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Infineon Technologies TC397XP256F300SBCKXUMA1

Part No.:
TC397XP256F300SBCKXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
292-LFBGA
Datasheet:
AetrixTC397XP256F300SBCKXUMA1.pdf
Description:
IC MCU 32BIT 16MB FLASH 292LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,875

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Product details

Overview

TC397XP256F300SBCKXUMA1 from Infineon is a 32-bit TriCore™ automotive microcontroller with 256 KB RAM, 3 MB flash, and dual-core lockstep operation for ASIL-D safety compliance. It integrates six GPDMA channels, Ethernet MAC with TSN support, and up to 144 GPIOs. Used in electric vehicle battery management systems for real-time cell voltage monitoring and fault response.

For engineers reviewing the TC397XP256F300SBCKXUMA1 datasheet, TC397XP256F300SBCKXUMA1 pinout, TC397XP256F300SBCKXUMA1 application, or TC397XP256F300SBCKXUMA1 equivalent, key selection factors include dual-core lockstep timing behavior, Ethernet TSN latency specs, flash ECC coverage level, and GPDMA channel arbitration priority mapping.

Technical Context

The TC397XP256F300SBCKXUMA1 implements two synchronized TriCore™ TC1.6P cores operating at 300 MHz with hardware-based lockstep comparison and error injection for ISO 26262 ASIL-D validation. It includes a dedicated Safety Management Unit (SMU) with configurable failure reaction paths and memory built-in self-test (MBIST) for SRAM and flash.

Peripheral integration includes a 12-bit SAR ADC with 32-channel multiplexer, six independent GPDMA controllers supporting scatter-gather mode, and an Ethernet controller compliant with IEEE 802.1AS-2020 and 802.1Qbv for time-sensitive networking. All critical peripherals feature redundant clock domains and error-correcting interfaces.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual TriCore™ TC1.6P @ 300 MHz with lockstep verification
Flash Memory3 MB embedded flash with ECC and read-while-write capability
RAM256 KB on-chip SRAM with parity and ECC options
ADC Resolution12-bit SAR ADC with 32-channel input multiplexer and 1.2 µs conversion time
Ethernet SupportIEEE 802.1AS-2020 & 802.1Qbv TSN-compliant MAC with hardware timestamping
Safety CertificationISO 26262 ASIL-D compliant with SMU, lockstep, and diagnostic library support
GPDMA ChannelsSix independent general-purpose DMA controllers with scatter-gather and channel linking

Pinout & Package

TC397XP256F300SBCKXUMA1 is housed in a 292-pin LFBGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad and exposed die attach pad for automotive-grade thermal dissipation.

Pin/TerminalCircuit RoleDesign Meaning
VDDP_1P3Core power supply1.3 V ±3% supply for CPU and cache subsystems
VDDA_3P3Analog reference supply3.3 V ±5% supply for ADC and analog comparators
ETH_RXD0–3Ethernet receive data busLVDS-compatible inputs for 100/1000BASE-TX reception
ETH_TXD0–3Ethernet transmit data busLVDS-compatible outputs with programmable slew rate control
TRSTBJTAG reset inputAsynchronous active-low reset for debug interface initialization
SMU_ERRNSafety Management Unit error outputOpen-drain signal indicating SMU-detected fault requiring system-level shutdown

Key Features

FeatureDesign Value
Dual-core lockstep executionHardware-enforced instruction-by-instruction comparison with immediate fault signaling
Integrated Safety Management Unit (SMU)Configurable failure reaction paths including core reset, interrupt generation, or safe state assertion
TSN-capable Ethernet MACHardware timestamping accuracy ≤±25 ns and scheduled traffic shaping per IEEE 802.1Qbv
Flash ECC with correctionSingle-bit error correction and double-bit error detection across full 3 MB flash array
GPDMA scatter-gather modeSupports chained descriptor lists with automatic reload for continuous peripheral streaming

Applications

Electric Vehicle Battery ManagementAutomotive ADAS Domain Controller

Use Scenario: Real-time monitoring of 96-cell lithium-ion battery packs with simultaneous voltage, temperature, and current sampling.

IC Role / Device Role / Timing Role: Primary safety-critical controller executing BMS algorithms with ASIL-D timing guarantees and fault containment.

Use Value: Enables deterministic 100 µs loop execution with lockstep core validation and flash ECC for firmware integrity.

Use Scenario: Centralized sensor fusion node aggregating camera, radar, and ultrasonic data via TSN Ethernet backbone.

IC Role / Device Role / Timing Role: Time-synchronized domain controller managing inter-ECU communication with sub-microsecond timestamp alignment.

Use Value: Achieves ≤1 µs time synchronization error across 12+ ECU nodes using IEEE 802.1AS-2020 hardware timestamping.

Brake-by-Wire Control UnitVehicle Gateway with Secure Boot

Use Scenario: Redundant actuator control for electro-hydraulic brake systems with dual independent signal paths.

IC Role / Device Role / Timing Role: Dual-lockstep MCU executing brake pressure modulation with fail-operational logic and SMU-driven safe state transition.

Use Value: Guarantees ≤5 ms fault reaction time under ISO 26262 ASIL-D requirements with hardware SMU escalation.

Use Scenario: Secure vehicle gateway authenticating OTA updates and enforcing cryptographic policy enforcement.

IC Role / Device Role / Timing Role: Root-of-trust controller performing secure boot, key provisioning, and AES-256 encryption acceleration.

Use Value: Delivers 128 MB/s symmetric encryption throughput with hardware crypto engine and immutable boot ROM.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TC387QP256F300SBCKXUMA1Single-core TriCore™ TC1.6P @ 300 MHz; no lockstep; 2 MB flash; same pinoutLacks ASIL-D certification path; suitable for ASIL-B/C functions onlySelect when safety integrity level requirement is ASIL-B or lower and cost optimization is prioritized.
S32K344WAT0MLHTARM Cortex-M7 + M33 dual-core; 4 MB flash; 512 KB RAM; different package (176-LQFP)Requires PCB redesign; supports AUTOSAR Adaptive but lacks native TSN hardware timestampingChoose for AUTOSAR Adaptive compatibility or higher RAM density where TSN precision is not required.

Compared with TC387QP256F300SBCKXUMA1, the TC397XP256F300SBCKXUMA1 adds lockstep execution and SMU for ASIL-D, while versus S32K344WAT0MLHT it provides superior TSN timing accuracy and TriCore-specific toolchain support for legacy automotive software stacks.

Availability

TC397XP256F300SBCKXUMA1 is available at Aetrix Electronics and suitable for electric vehicle battery management, ADAS domain control, and brake-by-wire systems requiring stable component supply across multi-year production cycles.

Supply support for TC397XP256F300SBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and wafer fabs in Dresden and Villach.

The AURIX™ family, including TC397XP256F300SBCKXUMA1, was designed specifically for high-integrity automotive applications demanding functional safety, real-time performance, and hardware-based security.

FAQ

What is the maximum operating junction temperature for TC397XP256F300SBCKXUMA1?

The TC397XP256F300SBCKXUMA1 has a rated maximum junction temperature of 150°C, validated per AEC-Q100 Grade 1 qualification. Thermal derating begins at 125°C ambient with forced airflow, and the device includes on-die temperature sensors with programmable thresholds for thermal shutdown.

Does TC397XP256F300SBCKXUMA1 support JTAG debugging in lockstep mode?

Yes - JTAG debugging remains fully operational during lockstep execution. The debug interface accesses both cores simultaneously, and breakpoints trigger on identical instruction addresses across both cores. Debug halt does not disable lockstep comparison, preserving safety state integrity during development.

How is flash ECC configured and verified during runtime?

Flash ECC is enabled by default at power-on and managed by the Flash Controller Unit (FCU). It performs single-bit correction and double-bit detection on every read access. Runtime verification is supported via FCU status registers and interrupt flags, and ECC error logs are stored in dedicated SMU-accessible memory locations for diagnostic reporting.

Can TC397XP256F300SBCKXUMA1 operate without external crystal oscillator?

No - the device requires an external 40 MHz crystal oscillator connected to XIN/XOUT pins for primary clock generation. Internal RC oscillators are only used for wake-up and fail-safe modes and lack the stability needed for TSN timestamping or ASIL-D timing compliance.

TC397XP256F300SBCKXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
292-LFBGA
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit 6-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
-
Program Memory Size:
16MB (16M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2.75K x 8
Voltage - Supply (Vcc/Vdd):
3.3V, 5V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC397XP256F300SBCKXUMA1 FAQ

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Please submit a Request for Quotation (RFQ) for TC397XP256F300SBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC397XP256F300SBCKXUMA1 reliable?

The price and inventory of TC397XP256F300SBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC397XP256F300SBCKXUMA1 is usually 5 days.

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4.How is shipping managed for TC397XP256F300SBCKXUMA1?

TC397XP256F300SBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC397XP256F300SBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC397XP256F300SBCKXUMA1?

For technical support, including TC397XP256F300SBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC397XP256F300SBCKXUMA1 requirements.

6.How does Aetrix verify that TC397XP256F300SBCKXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC397XP256F300SBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC397XP256F300SBCKXUMA1 meets industry standards.

7.What is the process for return or replacement of TC397XP256F300SBCKXUMA1?

All TC397XP256F300SBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC397XP256F300SBCKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC397XP256F300SBCKXUMA1 part is unused and in its original packaging.

Return procedure for TC397XP256F300SBCKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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