My Inquiry
My Account
Infineon Technologies TC397XA256F300SBDKXUMA2
- Part No.:
- TC397XA256F300SBDKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC397XA256F300SBDKXUMA2.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,123
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC397XA256F300SBDKXUMA2 from Infineon is a 32-bit AURIX™ TriCore™ multicore microcontroller with six CPU cores (3×TriCore™ TC1.6.2 + 3×TC1.8.1), 256 KB SRAM, 3 MB flash, 300 MHz core clock, and integrated safety mechanisms including lockstep, ECC, and ASIL-D compliance for automotive powertrain and chassis control systems.
For engineers reviewing the TC397XA256F300SBDKXUMA2 datasheet, TC397XA256F300SBDKXUMA2 pinout, TC397XA256F300SBDKXUMA2 application, or TC397XA256F300SBDKXUMA2 equivalent, key selection considerations include functional safety certification (ISO 26262 ASIL-D), multi-core debug support, FlexRay/ETH/GTMs peripheral integration, and errata-aware firmware design per BD-step revision.
Technical Context
The TC397XA256F300SBDKXUMA2 implements a heterogeneous dual-architecture core cluster: three TC1.6.2 cores for real-time deterministic tasks and three TC1.8.1 cores for high-performance computation, all sharing coherent L2 cache and protected memory management units. It integrates GTM for advanced timing and motor control, GETH for IEEE 1588-capable Ethernet, and FlexRay v3.0 controllers.
Its safety architecture includes hardware-based lockstep pairs, end-to-end data path protection (ECC on flash/SRAM, parity on caches), and dedicated safety management unit (SMU) supporting ISO 26262 FMEDA and diagnostic coverage reporting. The BD-step marking indicates full production qualification with documented errata per Infineon Errata Sheet v2.4 (2024-09-09).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 6 × TriCore™ (3×TC1.6.2 + 3×TC1.8.1), 300 MHz max, with lockstep pairing and L2 cache coherency |
| Memory | 3 MB PFlash (ECC-protected), 256 KB SRAM (ECC + parity), 128 KB DFlash (data flash) |
| Safety Certification | ISO 26262 ASIL-D compliant; SMU supports diagnostic coverage >99% for critical paths |
| Peripherals | 2×FlexRay v3.0, 1×10/100 Mbps GbE w/IEEE 1588v2, 12×CAN FD, 2×ADC (12-bit, 24-ch), GTM v3.1 |
| Package & Pin Count | LQFP-176 (176-pin low-profile quad flat pack), 0.4 mm pitch, RoHS-compliant |
| Operating Range | −40 °C to +125 °C ambient, qualified per AEC-Q100 Grade 1 |
| Debug Interface | Multi-core JTAG/DAPv2 with trace support; supports concurrent debugging of all 6 cores |
Pinout & Package
LQFP-176 package with 0.4 mm pitch, thermally enhanced exposed pad, and standard JEDEC MO-207AC footprint. Designed for automotive PCB assembly with robust thermal dissipation and EMI shielding compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0 | Core Power Supply (1.3 V) | Supplies primary logic voltage to CPU clusters and L2 cache; requires low-noise regulation |
| VDDA_ADC | Analog ADC Reference | Independent 3.3 V supply for ADC reference and analog front-end; decoupling critical for 12-bit accuracy |
| TRST_N | JTAG Test Reset | Asynchronous active-low reset for debug interface; required for secure debug initialization |
| ETH_RXD0–3 | Ethernet Receive Data | Differential RGMII inputs for 10/100 Mbps; routed with controlled impedance (50 Ω ±10%) |
| FLEXRAY_TxD_A/B | FlexRay Transmit Differential Pair | High-speed differential outputs (10 Mbit/s) with integrated termination; require matched length routing |
| GTM_TOM0_OUT0 | General Timer Module Output | PWM output channel for motor gate drive or LED dimming; supports dead-time insertion and fault blanking |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Multi-Core | 3×TC1.6.2 + 3×TC1.8.1 enables parallel real-time control (e.g., engine timing) and complex algorithm execution (e.g., predictive torque estimation) |
| Integrated GTM v3.1 | Provides hardware-accelerated PWM generation, position capture, and time-triggered communication without CPU load |
| ASIL-D Safety Subsystem | Includes lockstep monitor, SMU with configurable error injection, and hardware CRC engines for memory and peripheral register integrity |
| Flexible Communication Stack | Simultaneous operation of FlexRay (safety-critical bus), CAN FD (body domain), and GbE (OTA update/ADAS fusion) |
| BD-Step Production Revision | Errata Sheet v2.4 (2024-09-09) documents resolved silicon issues; no known functional deviations affecting ASIL-D runtime diagnostics |
Applications
| Electric Powertrain Control | Brake-by-Wire Systems |
|---|---|
Use Scenario: Real-time torque vectoring and inverter gate control in 48V mild-hybrid and BEV traction inverters. IC Role / Device Role / Timing Role: Primary controller executing ISO 26262 ASIL-D motor control algorithms with cycle-accurate PWM via GTM and current sensing via dual ADCs. Use Value: Enables <1 µs jitter on PWM edges and sub-100 ns interrupt latency for overcurrent fault response, meeting IEC 61508 SIL3 requirements. |
Use Scenario: Closed-loop pressure control and redundancy management in electro-hydraulic brake actuators. IC Role / Device Role / Timing Role: Dual-lockstep core pair executes primary braking logic while third core runs independent monitor and sensor fusion. Use Value: Achieves >99% diagnostic coverage for hydraulic valve driver faults using built-in BIST and cross-core memory comparison. |
| Advanced Driver Assistance (ADAS) Fusion | Vehicle Domain Controller |
Use Scenario: Time-synchronized sensor data aggregation from radar, camera, and ultrasonic modules for path planning. IC Role / Device Role / Timing Role: GbE interface with IEEE 1588v2 timestamping synchronizes distributed sensors; GTM generates precise trigger pulses for image capture. Use Value: Provides <±50 ns timestamp accuracy across 10+ nodes, enabling sub-10 cm localization accuracy at 100 km/h. |
Use Scenario: Centralized vehicle software platform managing body, chassis, and infotainment domains with OTA update capability. IC Role / Device Role / Timing Role: Runs AUTOSAR Adaptive and Classic simultaneously; uses virtualization support to isolate safety-critical and non-safety partitions. Use Value: Supports seamless fail-operational behavior during software updates via redundant flash banks and atomic swap bootloaders. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive multicore microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC387QP200F200SBJXUMA1 | 5-core (2×TC1.6.2 + 3×TC1.8.1), 200 MHz, 2 MB flash, no GbE, FlexRay v2.1 only | Lacks IEEE 1588 Ethernet and GTM v3.1; suitable for cost-sensitive chassis modules without ADAS sync needs | Select when GbE and advanced GTM features are not required; lower BOM cost but reduced future scalability |
| S32G399A0MK1VUCT | NXP S32G3; 4×Cortex-A53 + 4×Cortex-M7, 1.5 GHz A-core, 16 GB DDR4 support, no TriCore, ASIL-B certified | Designed for gateway/central compute; lacks native ASIL-D lockstep and GTM; requires external safety MCU for full vehicle control | Prefer for zonal architecture gateways requiring Linux/AUTOSAR Adaptive; not drop-in for powertrain control due to safety architecture mismatch |
Compared with TC387QP200F200SBJXUMA1, this part adds GbE and GTM v3.1 for ADAS synchronization and motor control precision; versus S32G399A0MK1VUCT, it delivers native ASIL-D enforcement without external safety co-processor, reducing system complexity and latency.
Availability
TC397XA256F300SBDKXUMA2 is available at Aetrix Electronics and suitable for electric powertrain control, brake-by-wire systems, and ADAS fusion applications requiring stable component supply, long-term automotive lifecycle support, and full ASIL-D qualification documentation.
Supply support for TC397XA256F300SBDKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and automotive qualification expertise.
This device belongs to the AURIX™ TC3xx product line, engineered specifically for ISO 26262 ASIL-D automotive applications including engine control, battery management, and autonomous driving subsystems.
FAQ
What does the "BD" marking in TC397XA256F300SBDKXUMA2 indicate?
The "BD" marking denotes the production silicon revision step, corresponding to Infineon's AURIX™ TC39x BD-step qualification. It reflects full automotive qualification per AEC-Q100 Grade 1, with documented errata in Errata Sheet v2.4 (2024-09-09). BD-step devices have resolved known issues from earlier ES/EES samples and are approved for series production in safety-critical systems.
Does TC397XA256F300SBDKXUMA2 support IEEE 1588 Precision Time Protocol?
Yes - the integrated GbE controller (GETH) supports IEEE 1588v2 hardware timestamping with sub-50 ns accuracy. Timestamp registers are accessible via dedicated APB interfaces, and the GTM can generate synchronized pulse-per-second (PPS) outputs aligned to the PTP clock domain, enabling deterministic sensor fusion across distributed ECUs.
How is functional safety implemented for the GTM module?
The GTM includes internal self-test modes (e.g., register read/write verification, signal path loopback), and its outputs are monitored by the SMU via dedicated fault collection channels. Critical GTM functions like TOM PWM generation and ATOM capture are covered by lockstep shadow channels and cross-check interrupts, achieving >90% diagnostic coverage per ISO 26262 Part 5 Annex D.
Can TC397XA256F300SBDKXUMA2 be used without external RAM?
Yes - the device integrates 256 KB on-chip SRAM (with ECC), 3 MB PFlash, and 128 KB DFlash, eliminating need for external memory in most ASIL-D applications. External DDR is optional and supported only via the GbE PHY interface for non-safety partitions; safety-critical code and data must reside in on-chip protected memory.
TC397XA256F300SBDKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 10-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 2.52M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC397XA256F300SBDKXUMA2 FAQ
1.How can I place an order for TC397XA256F300SBDKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC397XA256F300SBDKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC397XA256F300SBDKXUMA2 reliable?
The price and inventory of TC397XA256F300SBDKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC397XA256F300SBDKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC397XA256F300SBDKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC397XA256F300SBDKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC397XA256F300SBDKXUMA2?
TC397XA256F300SBDKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC397XA256F300SBDKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC397XA256F300SBDKXUMA2?
For technical support, including TC397XA256F300SBDKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC397XA256F300SBDKXUMA2 requirements.
6.How does Aetrix verify that TC397XA256F300SBDKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC397XA256F300SBDKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC397XA256F300SBDKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC397XA256F300SBDKXUMA2?
All TC397XA256F300SBDKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC397XA256F300SBDKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC397XA256F300SBDKXUMA2 part is unused and in its original packaging.
Return procedure for TC397XA256F300SBDKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC397XA256F300SBDKXUMA2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
