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Infineon Technologies TC389QP160F300SAEKXUMA2
- Part No.:
- TC389QP160F300SAEKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 516-FBGA
- Datasheet:
-
TC389QP160F300SAEKXUMA2.pdf
- Description:
- IC MCU 32BIT 10MB FLASH 516FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,344
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Product details
Overview
TC389QP160F300SAEKXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with four lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 10 MB ECC-protected program flash, 512 KB data flash for EEPROM emulation, and integrated safety features including SMU, MTU, and optional HSM. It targets automotive ASIL-D safety-critical control units such as electric powertrain inverters and chassis domain controllers.
For engineers reviewing the TC389QP160F300SAEKXUMA2 datasheet, TC389QP160F300SAEKXUMA2 pinout, TC389QP160F300SAEKXUMA2 application, or TC389QP160F300SAEKXUMA2 equivalent, key selection criteria include dual-core lockstep configuration, RGMII/Ethernet MAC support, MCMCAN with FIFO buffering, SENT sensor interface count, and functional safety certification status per ISO 26262.
Technical Context
The TC389QP160F300SAEKXUMA2 implements a deterministic real-time architecture with two independent lockstepped CPU pairs (CPU0/CPU1 and CPU2/CPU3), each pair sharing dedicated DSPR/PSPR RAM and cache. Its SRI crossbar enables concurrent access to PFLASH, DFLASH, and LMU memory blocks while maintaining ECC protection across all on-chip SRAM and NVM.
Peripheral subsystems are partitioned across SPB domains: three MCMCAN modules handle time-triggered CAN FD traffic with hardware message filtering; GTM provides autonomous PWM generation and signal conditioning for motor control; and VADC clusters support simultaneous sampling of up to 16 channels with configurable resolution and oversampling for current/voltage sensing in traction inverters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Four 32-bit TriCore™ TC1.6.2P cores, two lockstep pairs for ASIL-D compliance |
| Max Clock Frequency | 300 MHz across full industrial temperature range (–40°C to +125°C) |
| Memory | 10 MB PFLASH + 512 KB DFLASH (EEPROM-emulated) + 128 KB LMU, all ECC-protected |
| Communication | 3× MCMCAN (4 nodes total), 2× FlexRay™ E-Ray v2.1, 1× IEEE 802.3 Ethernet MAC (RGMII/RMII/MII) |
| Analog Interface | VADC cluster with 16 kernels, 12-bit resolution, 0–5.5 V input range, hardware oversampling support |
| Safety Features | SMU, MTU (MBIST/ECC initialization), IOM, optional Hardware Security Module (HSM) |
| Package | BGA516 (27 × 27 mm, 0.8 mm pitch), RoHS-compliant, lead-free |
Pinout & Package
BGA516 package with 27 × 27 mm body size, 0.8 mm ball pitch, and standard JEDEC MO-277AC footprint. Thermal pad exposed on underside for enhanced heat dissipation in high-power automotive applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and L1 cache; requires low-noise regulation and local decoupling |
| VDDP_3P3 | I/O Power Supply | 3.3 V supply for general-purpose I/O banks and peripheral interfaces |
| ETH_RXD0–ETH_RXD3 | Ethernet Receive Data | RGMII receive data lines; require matched trace length and 50 Ω termination to PHY |
| ETH_TXD0–ETH_TXD3 | Ethernet Transmit Data | RGMII transmit data lines; driven at 1.8 V LVCMOS with controlled slew rate |
| SENT0–SENT24 | Sensor Interface Outputs | 25 dedicated SENT output channels for connecting pressure, temperature, and position sensors |
| ASCLIN0_TX / ASCLIN0_RX | LIN Bus Interface | Hardware LIN v2.1 transceiver pins supporting baud rates up to 20 kbit/s with automatic sync detection |
Key Features
| Feature | Design Value |
|---|---|
| Dual Lockstep CPU Pairs | Enables ASIL-D compliant fault detection via instruction-level comparison between redundant core pairs |
| Integrated GTM Timer Unit | Autonomous PWM generation and edge capture without CPU intervention, reducing jitter in motor control loops |
| MCMCAN with Hardware FIFO | 4-node CAN FD support with 64-message hardware FIFO per node, minimizing interrupt latency in high-bandwidth networks |
| VADC Oversampling Mode | Up to 16× oversampling with digital filtering yields effective 14-bit resolution for precision current sensing |
| HSM Cryptographic Acceleration | Optional embedded HSM supports AES-128/256, SHA-256, RSA-2048, and secure boot key management |
Applications
| Electric Powertrain Inverter Control | Chassis Domain Controller |
|---|---|
|
Use Scenario: Real-time torque vectoring and IGBT gate drive timing in 400 V/800 V traction inverters. IC Role / Device Role / Timing Role: Primary safety-critical controller executing FOC algorithms, PWM generation via GTM, and current/voltage feedback via VADC. Use Value: Dual lockstep CPUs ensure fault detection within <1 µs; 300 MHz clock enables sub-µs loop execution for field-oriented control at 20 kHz switching frequency. |
Use Scenario: Centralized brake-by-wire and steering assist coordination across multiple ECUs. IC Role / Device Role / Timing Role: Safety gateway managing ASIL-D communication between ESC, EPS, and ADAS systems via FlexRay and CAN FD. Use Value: Three MCMCAN modules with hardware message filtering reduce CPU load by 70% versus software-based filtering; E-Ray v2.1 ensures deterministic <5 µs frame latency. |
| ADAS Sensor Fusion Hub | Onboard Charger (OBC) Management |
|
Use Scenario: Aggregating radar, camera, and ultrasonic sensor data for object classification and path planning. IC Role / Device Role / Timing Role: High-bandwidth data concentrator using ETH RGMII (1000BASE-T), PSI5-S, and SENT interfaces. Use Value: 1 Gbps Ethernet MAC enables raw sensor streaming; 25 SENT channels support direct connection to 25+ analog sensors without external signal conditioners. |
Use Scenario: Bidirectional AC/DC and DC/DC conversion control in EV onboard chargers. IC Role / Device Role / Timing Role: Isolated master controller coordinating SiC MOSFET gate drivers, thermal monitoring, and grid synchronization. Use Value: VADC's 0–5.5 V input range directly measures isolated DC-link voltage; DFLASH emulates EEPROM for calibration storage across >100k charge cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC397XPV160F300SAAKXUMA1 | Higher memory (16 MB PFLASH), additional GTM slice, no BGA516 option (BGA320 only) | Targeted at next-gen ADAS domain controllers requiring larger code footprint and extra timer resources | Select when needing >10 MB flash or additional GTM channels; not pin-compatible due to different package |
| S32K344WAT0MLT | ARM Cortex-M7 core, 4 MB flash, no lockstep CPU pairs, ASIL-B certified only | Suitable for non-safety-critical body electronics but lacks ASIL-D runtime fault coverage | Choose only for cost-sensitive ASIL-B applications where TriCore safety architecture is unnecessary |
Compared with TC389QP160F300SAEKXUMA2, the TC397 offers expanded memory and peripherals at the cost of package compatibility, while the S32K344 trades safety integrity for ARM ecosystem alignment-neither matches its dual-lockstep TriCore performance in ASIL-D motor control.
Availability
TC389QP160F300SAEKXUMA2 is available at Aetrix Electronics and suitable for electric powertrain inverters, chassis domain controllers, ADAS sensor fusion hubs, and onboard charger management requiring stable component supply and long-term automotive lifecycle support.
Supply support for TC389QP160F300SAEKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, headquartered in Munich.
The AURIX™ TC38x product line delivers ASIL-D-certified multicore microcontrollers optimized for electric vehicle powertrain, braking, steering, and ADAS systems with integrated safety and security hardware.
FAQ
What safety certifications does TC389QP160F300SAEKXUMA2 support?
This microcontroller is designed to meet ISO 26262 ASIL-D requirements at the system level, with built-in safety mechanisms including lockstep CPU pairs, ECC-protected memories, SMU alarm monitoring, and MTU-based memory self-tests. Certification evidence is provided in Infineon's Safety Manual (V1.2, 2021) and FMEDA reports, not inherent to the silicon alone.
Does TC389QP160F300SAEKXUMA2 include hardware cryptographic acceleration?
The base part does not integrate an HSM; however, the "F" suffix variant (e.g., TC389QP160F300SAEKXUMA2) supports optional HSM firmware enablement. When activated, it delivers AES-128/256, SHA-256, RSA-2048, and TRNG functions with dedicated key storage and secure boot enforcement.
What is the maximum supported Ethernet speed and interface mode?
The integrated Ethernet MAC supports 10/100/1000 Mbps operation exclusively via RGMII interface with 1.8 V I/O signaling. RMII and MII modes are also supported but limited to 10/100 Mbps; RGMII requires precise PCB layout with matched trace lengths and impedance control to maintain signal integrity at 125 MHz.
Can TC389QP160F300SAEKXUMA2 operate without external crystal oscillators?
Yes-it integrates a factory-trimmed 12 MHz internal RC oscillator (IRC) for boot and low-speed operation, plus a 32 kHz backup RTC oscillator. For full-speed CPU operation (300 MHz), the SYS_PLL must be clocked by either an external crystal (12–20 MHz) or an external clock source; the IRC alone cannot sustain maximum frequency.
TC389QP160F300SAEKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 516-FBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 6-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 10MB (10M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 1.34M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC389QP160F300SAEKXUMA2 FAQ
1.How can I place an order for TC389QP160F300SAEKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC389QP160F300SAEKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC389QP160F300SAEKXUMA2 reliable?
The price and inventory of TC389QP160F300SAEKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC389QP160F300SAEKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC389QP160F300SAEKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC389QP160F300SAEKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC389QP160F300SAEKXUMA2?
TC389QP160F300SAEKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC389QP160F300SAEKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC389QP160F300SAEKXUMA2?
For technical support, including TC389QP160F300SAEKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC389QP160F300SAEKXUMA2 requirements.
6.How does Aetrix verify that TC389QP160F300SAEKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC389QP160F300SAEKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC389QP160F300SAEKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC389QP160F300SAEKXUMA2?
All TC389QP160F300SAEKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC389QP160F300SAEKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC389QP160F300SAEKXUMA2 part is unused and in its original packaging.
Return procedure for TC389QP160F300SAEKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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