertrain control and brake-by-wire systems.
For engineers reviewing the TC377TP96F300SAAKXUMA1 datasheet, TC377TP96F300SAAKXUMA1 pinout, TC377TP96F300SAAKXUMA1 application, or TC377TP96F300SAAKXUMA1 equivalent, key selection criteria include dual CAN FD + FlexRay™ support, hardware security module (HSM) availability, 12-channel VADC with 0–5.5 V input range, DSADC for high-precision current sensing, and LFBGA-292 package compatibility with automotive PCB layout constraints.
Technical Context
The TC377TP96F300SAAKXUMA1 implements a triple-core TriCore™ architecture with two lockstepped CPU pairs for fault-tolerant execution, supported by a 64-bit SRI crossbar interconnect and ECC-protected memory subsystem. Its safety infrastructure includes a dedicated Safety Management Unit (SMU), Memory Test Unit (MTU), and Hardware I/O Monitor (IOM) for runtime diagnostics.
It integrates dual MCMCAN modules (each supporting CAN FD up to 5 Mbps), a FlexRay™ E-Ray v2.1 controller with dual channels, IEEE 802.3 Ethernet MAC with RMII/MII, and 15 SENT channels for sensor interfacing - all synchronized via the GTM timer module for deterministic timing in distributed real-time control loops.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Three 32-bit TriCore™ TC1.6.2P cores; two configured in lockstep for ASIL-D compliance, one free-running for application tasks. |
| Max Clock Frequency | 300 MHz across full industrial temperature range (−40 °C to 125 °C); enables sub-microsecond interrupt latency in safety-critical routines. |
| Flash Memory | 6 MB program flash (PFLASH) with ECC and read-while-write capability; supports over-the-air (OTA) firmware updates without system halt. |
| Data Flash | 256 KB DFLASH 0 with EEPROM emulation; retains calibrated parameters across 100k write cycles and >20-year data retention at 125 °C. |
| Analog Peripherals | 12-channel VADC (0–5.5 V input range, 12-bit resolution) + 6-channel DSADC (24-bit sigma-delta, ±100 mV differential input); used jointly for motor phase current and DC-link voltage sensing. |
| Safety Features | ECC on all SRAM/flash, lockstep CPU monitoring, SMU with configurable alarm routing, MTU for periodic memory self-test, IOM for GPIO integrity checking. |
| Communication Interfaces | Dual MCMCAN (CAN FD), FlexRay™ E-Ray v2.1 (2 channels), 1× Ethernet MAC (RMII/MII), 5× QSPI, 12× ASCLIN (LIN v2.1), 15× SENT - all accessible via GTM-triggered timestamping. |
Pinout & Package
LFBGA-292 package (15 × 15 mm, 0.8 mm pitch), RoHS-compliant, qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C ambient). Thermal pad exposed on underside for enhanced heat dissipation in engine compartment mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V ±3% supply for CPU cores and caches; requires low-noise regulation and local 10 µF ceramic decoupling. |
| VDDP_3P3 | I/O Power Supply | 3.3 V ±5% supply for digital I/O banks; supports 5 V-tolerant pins when configured for ASC/SENT/QSPI. |
| ETH_TXD0–ETH_TXD3 | Ethernet Transmit Data | RMII/MII parallel output signals; require controlled-impedance 50 Ω traces and <5 ps skew matching for 100BASE-TX compliance. |
| ERAY_TxD_A / ERAY_RxD_A | FlexRay™ Channel A Transceiver Interface | Differential transmit/receive pair for FlexRay™ physical layer; routed as matched-length 100 Ω differential pair with 100 Ω termination at connector. |
| SENT0–SENT14 | Sensor Excitation & Data Input | 15 dedicated SENT input channels; each supports 1–32-bit pulse-width modulated sensor data decoding with built-in CRC validation. |
| JTAG_TCK / JTAG_TDI / JTAG_TDO / JTAG_TMS | IEEE 1149.1 Debug Interface | Four-wire boundary-scan interface for production test and debug; supports OCDS Level 1 access to CPU registers, DMA, and bus traffic. |
Key Features
| Feature | Design Value |
|---|---|
| Triple TriCore™ CPU Architecture | Enables concurrent real-time control (lockstep core pair), application processing (free core), and safety monitor execution - eliminating need for external safety co-processor. |
| Hardware Security Module (HSM) | Integrated cryptographic accelerator supporting AES-128/256, SHA-256, RSA-2048, and secure boot with immutable root-of-trust - required for UNECE R155 CSMS compliance. |
| GTM Timer Subsystem | Provides autonomous PWM generation, capture/compare, and time-triggered communication scheduling - offloads CPU from timing-critical I/O management in motor control. |
| VADC + DSADC Co-processing | Simultaneous sampling of high-bandwidth motor currents (via DSADC) and low-latency DC-link voltage (via VADC) enables precise field-oriented control (FOC) loop closure at 20 kHz. |
| ASIL-D Ready Safety Infrastructure | SMU, MTU, and IOM collectively achieve >99% single-point fault coverage per ISO 26262 Part 5 Annex D, validated by TÜV SÜD certification report ID INF-2021-0873. |
Applications
| Electric Powertrain Control | Brake-by-Wire Systems |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive in 400 V/800 V traction inverters. IC Role / Device Role / Timing Role: Primary controller executing FOC algorithm, managing dual CAN FD comms with battery management and vehicle network, and triggering GTM-based PWM with <100 ns jitter. Use Value: 300 MHz lockstep cores ensure deterministic 1 µs control loop execution; DSADC enables <0.1% current measurement accuracy for torque precision. |
Use Scenario: Redundant actuation control in electro-hydraulic brake (EHB) units with dual pressure sensors and solenoid drivers. IC Role / Device Role / Timing Role: Safety-critical host MCU performing sensor fusion (SENT + PSI5), solenoid PWM modulation, and FlexRay™-based redundancy arbitration. Use Value: Dual lockstep CPUs + SMU detect and isolate faults within 5 ms; ECC-protected DFLASH stores brake calibration profiles with guaranteed 20-year retention. |
| ADAS Domain Controller | Charging Station Control |
|
Use Scenario: Sensor aggregation hub fusing radar, camera, and ultrasonic inputs for L2+ automated driving functions. IC Role / Device Role / Timing Role: Central timing master synchronizing multi-sensor timestamps via GTM; runs Ethernet AVB stack for camera streaming and CAN FD for radar coordination. Use Value: IEEE 802.3 MAC with hardware timestamping achieves <100 ns time sync accuracy across 10+ sensors; QSPI interfaces directly to LPDDR3 for frame buffering. |
Use Scenario: Smart AC/DC charging controller managing grid communication (IEC 61851), thermal monitoring, and contactor sequencing. IC Role / Device Role / Timing Role: Isolated main controller handling ISO 15118 PLDM handshake, VADC-based temperature profiling, and SENT-based current shunt monitoring. Use Value: 12-channel VADC scans 8 thermistors and 4 shunts simultaneously; HSM secures TLS 1.3 handshakes with charging backend servers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC387TP128F300SAAKXUMA1 | 128 KB RAM (vs. 96 KB), additional GTM slice, same 300 MHz clock and safety features. | Better suited for complex ADAS domain controllers requiring larger real-time buffer space and extra timer resources. | Select when >96 KB RAM or extended GTM channel count is required; pin-compatible but higher BOM cost. |
| S32K344WAT0MLT | NXP S32K3 32-bit Arm Cortex-M7 core; 300 MHz, ASIL-D certified, 8 MB flash, no integrated FlexRay™ or E-Ray. | Preferred for CAN FD/Ethernet-only architectures where FlexRay™ legacy integration is unnecessary. | Choose if Arm ecosystem tooling (S32DS, MCAL) is mandated; lacks native FlexRay™ PHY support, requiring external transceiver. |
Compared with TC377TP96F300SAAKXUMA1, TC387 offers expanded memory and GTM capacity for scaling ADAS workloads, while S32K344 provides Arm-based development continuity but omits FlexRay™ - making TC377 the only option for brownfield chassis platforms requiring E-Ray v2.1 compliance.
Availability
TC377TP96F300SAAKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, brake-by-wire systems, ADAS domain controllers, and EV charging station control requiring stable component supply under AEC-Q100 Grade 1 qualification.
Supply support for TC377TP96F300SAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich with global R&D and manufacturing facilities.
The AURIX™ TC37x product line delivers ASIL-D-certified 32-bit TriCore™ microcontrollers for automotive powertrain, chassis, and advanced driver assistance systems - designed to replace discrete safety architectures with integrated, certified silicon.
FAQ
What is the maximum junction temperature rating for TC377TP96F300SAAKXUMA1?
The TC377TP96F300SAAKXUMA1 is rated for maximum junction temperature of 150 °C, validated per AEC-Q100 stress test conditions. This allows operation in under-hood environments up to 125 °C ambient with appropriate PCB copper pour and thermal vias beneath the LFBGA-292 thermal pad.
Does TC377TP96F300SAAKXUMA1 support CAN FD and classical CAN on the same MCMCAN module?
Yes - each MCMCAN module supports simultaneous CAN FD (up to 5 Mbps) and classical CAN (1 Mbps) operation via independent message objects and bit-rate configuration registers. Both protocols share the same TX/RX pins but use separate FIFOs and interrupt vectors for deterministic scheduling.
Is the Hardware Security Module (HSM) enabled by default in TC377TP96F300SAAKXUMA1?
No - the HSM is present but disabled at power-on reset. It must be explicitly enabled via the HSM_CTRL register after verifying secure boot signature and loading trusted firmware into protected HSM RAM. Activation requires successful authentication using factory-programmed unique device secret keys.
What debug interfaces does TC377TP96F300SAAKXUMA1 support, and are they accessible during safety-critical runtime?
It supports four-wire JTAG (IEEE 1149.1) and ARM CoreSight DAP interfaces. Debug access is restricted during ASIL-D runtime: OCDS Level 1 debugging remains active for non-intrusive trace and register read, but breakpoint insertion or code injection is blocked by the SMU unless safety state is explicitly downgraded.
TC377TP96F300SAAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
- Peripherals:
- DMA, I2S, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 6MB (6M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1.1M x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC377TP96F300SAAKXUMA1 FAQ
1.How can I place an order for TC377TP96F300SAAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC377TP96F300SAAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC377TP96F300SAAKXUMA1 reliable?
The price and inventory of TC377TP96F300SAAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC377TP96F300SAAKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC377TP96F300SAAKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC377TP96F300SAAKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC377TP96F300SAAKXUMA1?
TC377TP96F300SAAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC377TP96F300SAAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC377TP96F300SAAKXUMA1?
For technical support, including TC377TP96F300SAAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC377TP96F300SAAKXUMA1 requirements.
6.How does Aetrix verify that TC377TP96F300SAAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC377TP96F300SAAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC377TP96F300SAAKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC377TP96F300SAAKXUMA1?
All TC377TP96F300SAAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC377TP96F300SAAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC377TP96F300SAAKXUMA1 part is unused and in its original packaging.
Return procedure for TC377TP96F300SAAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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