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Infineon Technologies TC377TX96F300SABKXUMA1
- Part No.:
- TC377TX96F300SABKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC377TX96F300SABKXUMA1.pdf
- Description:
- IC MCU 32BIT 6MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:706
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Product details
Overview
TC377TX96F300SABKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 6 MB program flash with ECC, 256 KB data flash for EEPROM emulation, and integrated safety features including SMU, MTU, and IOM. It supports automotive real-time control in engine management, transmission control, and ADAS domain controllers.
For engineers reviewing the TC377TX96F300SABKXUMA1 datasheet, TC377TX96F300SABKXUMA1 pinout, TC377TX96F300SABKXUMA1 application, or TC377TX96F300SABKXUMA1 equivalent, key selection criteria include dual CAN FD + FlexRay support, hardware security module (HSM) option, ASCLIN/LIN/PSI5 sensor interface capability, and ISO 26262 ASIL-D ready safety architecture.
Technical Context
The TC377TX96F300SABKXUMA1 implements a tri-core TriCore™ architecture with two lockstepped CPU pairs for functional safety, each core delivering 300 MHz real-time performance with FPU, MAC, ICACHE/DCACHE, and DSPR/PSPR memory subsystems. Its bus structure integrates a 64-bit SRI crossbar and 32-bit SPB peripheral bus with SFI bridges for deterministic latency.
It integrates safety-critical peripherals including dual MCMCAN (4 nodes), E-Ray FlexRay v2.1 (2 channels), GTM for autonomous I/O timing, VADC (12 kernels, 0–5.5 V range), DSADC (6 channels), and HSSL (320 Mbit/s inter-processor link), all ECC-protected and monitored by SMU and MTU.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Three TC1.6.2P TriCore™ cores; two configured in lockstep for ASIL-D compliance, one free-running for application tasks. |
| Max Clock Frequency | 300 MHz across full industrial temperature range (−40 °C to 125 °C); enables sub-µs interrupt response for motor control loops. |
| Memory | 6 MB PFLASH (ECC-protected), 256 KB DFLASH (EEPROM emulation), 240 KB DSPR + 96 KB DSPR (scratchpad RAM), 64 KB PSPR. |
| ADC | VADC: 12 independent kernels, 12-bit resolution, 0–5.5 V input range; DSADC: 6 channels, 16-bit sigma-delta, for high-precision current sensing. |
| Communication | 2× MCMCAN (4 CAN FD nodes), 1× E-Ray (2-channel FlexRay v2.1), 12× ASCLIN (LIN v2.1/J2602), 5× QSPI (50 Mbit/s), ETH (MII/RMII). |
| Safety Features | SMU with configurable alarm routing, MTU with MBIST/ECC initialization, IOM for I/O pin health monitoring, OCDS Level 1 debug. |
| Package | LFBGA-292 (15 × 15 mm, 0.8 mm pitch); supports high-density automotive PCB layouts with thermal pad for enhanced heat dissipation. |
Pinout & Package
LFBGA-292 package with exposed thermal pad (EPAD) on underside; 292 I/O terminals arranged in 17 × 17 array with corner pads omitted. Pin assignment follows Infineon's standardized TC37x TP pinning layout per DS Section 2.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | 1.3 V Core Power Supply | Dedicated low-noise supply for CPU cores and caches; requires local 10 µF ceramic decoupling. |
| VDDP_3P3 | 3.3 V I/O & Peripheral Power | Supplies ASCLIN, QSPI, I²C, and GPIO banks; supports 5 V-tolerant inputs via internal level shifters. |
| ETH_TXD0–ETH_TXD3 | Ethernet Transmit Data (RGMII) | Source-synchronous 125 MHz DDR outputs; require matched-length traces ≤ 25 mm for RGMII timing closure. |
| ERAY_TxD_A / ERAY_RxD_A | FlexRay Channel A Transceiver Interface | Differential pair routed as controlled-impedance 100 Ω twisted pair; supports 10 Mbps nominal bit rate. |
| TRSTN / TCK / TMS / TDI / TDO | JTAG Debug Interface (IEEE 1149.1) | Five-wire boundary scan and debug access; TRSTN active-low reset enables safe debug entry during boot. |
Key Features
| Feature | Design Value |
|---|---|
| TriCore™ Triple-Core Architecture | Enables ASIL-D decomposition: lockstep pair for safety-critical control, third core for middleware, diagnostics, and communication stacks. |
| Hardware Security Module (HSM) | Optional embedded HSM with AES-128/256, SHA-256, RSA-2048, and secure boot ROM for OTA firmware authentication and key lifecycle management. |
| GTM Timer Subsystem | Provides autonomous PWM generation, capture/compare, and signal conditioning without CPU intervention-reducing jitter in motor gate drive timing. |
| VADC + DSADC Coexistence | Simultaneous sampling of fast-switching power stage currents (DSADC) and slower analog sensor signals (VADC) with synchronized trigger sources. |
| OCDS Level 1 Debug Support | Real-time trace via HSSL, multi-core breakpoint control, and memory access monitoring-enabling ISO 26262-compliant software validation. |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary safety-certified controller executing ASIL-D motor control algorithms with dual-lockstep CPU execution and SMU-monitored memory. Use Value: Deterministic 300 MHz execution ensures <1 µs loop latency for closed-loop spark advance correction under transient load conditions. |
Use Scenario: Torque assist calculation, motor position feedback processing, and fail-safe torque limitation in column-assist EPS systems. IC Role / Device Role / Timing Role: Dual-core lockstep controller managing motor FOC (Field-Oriented Control) while running ISO 26262-compliant fault trees and sensor fusion. Use Value: Integrated DSADC enables direct 16-bit current measurement at 100 kSPS per phase, eliminating external ADC and reducing BOM cost. |
| Brake-by-Wire Controller | ADAS Domain Controller |
|
Use Scenario: Redundant hydraulic pressure modulation and wheel-speed-based ABS/EBD actuation in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Safety master handling dual-CAN FD communication with brake calipers and vehicle dynamics sensors, with HSM-secured firmware updates. Use Value: MCMCAN FIFO buffering reduces CPU load by 40% vs. polling-based CAN handling-freeing cycles for real-time pressure model computation. |
Use Scenario: Sensor data aggregation (radar, camera, ultrasonic) and decision-making for L2+ automated driving functions. IC Role / Device Role / Timing Role: High-bandwidth domain processor interfacing with radar SoCs via HSSL and offloading pre-processing to GTM and VADC. Use Value: 64-bit SRI crossbar sustains >2.5 GB/s aggregate bandwidth between CPU, ETH, and QSPI-supporting simultaneous 10 GbE sensor streaming and flash writes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC387TX128F300SABKXUMA1 | Higher memory: 8 MB PFLASH, 512 KB DFLASH, 384 KB DSPR; same core, package, and peripheral set. | Preferred for complex AUTOSAR Adaptive platforms requiring larger OS image and OTA update partitioning. | Select when >6 MB flash or >256 KB DFLASH is required for dual-bank firmware or extended logging. |
| TC337TX128F200SABKXUMA1 | Lower speed: 200 MHz max clock; reduced VADC (8 kernels); no HSM; LQFP-176 package (not LFBGA). | Suitable for cost-sensitive ASIL-B applications like HVAC or body control modules where Ethernet/FlexRay not needed. | Choose for non-safety-critical or lower-performance domains where LQFP assembly and reduced feature set reduce system cost. |
Compared with TC377TX96F300SABKXUMA1, TC387 offers scalable memory headroom for future software growth, while TC337 trades performance, safety features, and package density for cost and manufacturability in less demanding domains.
Availability
TC377TX96F300SABKXUMA1 is available at Aetrix Electronics and suitable for automotive powertrain control, electric steering systems, brake-by-wire modules, and ADAS domain controllers requiring stable component supply, long-term lifecycle assurance, and ASIL-D certification support.
Supply support for TC377TX96F300SABKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.
The AURIX™ TC37x product line targets ISO 26262 ASIL-D automotive applications-including engine, transmission, chassis, and ADAS control-with integrated safety mechanisms, real-time performance, and multi-protocol connectivity.
FAQ
What is the maximum junction temperature rating for TC377TX96F300SABKXUMA1?
The device is rated for operation up to 125 °C junction temperature, validated across its full industrial temperature range (−40 °C to 125 °C). Thermal design must maintain θJA ≤ 22 °C/W using the LFBGA-292 EPAD and six-layer PCB with internal ground/power planes per Infineon's board layout guidelines.
Does TC377TX96F300SABKXUMA1 support CAN FD and classical CAN simultaneously?
Yes-its dual MCMCAN modules provide four independent CAN nodes, each configurable for either classical CAN (1 Mbps) or CAN FD (up to 5 Mbps data phase). All nodes support flexible data-rate arbitration and payload length up to 64 bytes with built-in CRC and error confinement.
Is the Hardware Security Module (HSM) included in this specific variant?
No-the TC377TX96F300SABKXUMA1 does not integrate the optional HSM; it is available only in higher variants (e.g., TC377TP or TC387). This part supports secure boot via BROM and external HSM interfacing but lacks on-die cryptographic accelerators and secure key storage.
What debug interfaces are supported, and which is recommended for production programming?
It supports both IEEE 1149.1 JTAG (4-wire + TRSTN) and ARM CoreSight DAP. For production programming, DAP is preferred due to higher throughput and compatibility with Infineon's MemTool and iLLD libraries; JTAG remains essential for boundary scan and early silicon validation.
TC377TX96F300SABKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
- Peripherals:
- DMA, I2S, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 6MB (6M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 1.1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC377TX96F300SABKXUMA1 FAQ
1.How can I place an order for TC377TX96F300SABKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC377TX96F300SABKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC377TX96F300SABKXUMA1 reliable?
The price and inventory of TC377TX96F300SABKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC377TX96F300SABKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC377TX96F300SABKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC377TX96F300SABKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC377TX96F300SABKXUMA1?
TC377TX96F300SABKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC377TX96F300SABKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC377TX96F300SABKXUMA1?
For technical support, including TC377TX96F300SABKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC377TX96F300SABKXUMA1 requirements.
6.How does Aetrix verify that TC377TX96F300SABKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC377TX96F300SABKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC377TX96F300SABKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC377TX96F300SABKXUMA1?
All TC377TX96F300SABKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC377TX96F300SABKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC377TX96F300SABKXUMA1 part is unused and in its original packaging.
Return procedure for TC377TX96F300SABKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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