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Infineon Technologies TC397XP256F300SBDLXUMA2
- Part No.:
- TC397XP256F300SBDLXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC397XP256F300SBDLXUMA2.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,443
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Product details
Overview
TC397XP256F300SBDLXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring six lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 2.5 MB on-chip flash (2 MB PFLASH + 512 KB DFLASH), 768 KB SRAM with ECC, and integrated safety mechanisms including SMU, MTU, and optional HSM. It targets ASIL-D automotive safety-critical applications such as electric powertrain control and ADAS domain controllers.
For engineers reviewing the TC397XP256F300SBDLXUMA2 datasheet, TC397XP256F300SBDLXUMA2 pinout, TC397XP256F300SBDLXUMA2 application, or TC397XP256F300SBDLXUMA2 equivalent, key selection criteria include dual-core lockstep configuration, 300 MHz real-time execution, ASCLIN/LIN support up to 50 MBaud, QSPI master/slave at 50 Mbit/s, and functional safety compliance per ISO 26262.
Technical Context
The TC397XP256F300SBDLXUMA2 implements a distributed safety architecture with four lockstepped CPU core pairs (two active + two shadow), enabling fault detection via comparison logic and safe error signaling through the Safety Management Unit (SMU). Its memory subsystem includes ECC-protected PFLASH, DFLASH, and SRAM, with Memory Test Unit (MTU) supporting MBIST and initialization.
It integrates three MCMCAN modules (4 CAN FD nodes), eight ASCLIN channels with hardware LIN protocol acceleration, six QSPI interfaces, two HSSL links (320 Mbit/s), and Ethernet (RGMII/MII) - all accessible via a 64-bit crossbar interconnect (SRI) and protected by bus-level ECC and parity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Six 32-bit TriCore™ TC1.6.2P cores; four configured in lockstep for ASIL-D compliance. |
| Max Clock Frequency | 300 MHz across full industrial temperature range (–40°C to +125°C). |
| Flash Memory | 2 MB program flash (PFLASH) + 512 KB data flash (DFLASH) with ECC and EEPROM emulation capability. |
| SRAM | 768 KB on-chip SRAM (LMU), fully ECC-protected, including DSPR/PSPR scratchpad RAM. |
| CAN FD Support | Three MCMCAN modules supporting 4 CAN FD nodes with bit rates up to 5 Mbit/s and time-triggered communication. |
| Functional Safety | ISO 26262 ASIL-D compliant; includes SMU, MTU, IOM, lockstep CPUs, and ECC/parity on all memories and buses. |
| Interface Peripherals | 8× ASCLIN (LIN v2.1/J2602), 6× QSPI (50 Mbit/s), 2× HSSL (320 Mbit/s), Ethernet (RGMII/MII), 4× MSC, 3× ADC (VADC/DSADC). |
Pinout & Package
This device uses a 516-pin LFBGA package (19 mm × 19 mm, 0.8 mm pitch) with thermal pad, optimized for automotive ECU PCB layouts requiring high I/O count and thermal reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Digital core supply | 1.3 V ±3% supply for CPU cores and SRI interconnect; requires low-noise regulation. |
| VDDP_3P3 | I/O and peripheral supply | 3.3 V ±5% supply for GPIOs, ASCLIN, QSPI, and CAN transceivers; supports 5 V-tolerant inputs. |
| OSC_IN / OSC_OUT | Crystal oscillator interface | Connects to external 20–40 MHz crystal for system clock generation; supports internal PLL multiplication to 300 MHz. |
| ETH_RXD[3:0], ETH_TXD[3:0] | Ethernet RGMII data lanes | 8-bit RGMII interface supporting 100/1000 Mbps operation with precise timing alignment (±150 ps skew). |
| ASC0_TX / ASC0_RX | ASCLIN channel 0 serial I/O | Hardware-accelerated LIN/UART/SPI-compatible interface with baud rate up to 50 MBaud and automatic sync-break detection. |
| TRSTN / TCK / TMS / TDI / TDO | JTAG debug interface | IEEE 1149.1-compliant boundary scan and debug access; supports real-time trace via DAP interface. |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Configuration | Four TC1.6.2P cores arranged in two lockstep pairs (2×2), enabling continuous hardware comparison and fault reporting per ISO 26262. |
| Hardware Security Module (HSM) | Optional embedded HSM supporting AES-128/256, SHA-256, RSA-2048, and secure boot with key injection via JTAG fuse. |
| Memory Protection Architecture | MPU with 16 regions per core, plus MMU support for virtual memory mapping; all memories protected by ECC or parity. |
| Real-Time Communication Offload | Three MCMCAN modules with time-triggered scheduling, message RAM buffering, and CRC offload-reducing CPU load by >40% in CAN FD gateways. |
| On-Chip Diagnostic Coverage | Integrated IOM monitors digital I/O pin states against expected patterns; MTU performs periodic SRAM/flash BIST during runtime. |
Applications
| Electric Powertrain Control | ADAS Domain Controller |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter control in 800 V BEV platforms with dual-motor drive. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with <10 µs loop latency and synchronized PWM outputs. Use Value: Six-core lockstep enables redundant computation paths while HSSL links coordinate with sensor fusion SoCs at 320 Mbit/s. |
Use Scenario: Centralized perception fusion unit aggregating radar, camera, and ultrasonic inputs for L2+/L3 autonomy. IC Role / Device Role / Timing Role: High-bandwidth data concentrator managing 4× CAN FD, 2× Ethernet, and 8× ASCLIN interfaces with deterministic packet routing. Use Value: RGMII interface delivers 1 Gbps camera streaming; QSPI interfaces boot Linux from external flash while ASCLIN handles LIN-based actuator feedback. |
| Brake-by-Wire System | Charging Communication Gateway |
|
Use Scenario: Redundant electro-hydraulic brake control with dual independent actuation paths and fail-operational behavior. IC Role / Device Role / Timing Role: Dual-lockstep core pair executes braking algorithm while shadow pair validates results; SMU triggers safe state transition on mismatch. Use Value: MTU-performed memory self-tests ensure SRAM integrity before each braking cycle; ECC-protected DFLASH stores calibration data across 100k+ cycles. |
Use Scenario: ISO 15118-compliant DC fast charging handshaking between EV and charger, including PKI-based certificate exchange. IC Role / Device Role / Timing Role: Secure gateway managing TLS 1.2 handshake over Ethernet and CAN FD, with HSM performing ECDSA signing in <5 ms. Use Value: Hardware-accelerated crypto reduces host CPU load by 90%; ASCLIN interfaces handle legacy J1939 diagnostics during charging sessions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC387QP256F300SBDLXUMA2 | Same core count and frequency but lacks HSM and has reduced DFLASH (256 KB vs. 512 KB); no Ethernet PHY support. | Suitable for non-secure gateway or mid-tier ADAS ECUs without TLS/crypto requirements. | Select when cryptographic acceleration and full ASIL-D gateway functionality are not required. |
| S32K344WAT0MLHT | NXP S32K3 6-core Arm Cortex-R52; lower max frequency (320 MHz nominal but derated to 280 MHz at 125°C); no integrated Ethernet MAC. | Targets chassis control with strong CAN FD and FlexRay support; less suited for high-throughput sensor fusion. | Prefer for legacy NXP toolchain environments or where FlexRay coexistence is mandatory. |
Compared with TC397XP256F300SBDLXUMA2, TC387 offers cost reduction at the expense of security and connectivity features, while S32K344 trades AURIX-specific safety IP and Ethernet integration for Arm ecosystem compatibility and FlexRay readiness.
Availability
TC397XP256F300SBDLXUMA2 is available at Aetrix Electronics and suitable for electric powertrain control, ADAS domain controllers, brake-by-wire systems, and charging communication gateways requiring stable component supply under automotive qualification standards.
Supply support for TC397XP256F300SBDLXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and automotive-grade wafer fabs.
The AURIX™ TC39x product line was designed specifically for ASIL-D automotive safety applications-including xEV powertrain, autonomous driving, and vehicle networking-combining real-time performance, hardware safety mechanisms, and secure communication.
FAQ
What is the maximum ambient temperature rating for TC397XP256F300SBDLXUMA2?
The TC397XP256F300SBDLXUMA2 is qualified for operation from –40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements. Its thermal design supports sustained 300 MHz CPU operation within this range, validated via junction temperature monitoring and dynamic voltage/frequency scaling.
Does TC397XP256F300SBDLXUMA2 support CAN FD with ISO 11898-1:2015 physical layer compliance?
Yes - the three integrated MCMCAN modules comply with ISO 11898-1:2015, supporting bit rates up to 5 Mbit/s, flexible data-length up to 64 bytes, and built-in CRC calculation. Each module includes dedicated message RAM and time-triggered transmission scheduling.
How is the Hardware Security Module (HSM) accessed and provisioned?
The optional HSM is accessed via dedicated APB interface and provisioned using Infineon's OPTIGA™ Trust Anchor toolchain. Key injection occurs via JTAG fuses during programming; secure boot verifies signed firmware images using ECDSA-256 before execution.
Can TC397XP256F300SBDLXUMA2 operate without an external crystal oscillator?
No - the device requires an external 20–40 MHz crystal connected to OSC_IN/OSC_OUT pins for primary clock generation. The internal FLL and PLLs derive all system clocks from this reference; no internal RC oscillator is provided for production use.
TC397XP256F300SBDLXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 10-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 2.52M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC397XP256F300SBDLXUMA2 FAQ
1.How can I place an order for TC397XP256F300SBDLXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC397XP256F300SBDLXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC397XP256F300SBDLXUMA2 reliable?
The price and inventory of TC397XP256F300SBDLXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC397XP256F300SBDLXUMA2 is usually 5 days.
3.What payment methods are accepted for TC397XP256F300SBDLXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC397XP256F300SBDLXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC397XP256F300SBDLXUMA2?
TC397XP256F300SBDLXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC397XP256F300SBDLXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC397XP256F300SBDLXUMA2?
For technical support, including TC397XP256F300SBDLXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC397XP256F300SBDLXUMA2 requirements.
6.How does Aetrix verify that TC397XP256F300SBDLXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC397XP256F300SBDLXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC397XP256F300SBDLXUMA2 meets industry standards.
7.What is the process for return or replacement of TC397XP256F300SBDLXUMA2?
All TC397XP256F300SBDLXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC397XP256F300SBDLXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC397XP256F300SBDLXUMA2 part is unused and in its original packaging.
Return procedure for TC397XP256F300SBDLXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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