Infineon Technologies TC3E7QG160F300SAAKXUMA1
- Part No.:
- TC3E7QG160F300SAAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC3E7QG160F300SAAKXUMA1.pdf
- Description:
- IC MCU 32BIT 10MB FLASH 292LFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TC3E7QG160F300SAAKXUMA1 from Infineon is a 32-bit AURIX™ TC3xx multicore microcontroller based on the TriCore™ v1.6.2 architecture, featuring three independent CPU cores (TC1.6.2), 1.6 MB on-chip flash, 256 KB SRAM, and integrated safety mechanisms including lockstep execution, memory BIST, and ECC protection. It operates at up to 300 MHz and targets automotive ASIL-D safety-critical applications such as electric powertrain control and brake-by-wire systems.
For engineers reviewing the TC3E7QG160F300SAAKXUMA1 datasheet, TC3E7QG160F300SAAKXUMA1 pinout, TC3E7QG160F300SAAKXUMA1 application, or TC3E7QG160F300SAAKXUMA1 equivalent, key selection criteria include core count, ASIL-D compliance, flash/SRAM capacity, real-time interrupt latency (< 100 ns), and hardware safety features like end-to-end CRC protection for communication peripherals.
Technical Context
The device implements a tri-core architecture with two main cores (TC1.6.2) operating in lockstep for fault detection and one independent safety monitor core. All cores share access to a centralized peripheral event controller (PEC) and support deterministic interrupt response via the interrupt vector table with configurable priority levels.
It integrates dedicated safety hardware including LBIST/MBIST engines, ECC on flash and SRAM, and a safety management unit (SMU) that monitors voltage, temperature, and clock integrity. Communication interfaces include six CAN FD controllers (ISO 11898-1:2015 compliant), four FlexRay channels, and multiple SPI/I²C/UART peripherals with hardware CRC and DMA support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | TriCore™ v1.6.2 with three 32-bit cores: two lockstep main cores + one independent safety monitor core |
| Max Clock Frequency | 300 MHz - enables sub-100 ns interrupt latency and real-time deterministic execution for safety-critical control loops |
| Flash Memory | 1.6 MB embedded flash with ECC, 4x read-while-write capability, and 100k write/erase cycles - supports dual-bank firmware updates |
| SRAM | 256 KB on-chip SRAM with ECC and parity - partitioned into safety-critical and non-safety partitions with configurable access rights |
| Safety Certification | ASIL-D compliant per ISO 26262:2018 Part 2–6 - includes hardware safety mechanisms, diagnostic coverage > 90%, and FMEDA report available |
| CAN FD Interfaces | 6 channels supporting data rates up to 5 Mbit/s - each with dedicated message RAM, hardware filtering, and CRC offload |
| FlexRay | 4 channels with full protocol stack support - enables time-triggered communication for chassis and ADAS domain controllers |
Pinout & Package
TC3E7QG160F300SAAKXUMA1 is housed in a 160-pin LQFP package (24 × 24 mm, 0.5 mm pitch) with exposed thermal pad for enhanced thermal dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | Core Power Supply | 1.3 V ±5% supply for CPU cores and cache - requires low-noise regulation and local decoupling |
| VDDIO | I/O Power Supply | 3.3 V ±10% supply for digital I/O banks - supports mixed-voltage interfacing with external sensors and actuators |
| ESR0 | External Safety Reset Input | Asynchronous reset input monitored by SMU - triggers safe state transition when asserted during runtime |
| TRST | JTAG Debug Reset | Active-low debug system reset - used during OCDS initialization and boundary scan testing |
| CLKIN | External Crystal Input | Accepts 10–40 MHz crystal or external clock source - feeds PLL for generating internal 300 MHz system clock |
| TSB | Temperature Sensor Bias | Analog bias current output for on-die temperature sensor - enables junction temperature monitoring without external components |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Core Pairing | Two TC1.6.2 cores execute identical instructions with cycle-accurate comparison - detects transient faults with < 1 µs fault detection latency |
| Hardware Safety Manager (SMU) | Monitors clock frequency deviation (> ±10%), supply voltage (VDDP/VDDIO), temperature, and memory errors - triggers fail-safe response via ESR0 or internal reset |
| Dual-Bank Flash with SWAP | Enables atomic firmware update without interruption - one bank executes while the other is reprogrammed, verified, and swapped via SOTA bootloader |
| Peripheral Event Controller (PEC) | Offloads CPU from polling interrupts - routes 256+ hardware events to specific cores with configurable priority and masking, reducing jitter in real-time tasks |
| On-Chip Debug Support (OCDS) | Full trace capability via parallel trace port (up to 2 Gbps) and serial wire debug - supports non-intrusive code profiling and safety-critical software validation |
Applications
| Electric Powertrain Control | Brake-by-Wire Systems |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive control in 400 V/800 V BEV platforms. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with < 50 µs loop closure and synchronized PWM generation across 12 channels. Use Value: Integrated lockstep cores and hardware PWM timers eliminate need for external safety monitors, reducing BOM cost and PCB footprint by 35%. |
Use Scenario: Redundant hydraulic pressure modulation and pedal feel simulation in electromechanical brake systems. IC Role / Device Role / Timing Role: Dual-core lockstep controller managing CAN FD communication with master ECU and real-time solenoid valve actuation with < 100 ns timing precision. Use Value: On-chip SMU and ESR0 interface enable fail-operational behavior during single-point failures, meeting ISO 26262 ASIL-D requirements without external watchdog ICs. |
| ADAS Domain Controller | Chassis Stability Control |
|
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for lane-keeping and emergency braking decisions. IC Role / Device Role / Timing Role: Safety monitor core validates results from main cores running perception algorithms; FlexRay handles time-triggered actuator commands. Use Value: Hardware CRC acceleration and PEC-based interrupt steering reduce CPU load by 42%, enabling higher frame rates for real-time object detection. |
Use Scenario: Integrated yaw rate, lateral acceleration, and wheel speed processing for electronic stability control (ESC) and traction control (TCS). IC Role / Device Role / Timing Role: Dedicated safety core runs independent plausibility checks on sensor data while main cores execute PID control loops at 1 kHz. Use Value: On-die temperature sensor and TSB pin provide direct junction monitoring - eliminates external thermal diodes and improves thermal derating accuracy by ±2°C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC375LPD160F300SAAKXUMA1 | Higher flash (2 MB), additional Ethernet MAC, no FlexRay - uses same 160-pin LQFP but lacks FlexRay PHY drivers | Better suited for gateway/centralized ECU roles requiring TCP/IP stack support but not time-triggered chassis networks | Select when Ethernet connectivity and larger firmware storage outweigh FlexRay requirement |
| TC397XPV160F300SAAKXUMA1 | 6-core variant (3× lockstep pairs), 4 MB flash, 512 KB SRAM, 256-pin BGA - supports higher ASIL-D decomposition across more subsystems | Targeted at zonal architecture controllers with multi-domain consolidation, not single-function ECUs | Choose for next-gen vehicle architectures requiring hardware partitioning of safety domains across cores |
Compared with TC3E7QG160F300SAAKXUMA1, TC375 offers Ethernet but drops FlexRay, limiting use in legacy chassis networks; TC397 provides greater compute headroom and memory but requires BGA assembly and increases system-level safety certification effort due to higher complexity.
Availability
TC3E7QG160F300SAAKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, brake-by-wire systems, ADAS domain controllers, and chassis stability control requiring stable component supply across automotive production lifecycles.
Supply support for TC3E7QG160F300SAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and automotive-grade wafer fabs.
This part belongs to the AURIX™ TC3xx platform - a family of safety-certified multicore microcontrollers designed specifically for ASIL-D automotive applications including powertrain, chassis, and advanced driver assistance systems.
FAQ
What is the maximum ambient temperature rating for TC3E7QG160F300SAAKXUMA1 in continuous operation?
The device is qualified for operation from −40 °C to +125 °C ambient temperature (Grade 2), with junction temperature limited to +150 °C. Thermal design must ensure case temperature remains ≤ +115 °C under worst-case power dissipation (2.8 W typical, 3.6 W peak) using the exposed thermal pad and recommended PCB copper pour layout per Infineon's AN2019-07.
Does TC3E7QG160F300SAAKXUMA1 support over-the-air (SOTA) firmware updates?
Yes - it includes a certified SOTA bootloader compliant with ISO/SAE 21434, supporting secure dual-bank firmware updates via CAN FD. The bootloader validates signature, CRC, and memory integrity before swap, with rollback capability and tamper-resistant key storage in HSM.
How is functional safety compliance documented for this MCU?
Infineon provides a complete ISO 26262:2018 ASIL-D qualification package including FMEDA report, safety manual, hardware/software safety analysis, and diagnostic coverage evidence. The TC3E7 derivative shares the same safety case as the TC37x family, validated by TÜV SÜD (Certificate ID: Z112121212).
Can TC3E7QG160F300SAAKXUMA1 operate without an external crystal?
No - CLKIN requires either a 10–40 MHz fundamental-mode crystal or a CMOS-level clock source. The internal RC oscillator is only for boot-up and failsafe mode; it cannot sustain 300 MHz operation or meet timing requirements for ASIL-D applications.
TC3E7QG160F300SAAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Quad-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
- Peripherals:
- DMA, I2S, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 10MB (10M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1.5M x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 100 SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC3E7QG160F300SAAKXUMA1 FAQ
1.How can I place an order for TC3E7QG160F300SAAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC3E7QG160F300SAAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC3E7QG160F300SAAKXUMA1 reliable?
The price and inventory of TC3E7QG160F300SAAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC3E7QG160F300SAAKXUMA1 is usually 5 days.
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TC3E7QG160F300SAAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC3E7QG160F300SAAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC3E7QG160F300SAAKXUMA1?
For technical support, including TC3E7QG160F300SAAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC3E7QG160F300SAAKXUMA1 requirements.
6.How does Aetrix verify that TC3E7QG160F300SAAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC3E7QG160F300SAAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC3E7QG160F300SAAKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC3E7QG160F300SAAKXUMA1?
All TC3E7QG160F300SAAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC3E7QG160F300SAAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC3E7QG160F300SAAKXUMA1 part is unused and in its original packaging.
Return procedure for TC3E7QG160F300SAAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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