My Inquiry
My Account
Infineon Technologies TC387QP160F300SAELXUMA2
- Part No.:
- TC387QP160F300SAELXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC387QP160F300SAELXUMA2.pdf
- Description:
- IC MCU 32BIT 10MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,603
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC387QP160F300SAELXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with four lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 10 MB ECC-protected program flash, 512 KB data flash for EEPROM emulation, integrated Ethernet MAC (RGMII/ RMII/MII), and triple MCMCAN modules supporting 4 CAN nodes. It targets ASIL-D automotive safety-critical applications including electric powertrain control and ADAS domain controllers.
For engineers reviewing the TC387QP160F300SAELXUMA2 datasheet, TC387QP160F300SAELXUMA2 pinout, TC387QP160F300SAELXUMA2 application, or TC387QP160F300SAELXUMA2 equivalent, key selection criteria include dual-core lockstep configuration, 300 MHz real-time performance under -40°C to 125°C, integrated HSM security module support, and compliance with ISO 26262 ASIL-D requirements for functional safety.
Technical Context
The TC387QP160F300SAELXUMA2 implements a multi-core safety architecture with two pairs of TriCore CPUs: one pair in lockstep mode for fault detection and a second pair for independent computation. Its System Phase Locked Loop (SYS_PLL) delivers stable 300 MHz core clocking across full industrial temperature range while maintaining jitter < ±50 ps RMS.
On-chip peripheral integration includes three MCMCAN modules with hardware FIFO buffering, an IEEE 802.3-compliant Ethernet MAC supporting RGMII at 1 Gbps line rate, and a GTM timer unit enabling autonomous PWM generation and sigma-delta modulation without CPU intervention - all protected by ECC and monitored via Safety Management Unit (SMU).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Four 32-bit TriCore TC1.6.2P CPUs; two configured in lockstep for ASIL-D compliance |
| Max Core Frequency | 300 MHz at full temperature range (-40°C to +125°C), sustained via SYS_PLL with <±50 ps RMS jitter |
| Memory | 10 MB PFLASH + 512 KB DFLASH (EEPROM-emulation); all ECC-protected; 128 KB LMU SRAM |
| Communication Interfaces | 3× MCMCAN (4 CAN nodes), 1× Ethernet MAC (RGMII/RMII/MII), 5× QSPI, 24× ASCLIN with LIN v2.1 |
| Safety Features | Integrated SMU, MTU (MBIST/ECC initialization), IOM (I/O monitoring), optional HSM for secure boot and crypto acceleration |
| ADC System | VADC cluster with 16 kernels; 0–5.5 V input range; supports oversampling and hardware filtering |
| Package | BGA516 (27 × 27 mm, 0.8 mm pitch), RoHS-compliant, qualified per AEC-Q100 Grade 1 |
Pinout & Package
TC387QP160F300SAELXUMA2 uses a 516-ball BGA package (27 mm × 27 mm, 0.8 mm pitch) with thermal pad, designed for high-density automotive PCB layouts and thermally demanding environments. Pin assignment follows Infineon's standardized BGA516 footprint for TC38x series, supporting signal integrity optimization via dedicated power/ground ball patterns and differential I/O routing zones.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Digital Core Supply | 1.3 V supply for CPU cores and L1 cache; requires low-noise regulation and local decoupling |
| VDDP_3P3 | I/O & Peripheral Supply | 3.3 V supply for GPIO, ASCLIN, QSPI, and Ethernet PHY interface; supports 5 V-tolerant inputs |
| ETH_RXD0–ETH_RXD3 | Ethernet Receive Data | RGMII receive lane group; must be length-matched within ±5 mm for <100 ps skew at 125 MHz |
| ETH_TXD0–ETH_TXD3 | Ethernet Transmit Data | RGMII transmit lane group; routed with controlled impedance (50 Ω ±10%) and matched length |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Connects to 20 MHz fundamental-mode crystal; internal oscillator circuit enables startup in <10 ms |
| TRSTN / TCK / TMS / TDI / TDO | JTAG Debug Interface | IEEE 1149.1-compliant boundary scan and debug access; supports real-time trace via DAP |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core Pair | Two TC1.6.2P cores execute identical instructions with cycle-accurate comparison; detects transient faults for ASIL-D compliance |
| Hardware Security Module (HSM) | Optional embedded HSM supports AES-128/256, SHA-256, RSA-2048, and secure key storage; isolated from main CPU domain |
| Generic Timer Module (GTM) | Autonomous timing engine with 64 timers, 32 capture units, and 16 pattern generators; offloads CPU for motor control PWM and sensor signal conditioning |
| MCMCAN with Hardware FIFO | Each MCMCAN node integrates 32-entry TX/RX FIFOs with timestamping and message filtering; reduces CPU interrupt load by >70% vs legacy CAN |
| Ethernet MAC with RGMII | Full-duplex 100/1000 Mbps MAC with integrated DMA, checksum offload, and VLAN tagging; eliminates external PHY for cost-sensitive designs |
Applications
| Electric Powertrain Control | ADAS Domain Controller |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive sequencing in 800 V BEV platforms. IC Role / Device Role / Timing Role: Primary safety controller executing ISO 26262 ASIL-D software; manages dual-lockstep core execution and memory ECC scrubbing. Use Value: Enables deterministic 10 µs loop closure for field-oriented control (FOC) while maintaining fault coverage >99.99% per ISO 26262 Part 10 Annex D. |
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for L2+ automated driving functions. IC Role / Device Role / Timing Role: Central compute node running AUTOSAR Adaptive Platform; handles time-synchronized Ethernet backhaul and CAN FD sensor ingestion. Use Value: Delivers sub-50 ns time synchronization across 8+ sensor channels using GTM-based timestamping and hardware-triggered ADC sampling. |
| Brake-by-Wire ECU | Charging Communication Gateway |
|
Use Scenario: Redundant braking actuation with dual hydraulic circuits and electromechanical backup. IC Role / Device Role / Timing Role: Safety-critical controller implementing dual-channel ASIL-D brake pressure modulation; monitors cross-core consistency and memory integrity. Use Value: Achieves <100 ms fail-operational response via lockstep error detection, SMU-triggered safe state activation, and HSM-verified firmware updates. |
Use Scenario: ISO 15118-compliant V2G communication between EVSE and vehicle during DC fast charging. IC Role / Device Role / Timing Role: Secure gateway managing TLS 1.2 handshake, PKI certificate validation, and encrypted payload exchange over Ethernet and PLC. Use Value: Integrates HSM-accelerated ECDSA signing and AES-GCM encryption to meet ISO 15118-2 security requirements without external crypto co-processor. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC397XP160F300SAAKXUMA1 | Higher integration: 16 MB PFLASH, 1 MB DFLASH, added PCIe 3.0 controller, enhanced HSM with post-quantum crypto support | Targeted at next-gen zonal architectures requiring high-bandwidth interconnect and advanced cybersecurity | Select when PCIe, larger flash, or quantum-resistant crypto are required; otherwise TC387 offers optimal cost/performance for established ASIL-D designs |
| S32G274A | ARM Cortex-A53 + Cortex-M7 dual-core; supports virtualization, Linux RTOS, and Ethernet TSN; no TriCore ISA or GTM | Focused on vehicle-to-cloud connectivity, OTA update orchestration, and service-oriented architecture (SOA) | Choose for gateway/edge compute roles needing POSIX OS support and TSN time-aware scheduling; not drop-in compatible for TriCore real-time control code |
Compared with TC397XP160F300SAAKXUMA1 and S32G274A, the TC387QP160F300SAELXUMA2 provides best-in-class deterministic latency (<1 µs interrupt response) and mature ASIL-D toolchain support for motor control and brake systems, while avoiding over-specification in flash size or non-safety-critical peripherals.
Availability
TC387QP160F300SAELXUMA2 is available at Aetrix Electronics and suitable for electric powertrain control, ADAS domain controllers, brake-by-wire ECUs, and charging communication gateways requiring stable component supply across extended automotive production lifecycles.
Supply support for TC387QP160F300SAELXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D centers and manufacturing sites in Europe, Asia, and the Americas.
This device belongs to the AURIX™ TC3xx family - engineered specifically for ISO 26262 ASIL-D automotive safety applications, emphasizing real-time determinism, hardware-based fault containment, and end-to-end security from boot to runtime.
FAQ
What is the maximum ambient temperature rating for continuous operation?
The TC387QP160F300SAELXUMA2 is qualified per AEC-Q100 Grade 1, supporting continuous operation from −40 °C to +125 °C ambient temperature. Junction temperature must remain ≤150 °C under worst-case power dissipation; thermal design requires ≥2.5 cm² exposed copper on PCB bottom layer beneath thermal pad.
Does this part include built-in flash programming capability?
Yes - it integrates a Flash Target Interface compliant with Infineon's DAP protocol, enabling in-system programming via JTAG or SWD. The 10 MB PFLASH supports background read-while-write (BFW) and wear-leveling algorithms for EEPROM emulation in DFLASH sectors.
Is the Ethernet MAC capable of full 1 Gbps operation?
The integrated Ethernet MAC supports 10/100/1000 Mbps modes but requires external PHY for 1000BASE-T physical layer. In RGMII mode, it achieves full-duplex 1 Gbps data throughput with hardware checksum offload, VLAN tagging, and IEEE 1588 timestamping - all without CPU involvement.
How is functional safety certification documented for this variant?
Infineon provides ISO 26262 ASIL-D ready documentation including FMEDA reports, safety manual, and hardware/software safety analysis packages. TC387QP160F300SAELXUMA2 is covered under Infineon's AURIX™ TC3xx Safety Certification Kit (SC-Kit) v3.2, certified by TÜV SÜD for use in ASIL-D systems.
TC387QP160F300SAELXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 6-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 10MB (10M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512K x 8
- RAM Size:
- 1.34M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC387QP160F300SAELXUMA2 FAQ
1.How can I place an order for TC387QP160F300SAELXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC387QP160F300SAELXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC387QP160F300SAELXUMA2 reliable?
The price and inventory of TC387QP160F300SAELXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC387QP160F300SAELXUMA2 is usually 5 days.
3.What payment methods are accepted for TC387QP160F300SAELXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC387QP160F300SAELXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC387QP160F300SAELXUMA2?
TC387QP160F300SAELXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC387QP160F300SAELXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC387QP160F300SAELXUMA2?
For technical support, including TC387QP160F300SAELXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC387QP160F300SAELXUMA2 requirements.
6.How does Aetrix verify that TC387QP160F300SAELXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC387QP160F300SAELXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC387QP160F300SAELXUMA2 meets industry standards.
7.What is the process for return or replacement of TC387QP160F300SAELXUMA2?
All TC387QP160F300SAELXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC387QP160F300SAELXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC387QP160F300SAELXUMA2 part is unused and in its original packaging.
Return procedure for TC387QP160F300SAELXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC387QP160F300SAELXUMA2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
