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Infineon Technologies TC397XX256F300SBDKXUMA2
- Part No.:
- TC397XX256F300SBDKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC397XX256F300SBDKXUMA2.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,589
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Product details
Overview
TC397XX256F300SBDKXUMA2 from Infineon is a 300 MHz AURIX™ TC397 6-core TriCore™ microcontroller with extended memory (4096 KB EMEM), 16 MB program flash, 2528 KB SRAM, and integrated HSM for automotive safety-critical applications including ADAS domain controllers and vehicle central gateways.
For engineers reviewing the TC397XX256F300SBDKXUMA2 datasheet, TC397XX256F300SBDKXUMA2 pinout, TC397XX256F300SBDKXUMA2 application, or TC397XX256F300SBDKXUMA2 equivalent, key selection criteria include EMEM availability, dual HSSL interfaces, 1 Gbit/s Ethernet support, and ASCLIN/SENT/PSI5 peripheral count for sensor fusion and high-speed interconnect in ISO 26262 ASIL-D systems.
Technical Context
The TC397XX256F300SBDKXUMA2 implements six TriCore™ V1.6.2 CPUs (4 main + 2 checker cores) with lockstep and ECC-protected memory subsystems. It integrates dual HSSL modules supporting PCIe Gen2 x2 and SATA 3.0, plus 12 ASCLIN channels with ASC, LIN, and 3-wire SPI modes - enabling mixed-protocol communication across ECU domains.
Its safety architecture includes hardware security module (HSM) compliant with EVITA Full, configurable ADC subsystem (5 primary groups / 40 channels, 4 secondary groups / 60 channels), and MCDS trace interface for real-time debugging. The device supports SAK temperature grade (−40°C to +125°C) and uses PG-LFBGA-292 package with 0.8 mm pitch.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 6× TriCore™ V1.6.2 CPUs (4 main + 2 checker), lockstep-capable for ASIL-D compliance |
| Max Clock Frequency | 300 MHz - enables deterministic real-time execution of complex ADAS algorithms |
| Program Flash | 16 MB - sufficient for multi-domain firmware, OTA update partitions, and safety redundancy |
| EMEM Size | 4096 KB - dedicated high-bandwidth memory for ADAS subsystem data buffering and neural network inference |
| Ethernet Support | 1 Gbit/s - enables high-throughput vehicle networking for camera/radar data aggregation |
| HSSL Modules | 2× - provides PCIe Gen2 x2 and SATA 3.0 connectivity for external accelerators or storage |
| ASCLIN Channels | 12 modules, all supporting ASC/LIN/3-wire SPI - allows flexible sensor and actuator interfacing without protocol translation |
Pinout & Package
TC397XX256F300SBDKXUMA2 is housed in a PG-LFBGA-292 package with 0.8 mm ball pitch, optimized for automotive PCB thermal and mechanical reliability under extended temperature operation (−40°C to +125°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply (1.3 V) | Supplies TriCore™ CPU cluster; requires low-noise regulation for timing-critical execution |
| VDDP_1P8 | I/O Power Supply (1.8 V) | Drives ASCLIN, SENT, PSI5, and QSPI I/O banks; supports mixed-voltage sensor interfacing |
| VDDP_3P3 | Analog & Peripheral Power (3.3 V) | Feeds ADC, DAC, and HSSL PHY; critical for analog measurement accuracy and signal integrity |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Accepts 20–40 MHz crystal for system clock generation; supports external clock input mode |
| ETH_RXD0–3 / ETH_TXD0–3 | Gigabit Ethernet PHY Interface | Dedicated RMII/RGMII pins for 1 Gbit/s Ethernet; supports IEEE 1588 timestamping |
| HSSL0_CLK / HSSL0_DATA[0:7] | HSSL Link 0 Differential Pair | PCIe Gen2 x2 or SATA 3.0 physical layer; enables direct connection to vision processors or NVMe storage |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Security Module (HSM) | EVITA Full-compliant cryptographic engine with AES-128/256, SHA-256, RSA-2048, and secure boot key management |
| Extended Memory (EMEM) | 4096 KB on-chip SRAM accessible only by ADAS subsystem - isolates safety-critical data from general-purpose cores |
| Dual HSSL Interfaces | Two independent high-speed serial links supporting PCIe Gen2 x2 and SATA 3.0 simultaneously - eliminates need for external bridge ICs |
| Configurable ADC Subsystem | 5 primary groups / 40 channels + 4 secondary groups / 60 channels with EDSADC and fast compare - supports simultaneous radar, LiDAR, and power monitoring sampling |
| 12 ASCLIN Modules | All 12 support ASC, LIN, and 3-wire SPI protocols - enables unified communication stack for diverse sensors (e.g., IMU, pressure, temperature) without software abstraction overhead |
Applications
| ADAS Domain Controller | Vehicle Central Gateway |
|---|---|
|
Use Scenario: Aggregating and fusing inputs from front radar, surround-view cameras, and ultrasonic sensors in L2+ automated driving systems. IC Role / Device Role / Timing Role: Primary compute node executing perception, localization, and path planning; provides deterministic 300 MHz real-time scheduling with lockstep core validation. Use Value: 4096 KB EMEM enables local buffering of raw camera frames and radar point clouds, reducing off-chip bandwidth and latency for time-critical decision loops. |
Use Scenario: Bridging CAN FD, FlexRay, Ethernet, and LIN networks between powertrain, chassis, and infotainment domains in zonal E/E architectures. IC Role / Device Role / Timing Role: High-throughput routing and protocol translation hub with 1 Gbit/s Ethernet and dual HSSL for backhaul to cloud-connected modules. Use Value: Dual HSSL links allow direct PCIe attachment to cellular modems or AI accelerators, eliminating intermediate switches and reducing gateway BOM cost and latency. |
| Radar Signal Processor Interface | Secure OTA Update Controller |
|
Use Scenario: Interfacing with 77 GHz radar SoCs via HSSL or QSPI to receive baseband IQ data and perform preprocessing before host CPU ingestion. IC Role / Device Role / Timing Role: Dedicated radar co-processor handling FFT, CFAR, and angle estimation; leverages DSPR (240 KB in CPU0&1) for fixed-point math acceleration. Use Value: HSSL Gen2 x2 link delivers >1.6 GB/s sustained throughput - sufficient for streaming multiple radar chirps at 100 kHz PRF without packet loss. |
Use Scenario: Managing signed firmware updates, secure key provisioning, and rollback protection for ECUs across the vehicle fleet. IC Role / Device Role / Timing Role: Root-of-trust anchor implementing secure boot, encrypted flash writes, and attestation using embedded HSM with tamper-resistant key storage. Use Value: EVITA Full HSM enables end-to-end OTA chain-of-trust - meeting UNECE R155/R156 requirements without external secure elements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC397XP256F300SBDKXUMA2 | No EMEM (0 KB); same core count, flash, and peripheral set except missing ADAS subsystem memory | Suitable for non-ADAS applications like body control or gateway where sensor fusion memory bandwidth is not required | Select when EMEM is unnecessary and cost optimization is prioritized over ADAS scalability |
| TC399XX256F300SBDKXUMA2 | 6-core + 2 additional checker cores (6/4 vs 6/4), larger LFBGA-516 package, adds CIF and ADAS Cluster peripherals | Targeted for full ADAS domain controllers requiring camera interface (CIF) and cluster display rendering | Choose when integrating MIPI CSI-2 camera inputs or driving digital instrument clusters alongside radar/camera fusion |
Compared with TC397XP256F300SBDKXUMA2, this part adds 4096 KB EMEM for sensor data staging; versus TC399XX256F300SBDKXUMA2, it trades CIF/ADAS Cluster for smaller footprint and lower thermal density - optimizing for radar-centric or gateway roles where camera processing is offloaded.
Availability
TC397XX256F300SBDKXUMA2 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, vehicle central gateways, radar interface modules, and secure OTA update controllers requiring stable component supply across long production lifecycles.
Supply support for TC397XX256F300SBDKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with leadership in AEC-Q100-qualified devices for safety-critical systems.
This part belongs to the AURIX™ TC39x family - designed specifically for ISO 26262 ASIL-D automotive applications requiring functional safety, hardware-based security, and heterogeneous compute for sensor fusion and domain control.
FAQ
What is the maximum operating temperature range for TC397XX256F300SBDKXUMA2?
The device is rated for ambient temperatures from −40°C to +125°C (SAK grade), validated per AEC-Q100 Grade 2 requirements. Junction temperature limits are defined in the thermal section of the TC39x datasheet, with derating applied above 105°C ambient depending on PCB layout and airflow.
Does TC397XX256F300SBDKXUMA2 support JTAG or only MCDS for debug?
It supports MCDS (Multi-Core Debug Solution) exclusively - a high-bandwidth trace interface delivering real-time instruction and data trace over differential pairs. JTAG is not implemented; MCDS replaces it for complex multi-core debugging, calibration overlay, and runtime analysis in safety-critical environments.
How many SENT channels does TC397XX256F300SBDKXUMA2 provide?
The device provides 20 SENT receiver channels, confirmed in Table 1 of the TC39x Datasheet Addendum v2.2. These are distributed across two SENT modules, supporting variable-length messages and CRC-5/7 checksum verification for pressure, temperature, and position sensors.
Is the HSM in TC397XX256F300SBDKXUMA2 certified to Common Criteria or PSA Level 3?
The HSM implements EVITA Full specifications and supports ISO/IEC 15408 EAL4+ functional requirements for secure boot and cryptographic operations. While Infineon does not publish standalone CC certification for this specific variant, its HSM design aligns with PSA Certified Level 3 threat models for automotive secure elements.
TC397XX256F300SBDKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 10-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 2.52M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC397XX256F300SBDKXUMA2 FAQ
1.How can I place an order for TC397XX256F300SBDKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC397XX256F300SBDKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC397XX256F300SBDKXUMA2 reliable?
The price and inventory of TC397XX256F300SBDKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC397XX256F300SBDKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC397XX256F300SBDKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC397XX256F300SBDKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC397XX256F300SBDKXUMA2?
TC397XX256F300SBDKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC397XX256F300SBDKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC397XX256F300SBDKXUMA2?
For technical support, including TC397XX256F300SBDKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC397XX256F300SBDKXUMA2 requirements.
6.How does Aetrix verify that TC397XX256F300SBDKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC397XX256F300SBDKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC397XX256F300SBDKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC397XX256F300SBDKXUMA2?
All TC397XX256F300SBDKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC397XX256F300SBDKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC397XX256F300SBDKXUMA2 part is unused and in its original packaging.
Return procedure for TC397XX256F300SBDKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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