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Infineon Technologies TC399XX256F300SBDLXUMA2
- Part No.:
- TC399XX256F300SBDLXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 516-LFBGA
- Datasheet:
-
TC399XX256F300SBDLXUMA2.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 516LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,300
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Product details
Overview
TC399XX256F300SBDLXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with six lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 16 MB embedded PFlash, 1 MB DFlash for EEPROM emulation, and integrated hardware safety features including SMU, MTU, and ECC-protected memories. It targets automotive ASIL-D safety-critical applications such as electric powertrain control and ADAS domain controllers.
For engineers reviewing the TC399XX256F300SBDLXUMA2 datasheet, TC399XX256F300SBDLXUMA2 pinout, TC399XX256F300SBDLXUMA2 application, or TC399XX256F300SBDLXUMA2 equivalent, key selection criteria include dual-core lockstep configuration, 300 MHz real-time execution, ASIL-D compliance support, and integrated HSM for secure boot and cryptographic acceleration.
Technical Context
The TC399XX256F300SBDLXUMA2 implements a multi-core safety architecture with four of its six TriCore CPUs configured in lockstep pairs (2×2), enabling continuous comparison and fault detection per ISO 26262. Its System Phase Locked Loop (SYS_PLL) delivers stable 300 MHz core clocks across -40°C to 125°C ambient.
It integrates three MCMCAN modules supporting CAN FD up to 5 Mbps, six QSPI interfaces with DMA-assisted transfers, and an Ethernet MAC (RGMII/MII) compliant with IEEE 802.3. The on-chip Safety Management Unit (SMU) monitors voltage, temperature, clock, and memory integrity via dedicated watchdogs and error injection test modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Six 32-bit TriCore TC1.6.2P cores; four configured in lockstep pairs for ASIL-D compliance |
| Max Clock Frequency | 300 MHz at full industrial temperature range (−40 °C to +125 °C) |
| Embedded Flash | 16 MB Program Flash (PFLASH) with ECC; 1 MB Data Flash (DFLASH) for EEPROM emulation |
| On-chip RAM | 768 KB LMU SRAM, plus per-core DSPR/PSPR (up to 240 KB data + 64 KB instruction scratchpad) |
| Safety Features | SMU, MTU, IOM, ECC on all memories, lockstep CPU monitoring, and BIST coverage >90% |
| Communication Interfaces | 3× MCMCAN (CAN FD), 6× QSPI, 8× ASCLIN (LIN v2.1), 2× HSSL, 1× Ethernet (RGMII/MII), 4× MSC |
| Package | LFBGA-516, 27 × 27 mm, 0.8 mm pitch, lead-free and RoHS-compliant |
Pinout & Package
LFBGA-516 package with 27 × 27 mm body, 0.8 mm ball pitch, and standard JEDEC MO-277 footprint. Thermal pad exposed on underside for enhanced heat dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and L1 caches; requires low-noise regulation and local decoupling |
| VDDP_1P5 | Digital I/O Power | 1.5 V supply for GPIO banks, ASCLIN, QSPI, and peripheral logic |
| VDDP_3P3 | Analog & Interface Power | 3.3 V supply for ADC references, CAN transceivers, and Ethernet PHY interface |
| OSC_IN / OSC_OUT | Crystal Oscillator Input/Output | Supports 20–40 MHz external crystal; feeds SYS_PLL for precise clock generation |
| ETH_RXD[3:0], ETH_TXD[3:0] | Ethernet RGMII Data | 4-bit RGMII receive/transmit lanes; require matched trace lengths and 50 Ω termination |
| TSBCLK, TSBSTB, TSBDAT | Test Shell Bus Interface | Used for production test, debug access, and boundary-scan (IEEE 1149.1) compliance |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Configuration | Four TriCore CPUs grouped into two lockstep pairs with real-time comparison and fail-safe shutdown |
| Hardware Security Module (HSM) | Dedicated ARM Cortex-M3 core with AES-128/256, SHA-256, RSA-2048, and secure boot ROM |
| Memory Test Unit (MTU) | Automated ECC initialization, online memory testing, and March C+ MBIST for SRAM/Flash |
| ASIL-D Ready Peripheral Set | All critical peripherals (CAN, ADC, timers) include redundancy, self-test, and error signaling per ISO 26262 Part 5 |
| High-Speed Serial Interconnect | Two HSSL links supporting 320 Mbps inter-processor communication with CRC and link-layer retry |
Applications
| Electric Powertrain Control | ADAS Domain Controller |
|---|---|
Use Scenario: Real-time torque vectoring and inverter gate drive sequencing in 400V/800V traction inverters. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with <1 µs interrupt latency and deterministic cycle timing. Use Value: Dual-lockstep CPU pairs ensure fault detection within 2 clock cycles; ECC-protected 16 MB PFlash enables field-upgradable motor control firmware with rollback protection. | Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for L2+/L3 autonomous driving functions. IC Role / Device Role / Timing Role: Central domain processor managing time-synchronized data ingestion via 3× CAN FD and Ethernet RGMII, with hardware timestamping. Use Value: Six-core architecture allocates dedicated cores to sensor preprocessing, fusion, and actuator output-enabling sub-10 ms end-to-end latency with ASIL-B decomposition. |
| Brake-by-Wire System | Charging Communication Controller |
Use Scenario: Redundant electro-hydraulic brake control with dual independent actuation paths and cross-monitoring. IC Role / Device Role / Timing Role: Safety-certified controller executing dual-channel brake pressure modulation with hardware-enforced separation between channels. Use Value: SMU-monitored voltage/current/temperature sensors feed real-time diagnostics; MTU validates memory integrity before each braking command execution. | Use Scenario: Onboard charging controller managing AC/DC conversion, grid communication (ISO 15118), and battery thermal coordination. IC Role / Device Role / Timing Role: Secure gateway handling PKI-based V2G authentication, encrypted charging session negotiation, and CAN FD power delivery control. Use Value: Integrated HSM performs ECDSA signing and TLS 1.2 handshake offload, reducing host CPU load by >70% versus software-only implementations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-integrity automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC397XP-128F300SBDLKXUMA1 | Same die, reduced PFlash (128 KB vs 16 MB), no DFlash, LFBGA-292 package | Targeted at prototyping or non-production evaluation; lacks production-grade memory and package robustness | Select only for early software development where full flash capacity and automotive qualification are not required |
| S32K344W1MTAT0MLF | NXP S32K3 series; Arm Cortex-R52 dual-core, 320 MHz, 8 MB Flash, ASIL-D certified | Uses Arm ecosystem toolchain and AUTOSAR stack; different peripheral IP (e.g., FlexIO instead of ASCLIN/QSPI) | Prefer when leveraging existing NXP SDK/AUTOSAR investment or requiring Arm-native RTOS compatibility |
Compared with TC399XX256F300SBDLXUMA2, the TC397XP variant sacrifices memory and qualification for cost-sensitive evaluation, while the S32K344 offers Arm-based toolchain continuity but requires re-architecting of TriCore-specific safety monitor and lockstep logic.
Availability
TC399XX256F300SBDLXUMA2 is available at Aetrix Electronics and suitable for electric powertrain control, ADAS domain controllers, brake-by-wire systems, and charging communication controllers requiring stable component supply across automotive production lifecycles.
Supply support for TC399XX256F300SBDLXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security ICs, with global R&D centers and wafer fabs in Dresden and Villach.
The AURIX™ TC39x product line is designed specifically for ASIL-D automotive safety applications-including xEV powertrain, chassis, and automated driving-delivering deterministic real-time performance, hardware-based safety mechanisms, and scalable multi-core architectures.
FAQ
What is the maximum junction temperature rating for TC399XX256F300SBDLXUMA2?
The device is qualified for operation up to 150 °C junction temperature, with thermal derating applied above 125 °C ambient per the datasheet's "Operating Conditions" section. The LFBGA-516 package includes an exposed thermal pad that must be soldered to a dedicated PCB copper pour for effective heat transfer.
Does TC399XX256F300SBDLXUMA2 support JTAG debugging in production mode?
No-JTAG is disabled after secure boot completion unless explicitly enabled via HSM-controlled debug authentication. Production units default to DAP (Debug Access Port) over SWD using a 5-pin cJTAG interface, with debug access gated by HSM-verified credentials and lifetime-limited session keys.
How is the 1 MB DFlash used for EEPROM emulation validated for endurance and retention?
Infineon guarantees 100,000 write/erase cycles and 10-year data retention at 125 °C, verified through accelerated life testing per AEC-Q100 Grade 1. The DFlash controller includes wear-leveling, atomic page updates, and checksum-protected metadata stored in redundant sectors.
Can the Ethernet interface operate in both MII and RGMII modes simultaneously?
No-the ETH peripheral supports either MII or RGMII mode, selected at reset via the ETH_CON register; simultaneous operation is not supported. Mode selection is fixed per hardware configuration and requires corresponding PHY interface wiring-RGMII demands 4-bit DDR data lanes with 180° phase-shifted strobes.
TC399XX256F300SBDLXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 516-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 10-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1M x 8
- RAM Size:
- 2.47M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC399XX256F300SBDLXUMA2 FAQ
1.How can I place an order for TC399XX256F300SBDLXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC399XX256F300SBDLXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC399XX256F300SBDLXUMA2 reliable?
The price and inventory of TC399XX256F300SBDLXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC399XX256F300SBDLXUMA2 is usually 5 days.
3.What payment methods are accepted for TC399XX256F300SBDLXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC399XX256F300SBDLXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC399XX256F300SBDLXUMA2?
TC399XX256F300SBDLXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC399XX256F300SBDLXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC399XX256F300SBDLXUMA2?
For technical support, including TC399XX256F300SBDLXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC399XX256F300SBDLXUMA2 requirements.
6.How does Aetrix verify that TC399XX256F300SBDLXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC399XX256F300SBDLXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC399XX256F300SBDLXUMA2 meets industry standards.
7.What is the process for return or replacement of TC399XX256F300SBDLXUMA2?
All TC399XX256F300SBDLXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC399XX256F300SBDLXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC399XX256F300SBDLXUMA2 part is unused and in its original packaging.
Return procedure for TC399XX256F300SBDLXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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