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Infineon Technologies TC387QP160F300SAEKXUMA2
- Part No.:
- TC387QP160F300SAEKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC387QP160F300SAEKXUMA2.pdf
- Description:
- IC MCU 32BIT 10MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,895
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Product details
Overview
TC387QP160F300SAEKXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with four lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 10 MB embedded PFLASH, 512 KB DFLASH for EEPROM emulation, and integrated safety features including SMU, MTU, and ECC-protected memories. It supports automotive ASIL-D functional safety and integrates dual MCMCAN (4 CAN nodes), 3 FlexRay™ channels, Ethernet MAC (RGMII/RMII/MII), and hardware security module (HSM) option - deployed in engine control units and ADAS domain controllers.
For engineers reviewing the TC387QP160F300SAEKXUMA2 datasheet, TC387QP160F300SAEKXUMA2 pinout, TC387QP160F300SAEKXUMA2 application, or TC387QP160F300SAEKXUMA2 equivalent, key selection criteria include ASIL-D compliance, dual-core lockstep configuration, 300 MHz real-time execution, integrated Ethernet + FlexRay™ + MCMCAN, and HSM-enabled secure boot and cryptographic acceleration.
Technical Context
The TC387QP160F300SAEKXUMA2 implements a deterministic multi-core architecture with two pairs of lockstepped TriCore™ CPUs (TC1.6.2P), each featuring pipelined FPU, 2-cycle MAC unit, and dedicated DSPR/PSPR scratchpad RAM. Its safety-critical subsystem includes SMU-monitored clock/reset domains, ECC on all SRAM/Flash, and MTU-driven memory initialization and MBIST.
It integrates heterogeneous peripheral sets: three E-Ray modules (FlexRay™ V2.1 compliant), one IEEE 802.3 Ethernet MAC with RGMII timing support, five QSPI interfaces (50 Mbit/s), and 24 ASCLIN channels with LIN v2.1 hardware acceleration - enabling concurrent high-integrity communication across powertrain, chassis, and ADAS subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Four 32-bit TriCore™ TC1.6.2P cores; two lockstep pairs for ASIL-D compliance |
| Max Clock Frequency | 300 MHz across full industrial temperature range (–40°C to +125°C) |
| Embedded Memory | 10 MB PFLASH (ECC-protected), 512 KB DFLASH (EEPROM emulation), 128 KB LMU |
| Safety Features | SMU, MTU, ECC on all memories, IOM, lockstep CPU monitoring, safe DMA |
| Communication Interfaces | 3× E-Ray (FlexRay™ V2.1), 1× Ethernet MAC (RGMII/RMII/MII), 4× MCMCAN nodes, 5× QSPI |
| Analog Peripherals | VADC cluster (16 kernels, 0–5.5 V input), 25× SENT, 4× PSI5, 1× PSI5-S |
| Package | BGA516 (27 × 27 mm, 0.8 mm pitch), RoHS-compliant, lead-free |
Pinout & Package
TC387QP160F300SAEKXUMA2 uses a 516-ball BGA package (27 mm × 27 mm, 0.8 mm pitch) with thermal pad, optimized for automotive PCB thermal management and signal integrity. Pin assignments follow Infineon's standardized BGA516 layout for TC38x AD/AE-step devices.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and L1 cache; requires low-noise regulation and local decoupling |
| VDDP_1P5 | Digital I/O Power | 1.5 V supply for GPIO, ASCLIN, QSPI, and peripheral logic; supports 5 V-tolerant inputs |
| VDDP_3P3 | Analog & Interface Supply | 3.3 V supply for VADC reference, ETH PHY interface, and I²C pull-ups |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Supports 20–40 MHz external crystal; feeds SYS_PLL for precise clock generation |
| ETH_RXD[3:0], ETH_TXD[3:0] | Ethernet RGMII Data Lines | 4-bit parallel RGMII receive/transmit data; requires matched trace length and 50 Ω termination |
| ERAY_A_TX, ERAY_A_RX | FlexRay™ Channel A Transceiver Interface | Differential signaling pair for FlexRay™ bus communication at 10 Mbps nominal rate |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Pairing | Two independent lockstep core pairs enable ASIL-D fault detection without software overhead |
| HSM Option | Hardware Security Module supports AES-128/256, SHA-256, RSA-2048, and secure boot key management |
| Flexible Clock Architecture | SYS_PLL and PER_PLL allow independent frequency scaling for CPU vs. peripherals (e.g., 300 MHz CPU / 150 MHz ETH) |
| Safe DMA Controller | 128-channel DMA with address/data ECC, channel-level error reporting, and SMU-monitored transfer completion |
| Integrated Safety Monitor Unit | SMU detects clock failure, reset anomaly, memory access violation, and triggers safe state entry within ≤ 10 µs |
Applications
| Engine Control Unit (ECU) | ADAS Domain Controller |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and exhaust gas recirculation control in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary ASIL-D controller executing ISO 26262-compliant safety-critical tasks with dual lockstep cores and SMU supervision. Use Value: Deterministic 300 MHz execution enables sub-10 µs interrupt latency for cylinder-specific spark/fuel events. |
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for automated emergency braking and lane-keeping. IC Role / Device Role / Timing Role: Central compute node managing time-synchronized data ingestion via ETH, FlexRay™, and MCMCAN with hardware timestamping. Use Value: Integrated RGMII Ethernet and 3× E-Ray channels eliminate external bridge ICs, reducing BOM count and latency jitter. |
| Electric Powertrain Inverter | Vehicle Gateway Module |
|
Use Scenario: High-voltage inverter control with isolated gate drivers, current sensing, and thermal monitoring in BEV traction systems. IC Role / Device Role / Timing Role: Real-time motor control processor running field-oriented control (FOC) algorithms using GTM timer units and VADC synchronized sampling. Use Value: 16-kernel VADC with 0–5.5 V input range directly interfaces shunt-based current sensors without external signal conditioning. |
Use Scenario: Secure CAN-to-Ethernet/FlexRay™ gateway bridging legacy body networks with next-gen zonal architectures. IC Role / Device Role / Timing Role: Protocol translation engine with HSM-enforced firewall rules and authenticated firmware updates over Ethernet. Use Value: On-chip HSM accelerates TLS 1.2 handshake and OTA signature verification, cutting update time by >40% vs. software-only crypto. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC397XP160F300SAAKXUMA1 | Higher integration: 16 MB PFLASH, 1 MB DFLASH, added HSM with post-quantum crypto support | Targeted for next-gen Zonal E/E architectures requiring larger secure boot image storage and quantum-resistant key exchange | Select when future-proofing against cryptographic obsolescence or expanding OTA payload size beyond 512 KB |
| S32G274A | ARM Cortex-A53 + Cortex-M7 dual-core; Linux-capable; no TriCore™ or FlexRay™ native support | Designed for vehicle networking gateways with virtualization, containerized services, and cloud connectivity - not ASIL-D motor control | Select only for non-safety-critical gateway functions requiring POSIX OS support; not drop-in for TC387 real-time control workloads |
Compared with TC387QP160F300SAEKXUMA2, TC397 offers extended Flash and crypto agility for evolving OTA requirements, while S32G274A trades ASIL-D determinism for general-purpose compute - making TC387 optimal for hard real-time, safety-certified powertrain and chassis control.
Availability
TC387QP160F300SAEKXUMA2 is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, electric powertrain inverters, and vehicle gateway modules requiring stable component supply, long-term automotive lifecycle support, and ASIL-D certification readiness.
Supply support for TC387QP160F300SAEKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and automotive-grade wafer fabs.
This device belongs to the AURIX™ TC3xx family - engineered specifically for ISO 26262 ASIL-D automotive applications including powertrain, chassis, and autonomous driving systems where functional safety and real-time determinism are non-negotiable.
FAQ
What safety certifications does TC387QP160F300SAEKXUMA2 support?
TC387QP160F300SAEKXUMA2 is designed to meet ISO 26262 ASIL-D requirements at the hardware level, with certified safety mechanisms including lockstep CPU pairs, SMU-monitored clock domains, ECC on all memories, and MTU-driven memory self-tests. Infineon provides FMEDA reports, safety manuals, and ISO 26262 TÜV-certified documentation packages for system-level certification.
Does this MCU include hardware cryptographic acceleration?
The TC387QP160F300SAEKXUMA2 supports optional Hardware Security Module (HSM) variants. When configured with HSM, it delivers AES-128/256 encryption/decryption, SHA-256 hashing, RSA-2048 signing, and secure key storage - enabling secure boot, encrypted OTA updates, and TLS offload without CPU intervention.
What is the maximum supported Ethernet speed and interface mode?
TC387QP160F300SAEKXUMA2 integrates an IEEE 802.3-compliant Ethernet MAC supporting 10/100 Mbps operation. It implements RGMII (reduced gigabit media-independent interface) with 4-bit wide RX/TX data paths, RMII, and MII modes - with RGMII timing validated up to 125 MHz DDR clock and strict setup/hold margins per IEEE 802.3 specification.
Can TC387QP160F300SAEKXUMA2 replace older TC2xx series MCUs in existing designs?
No direct pin-to-pin or software compatibility exists between TC387QP160F300SAEKXUMA2 and TC2xx devices due to architectural differences: TriCore™ TC1.6.2P cores, new SRI/SPB bus hierarchy, updated peripheral register maps, and enhanced safety subsystems. Migration requires full hardware redesign and AUTOSAR 4.x+ software adaptation - Infineon provides migration guides and porting kits for qualified customers.
TC387QP160F300SAEKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 6-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 10MB (10M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512K x 8
- RAM Size:
- 1.34M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC387QP160F300SAEKXUMA2 FAQ
1.How can I place an order for TC387QP160F300SAEKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC387QP160F300SAEKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC387QP160F300SAEKXUMA2 reliable?
The price and inventory of TC387QP160F300SAEKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC387QP160F300SAEKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC387QP160F300SAEKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC387QP160F300SAEKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC387QP160F300SAEKXUMA2?
TC387QP160F300SAEKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC387QP160F300SAEKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC387QP160F300SAEKXUMA2?
For technical support, including TC387QP160F300SAEKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC387QP160F300SAEKXUMA2 requirements.
6.How does Aetrix verify that TC387QP160F300SAEKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC387QP160F300SAEKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC387QP160F300SAEKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC387QP160F300SAEKXUMA2?
All TC387QP160F300SAEKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC387QP160F300SAEKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC387QP160F300SAEKXUMA2 part is unused and in its original packaging.
Return procedure for TC387QP160F300SAEKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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