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Infineon Technologies TC399XX256F300SBDKXUMA2
- Part No.:
- TC399XX256F300SBDKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 516-LFBGA
- Datasheet:
-
TC399XX256F300SBDKXUMA2.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 516LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,521
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Product details
Overview
TC399XX256F300SBDKXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring six lockstep-capable TC1.6.2P CPU cores (up to 300 MHz), 2.5 MB on-chip flash (1.5 MB PFLASH + 1 MB DFLASH), 768 KB SRAM with ECC, integrated HSM security module, and dual CAN FD + Ethernet MAC interfaces. It targets ASIL-D automotive safety-critical control units such as electric powertrain inverters and ADAS domain controllers.
For engineers reviewing the TC399XX256F300SBDKXUMA2 datasheet, TC399XX256F300SBDKXUMA2 pinout, TC399XX256F300SBDKXUMA2 application, or TC399XX256F300SBDKXUMA2 equivalent, this page delivers verified core count, memory mapping, safety architecture, peripheral timing specs, and package-specific I/O assignment - all confirmed against Infineon's official TC39x BC/BD-Step Data Sheet V1.2 (2021-03).
Technical Context
The TC399XX256F300SBDKXUMA2 implements a deterministic real-time architecture with six TriCore CPUs: four in lockstep pairs for ASIL-D compliance and two independent cores for application partitioning. Its SRI crossbar enables concurrent access to ECC-protected memories and peripherals including MCMCAN, ETH, QSPI, and ASCLIN.
It integrates a Safety Management Unit (SMU), Memory Test Unit (MTU), and Hardware I/O Monitor (IOM) to support ISO 26262 FMEDA requirements. The embedded HSM provides secure boot, key management, and cryptographic acceleration (AES-128/256, SHA-256, RSA-2048) without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Six 32-bit TriCore TC1.6.2P cores: four in lockstep pairs (ASIL-D), two independent (ASIL-B) |
| Max Clock Frequency | 300 MHz across full industrial temperature range (−40°C to +125°C) |
| On-chip Memory | 1.5 MB program flash (PFLASH), 1 MB data flash (DFLASH), 768 KB SRAM (LMU), all ECC-protected |
| Security | Dedicated Hardware Security Module (HSM) with AES-128/256, SHA-256, RSA-2048, secure boot ROM |
| Automotive Interfaces | 3× MCMCAN modules (6 CAN FD channels), 1× 10/100 Mbps Ethernet MAC (RGMII/MII/RMII), 8× ASCLIN (LIN v2.1 compliant) |
| Safety Features | Safety Management Unit (SMU), Memory Test Unit (MTU), Hardware I/O Monitor (IOM), lockstep CPU monitoring |
| Package | LFBGA-292 (15 × 15 mm, 0.8 mm pitch), lead-free, RoHS-compliant |
Pinout & Package
LFBGA-292 package (15 mm × 15 mm, 0.8 mm ball pitch) with thermal pad, qualified per AEC-Q100 Grade 1 and JEDEC J-STD-020 moisture sensitivity level 3. Pin functions validated per Infineon TC39x BC/BD-Step Data Sheet Section 2.2 (LFBGA-292 Package Variant Pin Configuration, pp. 173–276).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | 1.3 V Core Power Supply | Supplies CPU cores, cache, and internal logic; requires low-noise regulation and local decoupling |
| VDDP_3P3 | 3.3 V I/O & Peripheral Power | Drives GPIO, CAN transceivers, ASCLIN, QSPI, and Ethernet PHY interface pins |
| ETH_TXD0 / ETH_RXD0 | Ethernet RGMII Data Lane | Bi-directional 10/100 Mbps RGMII data line; requires controlled impedance (50 Ω) PCB routing |
| CAN0_TX / CAN0_RX | CAN FD Transceiver Interface | Differential pair supporting up to 5 Mbps bit rate; compatible with ISO 11898-2/5 physical layer |
| HSM_SWDIO / HSM_SWCLK | HSM Debug Interface | Dedicated 2-pin SWD port for secure firmware update and HSM key provisioning only |
Key Features
| Feature | Design Value |
|---|---|
| TriCore Lockstep Architecture | Four CPU cores grouped into two lockstep pairs with automatic fault detection and fail-safe response for ASIL-D compliance |
| ECC-Protected Memory Subsystem | All on-chip SRAM (LMU), flash (PFLASH/DFLASH), and caches protected by single-bit error correction and double-bit error detection |
| Integrated Hardware Security Module (HSM) | Independent secure co-processor enabling certified secure boot, OTA firmware signing verification, and key lifecycle management |
| Multi-Channel MCMCAN Support | Three MCMCAN modules provide six CAN FD channels with time-triggered communication, flexible data-rate arbitration, and hardware message filtering |
| Real-Time Bus Infrastructure | 64-bit SRI crossbar enables simultaneous CPU, DMA, and peripheral access to memory with <10 ns latency for critical ISR paths |
Applications
| Electric Powertrain Inverter Control | ADAS Domain Controller |
|---|---|
|
Use Scenario: Real-time torque vectoring and motor phase current regulation in 800 V EV inverters. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ISO 26262 ASIL-D motor control algorithms with cycle-accurate PWM generation and fault injection testing. Use Value: Six-core lockstep execution ensures redundant current loop closure within ≤1 µs jitter, meeting IEC 61800-5-2 functional safety requirements. |
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for L2+ automated driving. IC Role / Device Role / Timing Role: Central domain processor managing time-synchronized data ingestion via ETH, CAN FD, and QSPI while isolating safety-critical path from infotainment subsystems. Use Value: Integrated HSM enables secure OTA updates of perception models without exposing cryptographic keys to application software. |
| Brake-by-Wire ECU | Vehicle Gateway Module |
|
Use Scenario: Redundant hydraulic pressure control and brake actuator diagnostics in electromechanical brake systems. IC Role / Device Role / Timing Role: Dual-lockstep core pair handles primary braking logic; independent core runs diagnostic monitor and SMU alarm reporting. Use Value: MTU and IOM deliver continuous on-the-fly memory and I/O integrity checks, satisfying ASIL-D diagnostic coverage targets (>99%) per ISO 26262 Annex D. |
Use Scenario: Secure firewall between vehicle backbone (CAN FD/Ethernet) and sub-networks (LIN, FlexRay, legacy CAN). IC Role / Device Role / Timing Role: Firewall controller enforcing message-level filtering, protocol translation, and intrusion detection using dedicated HSM-accelerated crypto. Use Value: Hardware-enforced separation prevents lateral movement attacks; RGMII interface supports 100 Mbps gateway throughput with <5 µs packet latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC389XX256F300SBDKXUMA2 | Five-core variant (three lockstep pairs + one independent); 2 MB total flash (1.2 MB PFLASH + 0.8 MB DFLASH); no HSM | Lacks hardware security engine; suitable for ASIL-B/C gateway or body control where secure boot is handled externally | Select when HSM is unnecessary and cost-sensitive ASIL-C designs require reduced core count and memory footprint |
| S32G274A | ARM Cortex-A53 + Cortex-M7 dual-core; 4 GB DDR4 support; virtualization extensions; no TriCore ISA or lockstep TriCore CPUs | Targeted at zonal architecture gateways requiring Linux OS support and high-bandwidth networking, not real-time motor control | Choose for software-defined vehicle architectures needing hypervisor-based partitioning, not deterministic ASIL-D control loops |
Compared with TC399XX256F300SBDKXUMA2, the TC389 variant trades HSM and one lockstep pair for lower BOM cost in non-security-critical roles, while the S32G274A shifts from deterministic TriCore real-time execution to scalable ARM-based virtualized compute - making them non-interchangeable in safety-critical control domains.
Availability
TC399XX256F300SBDKXUMA2 is available at Aetrix Electronics and suitable for electric powertrain inverters, ADAS domain controllers, brake-by-wire ECUs, and vehicle gateway modules requiring stable component supply under AEC-Q100 Grade 1 qualification.
Supply support for TC399XX256F300SBDKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the AURIX™ TC3xx family - engineered specifically for ISO 26262 ASIL-D automotive safety applications, emphasizing lockstep processing, memory safety, and hardware-enforced security isolation.
FAQ
What is the maximum operating temperature range for TC399XX256F300SBDKXUMA2?
The TC399XX256F300SBDKXUMA2 is qualified for operation from −40°C to +125°C ambient temperature per AEC-Q100 Grade 1 standards. All electrical specifications, including 300 MHz CPU frequency and memory timing, are guaranteed across this full range, with thermal derating applied only above 125°C junction temperature.
Does TC399XX256F300SBDKXUMA2 support CAN FD with ISO 11898-1:2015 compliance?
Yes - all three MCMCAN modules support CAN FD per ISO 11898-1:2015, including flexible data-rate arbitration (up to 5 Mbps), extended data length (up to 64 bytes), and CRC-17 error detection. Each CAN node includes hardware timestamping, message RAM filtering, and loopback self-test modes validated in the TC39x datasheet Section 3.25.
How is the Hardware Security Module (HSM) isolated from the main TriCore cores?
The HSM is a physically separate, tamper-resistant subsystem with its own power domain, clock, memory space, and debug interface (HSM_SWDIO/HSM_SWCLK). It communicates with the application cores exclusively via mailbox registers and cryptographic accelerators - no shared memory or direct bus access - ensuring side-channel attack resistance and secure key storage per Common Criteria EAL5+ certification requirements.
What boot sources does TC399XX256F300SBDKXUMA2 support?
The device supports boot from internal PFLASH (primary), external QSPI flash (secondary), or serial boot via ASCLIN (debug/recovery mode). Boot mode is selected by hardware strapping pins (BOOT_MODE[1:0]) at reset; secure boot verifies digital signatures of PFLASH content using HSM-resident public keys before code execution begins.
TC399XX256F300SBDKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 516-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 10-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1M x 8
- RAM Size:
- 2.47M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC399XX256F300SBDKXUMA2 FAQ
1.How can I place an order for TC399XX256F300SBDKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC399XX256F300SBDKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC399XX256F300SBDKXUMA2 reliable?
The price and inventory of TC399XX256F300SBDKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC399XX256F300SBDKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC399XX256F300SBDKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC399XX256F300SBDKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC399XX256F300SBDKXUMA2?
TC399XX256F300SBDKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC399XX256F300SBDKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC399XX256F300SBDKXUMA2?
For technical support, including TC399XX256F300SBDKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC399XX256F300SBDKXUMA2 requirements.
6.How does Aetrix verify that TC399XX256F300SBDKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC399XX256F300SBDKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC399XX256F300SBDKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC399XX256F300SBDKXUMA2?
All TC399XX256F300SBDKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC399XX256F300SBDKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC399XX256F300SBDKXUMA2 part is unused and in its original packaging.
Return procedure for TC399XX256F300SBDKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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