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Infineon Technologies TC397XP256F300SBDKXUMA2
- Part No.:
- TC397XP256F300SBDKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC397XP256F300SBDKXUMA2.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,059
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Product details
Overview
TC397XP256F300SBDKXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with six TC1.6.2P CPU cores (four lockstepped), 2.5 MB on-chip flash (1.5 MB PFLASH + 1 MB DFLASH), 768 KB SRAM, and integrated safety features including SMU, MTU, and optional HSM. It operates at up to 300 MHz across -40°C to 125°C, supports ASCLIN/LIN, QSPI, MCMCAN, Ethernet (RGMII), and E-Ray, and targets automotive ADAS and powertrain control.
For engineers reviewing the TC397XP256F300SBDKXUMA2 datasheet, TC397XP256F300SBDKXUMA2 pinout, TC397XP256F300SBDKXUMA2 application, or TC397XP256F300SBDKXUMA2 equivalent, key selection criteria include dual-core lockstep capability, ASIL-D compliance support, 300 MHz real-time execution, ECC-protected memory hierarchy, and integrated hardware security module (HSM) availability.
Technical Context
The TC397XP256F300SBDKXUMA2 implements a heterogeneous multi-core architecture with six TriCore CPUs: four configured in two lockstep pairs (for ASIL-D safety), and two independent cores for application and safety monitor tasks. Its SRI crossbar enables concurrent 64-bit data transfers between CPUs, DMA, and memories.
It integrates three MCMCAN modules (each supporting 4 CAN FD nodes), RGMII-compliant Ethernet PHY interface, and E-Ray high-speed deterministic bus for fault-tolerant communication. Clocking uses dual PLLs (SYS_PLL and PER_PLL) with jitter < ±50 ps RMS, and reset management includes power-on, watchdog, and safety-monitor-initiated sources.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Six 32-bit TriCore TC1.6.2P cores: four in lockstep pairs (ASIL-D), two independent (ASIL-B) |
| Max Core Frequency | 300 MHz across full industrial temperature range (-40°C to +125°C) |
| Memory | 1.5 MB program flash (PFLASH), 1 MB data flash (DFLASH), 768 KB SRAM - all ECC-protected |
| Communication | Three MCMCAN modules (12 CAN FD channels), RGMII Ethernet, E-Ray, 6× QSPI, 8× ASCLIN with LIN v2.1 |
| Safety Features | SMU, MTU (MBIST/ECC initialization), IOM, lockstep core monitoring, and optional HSM for secure boot & crypto |
| Package | LFBGA-292 (15 × 15 mm, 0.8 mm pitch), RoHS-compliant, automotive-grade reflow profile |
| Supply Voltage | Core: 1.25 V ±3%; I/O: 3.3 V or 5 V switchable per pad group; supports single-supply and external-supply modes |
Pinout & Package
LFBGA-292 package with 15 × 15 mm body, 0.8 mm ball pitch, and 292 I/O balls arranged in perimeter array. Pin functions defined per datasheet Section 2.2 (LFBGA-292 Package Variant Pin Configuration), including dedicated supply/ground banks, JTAG/DAP debug interfaces, and function-mapped peripheral pads (e.g., ETH_MDC/MDIO, CANH/CANL, QSPI_CLK/MOSI/MISO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P25 | Core Power Supply | 1.25 V ±3% input for CPU/SRI/MTU domains; requires low-noise decoupling per datasheet Fig. 3-12 |
| VDDP_3V3 / VDDP_5V | I/O Supply Select | Configurable 3.3 V or 5 V supply for grouped I/O pads; set via internal register and external strap options |
| TCK / TMS / TDI / TDO | JTAG Debug Interface | IEEE 1149.1-compliant boundary-scan and debug access; supports real-time trace via DAP |
| ETH_TXD0–3 / ETH_RXD0–3 | RGMII Data Lanes | Direct RGMII interface (no external PHY required); supports 10/100/1000 Mbps with clock compensation |
| CAN0H / CAN0L | CAN FD Transceiver Interface | Differential bus interface compliant with ISO 11898-2:2016; supports bit rates up to 5 Mbps |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Core Pairing | Two independent lockstep pairs (4 cores total) enable ASIL-D compliance per ISO 26262 Part 5, with automatic error detection and fail-safe response |
| ECC Memory Protection | All on-chip SRAM, flash, and cache protected by SEC-DED ECC; MTU performs on-demand memory tests during startup and runtime |
| Hardware Security Module (HSM) | Optional embedded HSM with AES-128/256, SHA-256, RSA-2048, secure boot ROM, and key provisioning isolation |
| Real-Time Peripheral Offload | 128-channel DMA with scatter-gather, channel linking, and peripheral-to-peripheral transfers - reduces CPU load for sensor/actuator data movement |
| Deterministic Communication | E-Ray controller supports time-triggered, fault-tolerant communication with guaranteed latency ≤ 2 µs and synchronization accuracy ±50 ns |
Applications
| Automotive Powertrain Control | ADAS Domain Controller |
|---|---|
|
Use Scenario: Real-time combustion timing, torque calculation, and emissions control in gasoline/diesel ECUs. IC Role / Device Role / Timing Role: Primary ASIL-D controller executing safety-critical engine algorithms with lockstep core validation and memory ECC. Use Value: Enables deterministic 300 MHz execution of ISO 26262-compliant software stacks while maintaining < 10 µs interrupt latency for spark/fuel events. |
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for autonomous emergency braking. IC Role / Device Role / Timing Role: Central domain controller managing time-synchronized E-Ray and CAN FD communication between sensors and actuators. Use Value: Provides hardware-accelerated CRC, timestamping, and deterministic scheduling for sub-100 µs end-to-end latency across multi-sensor pipelines. |
| Electric Vehicle Inverter Control | Vehicle Gateway Module |
|
Use Scenario: High-frequency motor phase current sampling and PWM generation for traction inverters. IC Role / Device Role / Timing Role: Real-time control unit interfacing with isolated ADCs and gate drivers via MSC and HSCT peripherals. Use Value: Delivers 100 ns resolution timer capture and 100 kHz PWM switching with hardware dead-time insertion and fault shutdown propagation. |
Use Scenario: Secure bridging between CAN FD, Ethernet, and LIN networks in vehicle communication gateways. IC Role / Device Role / Timing Role: Firewall-enabled gateway processor routing messages with HSM-verified authentication and encrypted OTA update handling. Use Value: Supports UDS over IP and DoIP protocols with hardware-accelerated TLS 1.2 and secure key storage in HSM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-integrity automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC387QP256F300SBDKXUMA2 | Same core count and frequency, but lacks HSM and has reduced DFLASH (512 KB vs. 1 MB); no RGMII Ethernet | Suitable for ASIL-B/C powertrain modules where cryptographic offload and gigabit networking are not required | Select when cost sensitivity outweighs need for secure boot or Ethernet connectivity |
| TC375LP256F300SBDKXUMA2 | Triple-core (2 lockstep + 1 standalone), 2 MB total flash, no HSM, no Ethernet, lower temp grade (–40°C to 105°C) | Targeted at mid-tier ADAS cameras and body control units with less stringent safety or bandwidth demands | Choose for simplified BOM and thermal design where ASIL-D and RGMII are unnecessary |
Compared with TC387QP256F300SBDKXUMA2 and TC375LP256F300SBDKXUMA2, the TC397XP256F300SBDKXUMA2 uniquely delivers ASIL-D-ready lockstep redundancy, 1 MB DFLASH for robust EEPROM emulation, and integrated RGMII - making it the only variant qualified for domain controllers requiring both functional safety and high-bandwidth interconnect.
Availability
TC397XP256F300SBDKXUMA2 is available at Aetrix Electronics and suitable for automotive powertrain control, ADAS domain controllers, EV inverter systems, and vehicle gateway modules requiring stable component supply under AEC-Q100 Grade 1 qualification.
Supply support for TC397XP256F300SBDKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The AURIX™ TC39x product line is designed specifically for ASIL-D automotive applications - emphasizing functional safety, real-time determinism, hardware-based security, and integration of high-speed communication interfaces for next-generation E/E architectures.
FAQ
What is the maximum operating temperature range for TC397XP256F300SBDKXUMA2?
The TC397XP256F300SBDKXUMA2 is qualified for operation from –40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This rating applies to all core logic, memory, and integrated peripherals including CAN FD transceivers, QSPI, and RGMII interfaces, with derating applied only for sustained junction temperatures above 150°C.
Does TC397XP256F300SBDKXUMA2 include an integrated Ethernet PHY?
No, the TC397XP256F300SBDKXUMA2 integrates a full RGMII MAC layer but requires an external 1000BASE-T PHY chip. Its RGMII interface provides all timing-critical signals (TXCLK, RXCLK, TXD[3:0], RXD[3:0], TXCTL, RXCTL) with programmable delay calibration and skew compensation to meet IEEE 802.3 specifications without external glue logic.
How is functional safety supported in this microcontroller?
Functional safety is implemented via hardware-enforced mechanisms: lockstep CPU pairs with comparator logic, ECC on all memories, Safety Management Unit (SMU) for centralized alarm routing, Memory Test Unit (MTU) with MBIST, and Hardware I/O Monitor (IOM). These elements collectively support ISO 26262 ASIL-D development when used with Infineon's SafeTcore library and certified toolchain.
Is the Hardware Security Module (HSM) enabled by default on this part?
No - the HSM is an optional feature physically present on the TC397XP256F300SBDKXUMA2 die but disabled at power-on. It must be explicitly activated via secure boot sequence using factory-provisioned keys stored in OTP memory. Once enabled, HSM firmware executes in isolated memory space with dedicated bus interface and cannot be accessed by application cores without authenticated requests.
TC397XP256F300SBDKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 10-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 2.52M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC397XP256F300SBDKXUMA2 FAQ
1.How can I place an order for TC397XP256F300SBDKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC397XP256F300SBDKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC397XP256F300SBDKXUMA2 reliable?
The price and inventory of TC397XP256F300SBDKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC397XP256F300SBDKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC397XP256F300SBDKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC397XP256F300SBDKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC397XP256F300SBDKXUMA2?
TC397XP256F300SBDKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC397XP256F300SBDKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC397XP256F300SBDKXUMA2?
For technical support, including TC397XP256F300SBDKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC397XP256F300SBDKXUMA2 requirements.
6.How does Aetrix verify that TC397XP256F300SBDKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC397XP256F300SBDKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC397XP256F300SBDKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC397XP256F300SBDKXUMA2?
All TC397XP256F300SBDKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC397XP256F300SBDKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC397XP256F300SBDKXUMA2 part is unused and in its original packaging.
Return procedure for TC397XP256F300SBDKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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