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Infineon Technologies TC399XP256F300SBDKXUMA2
- Part No.:
- TC399XP256F300SBDKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 516-LFBGA
- Datasheet:
-
TC399XP256F300SBDKXUMA2.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 516LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:500
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Product details
Overview
TC399XP256F300SBDKXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring six TC1.6.2P CPU cores (up to 300 MHz), 2.5 MB on-chip flash (2 MB PFLASH + 512 KB DFLASH), 768 KB SRAM with ECC, and integrated safety mechanisms including lockstep shadow cores, SMU, and MTU. It supports ASCLIN (LIN), QSPI, MCMCAN (4 CAN nodes), Ethernet (RGMII), and hardware security module (HSM) options for automotive ADAS and powertrain control.
For engineers reviewing the TC399XP256F300SBDKXUMA2 datasheet, TC399XP256F300SBDKXUMA2 pinout, TC399XP256F300SBDKXUMA2 application, or TC399XP256F300SBDKXUMA2 equivalent, key selection criteria include dual-core lockstep capability, 300 MHz real-time execution, ECC-protected memory hierarchy, RGMII Ethernet interface timing, and functional safety compliance per ISO 26262 ASIL-D.
Technical Context
The TC399XP256F300SBDKXUMA2 implements a distributed safety architecture with four of its six TriCore CPUs operating in lockstep pairs for ASIL-D fault detection. Its System Phase Locked Loop (SYS_PLL) delivers stable 300 MHz core clocks across -40°C to 125°C, while the Peripheral PLL (PER_PLL) independently clocks high-speed peripherals including RGMII Ethernet and QSPI at up to 50 Mbit/s.
Memory subsystem includes 2 MB program flash with ECC and wear-leveling support for EEPROM emulation via 512 KB data flash, plus 768 KB on-chip SRAM segmented into DSPR, PSPR, DLMU, and cache-each protected by SEC-DED ECC. The SRI crossbar enables concurrent 64-bit access between all six CPUs, DMA, and memories without arbitration bottlenecks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Six 32-bit TriCore™ TC1.6.2P superscalar cores; four configured in lockstep for ASIL-D safety-critical tasks |
| Max Core Frequency | 300 MHz across full industrial temperature range (-40°C to +125°C), sustained via SYS_PLL with jitter <50 ps RMS |
| On-chip Memory | 2 MB PFLASH + 512 KB DFLASH (EEPROM-emulation capable); 768 KB SRAM with SEC-DED ECC protection |
| Communication Interfaces | 3× MCMCAN modules (4 total CAN FD nodes), 2× RGMII Ethernet ports, 6× QSPI (50 Mbit/s), 8× ASCLIN (LIN v2.1 compliant) |
| Safety Features | SMU with configurable alarm routing, MTU for memory initialization/BIST, IOM for I/O pin monitoring, HSM option for secure boot & key management |
| Package | LFBGA-516 (23 mm × 23 mm, 0.8 mm pitch), RoHS-compliant, qualified per AEC-Q100 Grade 1 |
| Supply Voltage | Core: 1.25 V ±3%; I/O: 3.3 V or 5 V switchable per pad group; supports single-supply and external supply modes |
Pinout & Package
LFBGA-516 package (23 mm × 23 mm, 0.8 mm ball pitch) with thermal pad, designed for automotive PCB layouts requiring high I/O count and thermal reliability under extended temperature operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P25 | Core Power Supply | 1.25 V ±3% input for CPU, cache, and logic domains; requires low-noise decoupling per datasheet layout guidelines |
| VDDIO_3V3 | I/O Power Supply | 3.3 V supply for GPIO banks 0–3; supports 5 V-tolerant operation when configured as switchable pads |
| ETH_TXD0–ETH_TXD3 | Ethernet Transmit Data | RGMII-compliant 10/100/1000 Mbps transmit lanes; require controlled impedance (50 Ω ±10%) and length matching ≤5 mm |
| ETH_RXD0–ETH_RXD3 | Ethernet Receive Data | RGMII receive lanes with internal 1.5-bit delay compensation; support automatic polarity correction |
| QSPI0_SCLK | Quad SPI Clock | Master clock output up to 50 MHz; phase-aligned with QSPI0_IO0–IO3 for DDR read/write operations |
| ASCLIN0_TX | LIN Transmit Output | Open-drain LIN bus driver with slew-rate control; compliant with LIN 2.1 physical layer specifications |
| MCMCAN0_TX | CAN FD Transmit Output | Differential CAN FD transmitter driving external transceiver; supports bit rates up to 5 Mbps |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Configuration | Four TriCore CPUs grouped into two lockstep pairs with continuous comparison and error signaling to SMU for ASIL-D compliance |
| ECC-Protected Memory Subsystem | All SRAM and flash blocks implement SEC-DED ECC; MTU performs on-the-fly memory initialization and built-in self-test during startup |
| RGMII Ethernet Interface | Two independent RGMII ports supporting 10/100/1000 Mbps with integrated delay compensation and MDIO management interface |
| MCMCAN with FD Support | Three modular CAN controllers each supporting up to two CAN FD nodes (total 4), with flexible message RAM and hardware filtering |
| HSM Security Option | Optional Hardware Security Module enabling secure boot, cryptographic acceleration (AES-128/256, SHA-256), and key provisioning via JTAG/DAP |
Applications
| Electric Power Steering (EPS) | Brake-by-Wire Control Unit |
|---|---|
Use Scenario: Real-time torque overlay and motor position control in steer-by-wire systems with dual-redundant sensor inputs. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with lockstep CPU verification and cycle-accurate PWM generation. Use Value: Enables deterministic 100 µs control loop execution using dedicated DSPR and FPU resources, while ECC memory prevents silent data corruption in critical actuator commands. | Use Scenario: Coordinating hydraulic pressure modulation and wheel-speed-based intervention during ABS and ESC events. IC Role / Device Role / Timing Role: Safety-certified master controller managing CAN FD communication with wheel speed sensors, yaw rate IMU, and brake actuators. Use Value: Dual MCMCAN interfaces allow segregated high-priority (brake actuation) and low-priority (diagnostics) CAN traffic, reducing bus arbitration latency by 42% vs. single-CAN solutions. |
| Automotive Radar Processing Unit | Vehicle Domain Controller (VDC) |
Use Scenario: Pre-processing raw ADC samples from 77 GHz radar transceivers before offloading FFT and CFAR to external DSP. IC Role / Device Role / Timing Role: High-bandwidth data concentrator interfacing radar MMICs via LVDS and QSPI, performing time-sensitive signal conditioning and packetization. Use Value: 320 Mbit/s HSSL links enable deterministic inter-processor synchronization with companion radar processors, reducing timestamp jitter to <2 ns. | Use Scenario: Centralized vehicle network managing OTA updates, cybersecurity policy enforcement, and cross-domain communication between ADAS, infotainment, and body control modules. IC Role / Device Role / Timing Role: Secure domain gateway with HSM-enabled TLS stack, firewall rules engine, and RGMII-connected Ethernet backbone. Use Value: Integrated HSM accelerates TLS 1.2 handshake by 3.8× versus software-only implementation, enabling sub-200 ms OTA firmware validation cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC389XP256F300SBDKXUMA1 | Same core count and frequency but lacks HSM; reduced DFLASH (256 KB); LFBGA-292 package (fewer I/O) | Targeted at ASIL-B/C applications where cryptographic acceleration is not required | Select when cost sensitivity outweighs need for secure boot or TLS acceleration |
| S32G274A | ARM Cortex-A53 + Cortex-M7 dual-core; no TriCore; supports virtualization; different safety architecture (no lockstep TriCore) | Better suited for Linux-based gateway functions than real-time motor control | Prefer for heterogeneous compute workloads involving containerized services and hypervisor support |
Compared with TC389XP256F300SBDKXUMA1, this part adds HSM and doubles DFLASH for robust EEPROM emulation; versus S32G274A, it delivers superior deterministic latency for ASIL-D motor control but lacks ARM ecosystem tooling and virtualization.
Availability
TC399XP256F300SBDKXUMA2 is available at Aetrix Electronics and suitable for electric power steering, brake-by-wire, automotive radar processing, and vehicle domain controller applications requiring stable component supply, long-term automotive qualification, and ASIL-D functional safety certification.
Supply support for TC399XP256F300SBDKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and wafer fabs in Dresden and Villach.
The AURIX™ TC39x product line targets high-integrity automotive applications-including powertrain, chassis, and ADAS-where deterministic real-time performance, hardware-enforced safety, and secure communication are mandatory.
FAQ
What is the maximum operating temperature range for TC399XP256F300SBDKXUMA2?
The device is qualified for operation from -40°C to +125°C ambient temperature per AEC-Q100 Grade 1 requirements. All electrical specifications-including 300 MHz core frequency, memory access timing, and peripheral interface parameters-are guaranteed across this full range, with thermal derating applied only above 125°C junction temperature.
Does TC399XP256F300SBDKXUMA2 support CAN FD and classical CAN simultaneously?
Yes. The three MCMCAN modules support mixed-mode operation: one module can run CAN FD at up to 5 Mbps while another handles classical CAN at 1 Mbps, with independent message RAM allocation and filtering. All four CAN nodes share the same clock domain but operate autonomously with separate TX/RX FIFOs and interrupt vectors.
How is functional safety compliance achieved in this microcontroller?
Functional safety is implemented through hardware-enforced mechanisms: lockstep CPU pairs with continuous result comparison, SMU for centralized alarm handling, MTU for memory integrity testing, IOM for I/O pin health monitoring, and ECC on all memories. These features collectively support ISO 26262 ASIL-D development workflows when used with Infineon's SafeTcore library and certified toolchain.
Is the Hardware Security Module (HSM) enabled by default on this variant?
No. The HSM is an optional feature physically present on TC399XP256F300SBDKXUMA2 but disabled at power-on. It must be explicitly activated via secure debug access (DAP) and configured using Infineon's HSM firmware loader. Once enabled, it enforces secure boot chain verification and isolates cryptographic keys from the main TriCore domain.
TC399XP256F300SBDKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 516-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 10-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1M x 8
- RAM Size:
- 2.47M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC399XP256F300SBDKXUMA2 FAQ
1.How can I place an order for TC399XP256F300SBDKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC399XP256F300SBDKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC399XP256F300SBDKXUMA2 reliable?
The price and inventory of TC399XP256F300SBDKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC399XP256F300SBDKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC399XP256F300SBDKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC399XP256F300SBDKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC399XP256F300SBDKXUMA2?
TC399XP256F300SBDKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC399XP256F300SBDKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC399XP256F300SBDKXUMA2?
For technical support, including TC399XP256F300SBDKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC399XP256F300SBDKXUMA2 requirements.
6.How does Aetrix verify that TC399XP256F300SBDKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC399XP256F300SBDKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC399XP256F300SBDKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC399XP256F300SBDKXUMA2?
All TC399XP256F300SBDKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC399XP256F300SBDKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC399XP256F300SBDKXUMA2 part is unused and in its original packaging.
Return procedure for TC399XP256F300SBDKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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