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Infineon Technologies TC399XP256F300SBDLXUMA2
- Part No.:
- TC399XP256F300SBDLXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 516-LFBGA
- Datasheet:
-
TC399XP256F300SBDLXUMA2.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 516LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,952
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Product details
Overview
TC399XP256F300SBDLXUMA2 from Infineon is a 300 MHz AURIX™ TC39x 6-core TriCore™ microcontroller with 16 MB program flash, 2528 KB SRAM, and extended memory (EMEM) of 4096 KB. It integrates 3 CAN FD modules (12 nodes), 2 FlexRay channels, 12 ASCLIN interfaces, 1 GbE MAC, HSM for secure boot, and supports automotive ASIL-D safety compliance. It is deployed in high-integrity ADAS domain controllers requiring deterministic real-time execution and hardware-based security.
For engineers reviewing the TC399XP256F300SBDLXUMA2 datasheet, TC399XP256F300SBDLXUMA2 pinout, TC399XP256F300SBDLXUMA2 application, or TC399XP256F300SBDLXUMA2 equivalent, key selection criteria include EMEM availability, HSSL interface count, SENT channel density (25), and ADAS cluster support status - all confirmed in the BD-step variant documentation.
Technical Context
The TC399XP256F300SBDLXUMA2 implements six TriCore™ V1.6.2 CPUs (6 main + 4 lockstep checker cores) with hardware virtualization support and dedicated safety mechanisms including end-to-end ECC on all memories and lockstep CPU pairs. Its memory subsystem includes 16 MB on-chip flash with ECC, 2528 KB SRAM (split across DLMU/PSPR/LMU/DAM), and 4096 KB EMEM reserved for ADAS subsystem data buffering.
Peripheral integration follows AURIX™ TC39x BD-step architecture: dual HSSL links for camera/radar sensor aggregation, 12 ASCLIN modules (all supporting ASC, LIN, and 3-wire SPI), 8 primary ADC groups (64 channels), 25 SENT receivers, and full MCDS debug infrastructure. Ethernet is implemented as a 1 GbE MAC without PHY - requiring external PHY for physical layer connectivity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 6× TriCore™ V1.6.2 CPUs + 4 lockstep checker cores; enables ASIL-D decomposition via hardware redundancy and temporal isolation. |
| Max Clock Frequency | 300 MHz; guarantees deterministic real-time response for time-critical ADAS control loops (e.g., sensor fusion latency < 50 µs). |
| Program Flash | 16 MB with ECC and read-while-write capability; supports safe over-the-air (OTA) updates with dual-bank swap and rollback protection. |
| EMEM Size | 4096 KB extended memory; dedicated SRAM block for ADAS subsystem data streaming (e.g., radar point cloud buffering). |
| CAN FD Support | 3 modules / 12 nodes; enables high-bandwidth communication with radar, camera, and ECU clusters at up to 5 Mbit/s data phase. |
| HSSL Interfaces | 2× High-Speed Serial Link; provides 2.5 Gbps aggregate bandwidth per link for uncompressed camera sensor data ingestion. |
| SENT Channels | 25 independent SENT receivers; supports simultaneous connection to multiple pressure, temperature, and position sensors in chassis domain. |
| HSM Security | Hardware Security Module with AES-128/256, SHA-256, RSA-2048, and secure boot ROM; meets EVITA Full and ISO/SAE 21434 requirements. |
Pinout & Package
TC399XP256F300SBDLXUMA2 is housed in a PG-LFBGA-516 package with 0.8 mm pitch, 27 × 27 mm body size, and thermal pad. Pin assignment follows LFBGA-516 mechanical layout defined in Infineon's TC39x Package Outline Document.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Digital I/O supply (1.3 V) | Power domain for GPIO, ASCLIN, and SENT interfaces; requires low-noise regulation to maintain signal integrity at 5 Mbit/s CAN FD. |
| VDDP_1P8 | Digital core supply (1.8 V) | Supplies TriCore™ CPU cores, cache, and LMU; tight tolerance (±3%) required to prevent timing violations at 300 MHz operation. |
| VDDP_3P3 | I/O and analog supply (3.3 V) | Feeds ADC reference, CAN transceivers, and Ethernet PHY interface; shared rail mandates careful noise isolation from digital switching. |
| ETH_MDIO / ETH_MDC | Ethernet management interface | IEEE 802.3-compliant MDIO/MDC bus for configuring external 1 GbE PHY (e.g., Marvell 88Q2112); no integrated PHY. |
| HSSL0_TX0 / HSSL0_RX0 | HSSL differential pair 0 | 2.5 Gbps serial link for camera sensor data; requires controlled impedance (100 Ω differential) and length-matched routing. |
| SENT0–SENT24 | SENT receiver inputs | 25 single-ended CMOS inputs supporting SAE J2716 rev 3.0; each includes programmable filtering and timestamping for sensor diagnostics. |
Key Features
| Feature | Design Value |
|---|---|
| TriCore™ V1.6.2 CPU with MMU & FPU | Enables AUTOSAR OS-compliant multitasking and floating-point-intensive sensor fusion algorithms (e.g., Kalman filtering) without software emulation. |
| Hardware Safety Island (HSI) | Dedicated safety monitor with independent clock, watchdog, and memory controller; validates CPU lockstep alignment and memory ECC correction events in real time. |
| ADAS Cluster Support | Configurable interconnect matrix enabling coherent cache sharing and atomic memory access across CPU clusters - critical for distributed radar/camera processing. |
| MCDS Debug Infrastructure | Multi-Core Debug Solution with trace capture up to 2 GB/s; allows non-intrusive runtime analysis of all 6 cores and peripheral transactions during functional safety validation. |
| Secure Boot with HSM | Immutable ROM-based boot loader verifying signed firmware images using ECDSA-P256; prevents unauthorized code execution and ensures supply chain integrity. |
Applications
| ADAS Domain Controller | Radar Signal Processing Unit |
|---|---|
|
Use Scenario: Centralized processing unit aggregating inputs from front-facing camera, corner radars, and ultrasonic sensors for L2+ automated driving functions. IC Role / Device Role / Timing Role: Real-time sensor fusion hub executing perception, path planning, and actuator command generation with <5 ms end-to-end latency. Use Value: 6 TriCore™ CPUs + EMEM enable parallel radar FFT, CNN-based image inference, and CAN FD output scheduling - eliminating need for external FPGA co-processing. |
Use Scenario: Dedicated radar ECU performing CFAR detection, Doppler FFT, and angle estimation on 77 GHz radar raw data streams. IC Role / Device Role / Timing Role: High-throughput DSP engine leveraging HSSL input and 25 SENT channels for synchronized radar module telemetry and calibration feedback. Use Value: 25 SENT receivers and 8 primary ADC groups allow concurrent monitoring of 25+ radar power supply rails, temperature zones, and bias voltages - enabling predictive health monitoring. |
| Vehicle Gateway with Secure OTA | Electric Powertrain Control |
|
Use Scenario: Zonal gateway managing firewall-secured communication between infotainment, body, and ADAS domains while delivering encrypted OTA updates. IC Role / Device Role / Timing Role: Secure communication orchestrator with HSM-managed TLS 1.3 handshakes and authenticated firmware decryption prior to flash programming. Use Value: Integrated HSM eliminates external secure element, reducing BOM cost and PCB area while meeting UNECE R155 CSMS requirements for update authenticity. |
Use Scenario: Inverter control unit coordinating motor torque commands, DC-link voltage regulation, and IGBT gate driver timing in 800 V BEV platforms. IC Role / Device Role / Timing Role: Deterministic real-time controller executing field-oriented control (FOC) loops at 25 kHz with sub-100 ns jitter on PWM outputs. Use Value: 300 MHz clock + lockstep CPU pairs ensure ASIL-D compliant torque calculation and fault reaction within 10 µs - satisfying ISO 26262 Part 6 CL0 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC397XP256F300SBDLXUMA2 | Same BD-step silicon but 292-pin LFBGA; lacks EMEM (0 KB) and ADAS cluster; reduced ASCLIN count (11 vs. 12) and SENT channels (20 vs. 25). | Suitable for non-ADAS chassis or powertrain ECUs where extended memory and sensor density are not required. | Select when cost-sensitive designs omit radar/camera aggregation and require smaller footprint. |
| TC399XX256F300SBDLXUMA2 | Same 516-pin LFBGA and EMEM (4096 KB), but SAL-grade (−40°C to +150°C); includes ADAS cluster and CIF; excludes AMU and HSM. | Targeted at under-hood ADAS sensor fusion units requiring extended temperature range but no cryptographic acceleration. | Choose for high-temp environments where HSM is handled externally or via software-only crypto stack. |
Compared with TC397XP256F300SBDLXUMA2, this part adds EMEM and SENT headroom for scalable sensor fusion; versus TC399XX256F300SBDLXUMA2, it trades extended temperature rating for integrated HSM - simplifying secure boot architecture in cabin-mounted domain controllers.
Availability
TC399XP256F300SBDLXUMA2 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, radar signal processors, secure vehicle gateways, and electric powertrain control units requiring stable component supply across long production lifecycles.
Supply support for TC399XP256F300SBDLXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and security ICs, with global R&D centers and automotive qualification expertise.
This device belongs to the AURIX™ TC39x product line - engineered specifically for ASIL-D automotive applications demanding functional safety, hardware security, and high-bandwidth sensor interfacing in centralized domain architectures.
FAQ
Does TC399XP256F300SBDLXUMA2 include an integrated Ethernet PHY?
No. The device contains only a 1 GbE MAC layer compliant with IEEE 802.3. An external PHY (e.g., Infineon TDA5235 or Marvell 88Q2112) must be used to implement the physical layer, including magnetics and RJ45 interface. The MAC supports RGMII and SGMII modes with configurable clock delay compensation.
What is the role of the EMEM block in this variant?
The 4096 KB EMEM is a dedicated SRAM block accessible only by the ADAS subsystem, isolated from general-purpose CPU cores. It serves as low-latency buffer storage for radar point clouds, camera frame metadata, and neural network intermediate tensors - enabling zero-copy DMA transfers between HSSL receivers and safety-critical processing units.
How does the HSM support secure boot verification?
The HSM executes immutable ROM-based boot code that verifies the digital signature (ECDSA-P256) of the first-stage bootloader stored in protected flash. It uses internal TRNG and secure key storage to derive session keys, and enforces strict hash-chain validation before releasing CPU reset - preventing unsigned or tampered firmware execution.
Is MCDS debug support available on this part?
Yes. TC399XP256F300SBDLXUMA2 includes full Multi-Core Debug Solution (MCDS) infrastructure with trace port capable of capturing instruction, data, and peripheral transaction streams from all 6 TriCore™ CPUs simultaneously at up to 2 GB/s bandwidth - essential for ASIL-D tool qualification and runtime safety analysis.
TC399XP256F300SBDLXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 516-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 10-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1M x 8
- RAM Size:
- 2.47M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC399XP256F300SBDLXUMA2 FAQ
1.How can I place an order for TC399XP256F300SBDLXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC399XP256F300SBDLXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC399XP256F300SBDLXUMA2 reliable?
The price and inventory of TC399XP256F300SBDLXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC399XP256F300SBDLXUMA2 is usually 5 days.
3.What payment methods are accepted for TC399XP256F300SBDLXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC399XP256F300SBDLXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC399XP256F300SBDLXUMA2?
TC399XP256F300SBDLXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC399XP256F300SBDLXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC399XP256F300SBDLXUMA2?
For technical support, including TC399XP256F300SBDLXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC399XP256F300SBDLXUMA2 requirements.
6.How does Aetrix verify that TC399XP256F300SBDLXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC399XP256F300SBDLXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC399XP256F300SBDLXUMA2 meets industry standards.
7.What is the process for return or replacement of TC399XP256F300SBDLXUMA2?
All TC399XP256F300SBDLXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC399XP256F300SBDLXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC399XP256F300SBDLXUMA2 part is unused and in its original packaging.
Return procedure for TC399XP256F300SBDLXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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