Infineon Technologies TD250N18KOFHPSA1

Overview

TD250N18KOFHPSA1 from Infineon Technologies is a phase-control thyristor module designed for high-power AC line switching in industrial power converters. It delivers 250 A average on-state current (TC = 85 °C), 1800 V repetitive peak off-state voltage (VDRM/VRRM), and 9100 A non-repetitive surge current (ITSM), with electrically insulated baseplate and pressure-contact silicon die construction. It is deployed in soft starters for three-phase induction motors.

For engineers reviewing the TD250N18KOFHPSA1 datasheet, TD250N18KOFHPSA1 pinout, TD250N18KOFHPSA1 application, or TD250N18KOFHPSA1 equivalent, key selection criteria include junction-to-case thermal resistance (0.124 K/W), gate trigger current (≤200 mA), critical dv/dt rating (1000 V/µs), and pre-applied TIM option for thermal interface reliability in high-cycle industrial drives.

Technical Context

This dual-thyristor module operates in phase-angle controlled rectification and AC power control topologies, supporting both two-pulse (B2) and six-pulse (B6) bridge configurations. Its pressure-contact die architecture enables robust thermal cycling performance and eliminates wire-bond fatigue failure modes common in high-current discrete packages.

The device features class-1 basic insulation (EN61140), 3.6 kV RMS insulation test voltage (1 sec), and a 125 °C maximum junction temperature. Gate triggering is optimized for standard pulse transformers or opto-triac drivers, with latching current ≤1200 mA and holding current ≤300 mA at 25 °C.

Key Specifications

Pinout & Package

TD250N18KOFHPSA1 uses an industry-standard press-pack module package with electrically insulated AlN ceramic baseplate (50 mm × 70 mm footprint). Mechanical mounting uses M1 screws (5 Nm torque); electrical terminals are M2 screw-type (12 Nm torque) with DIN 46244 A 2.8 × 0.8 mm cross-section.

Key Features

Applications

Availability

TD250N18KOFHPSA1 is available at Aetrix Electronics and suitable for soft starters, industrial rectifiers, crowbar protection circuits, and static power controllers requiring stable component supply and long-term industrial lifecycle support.

Supply support for TD250N18KOFHPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and industrial control solutions, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.

This part belongs to Infineon's high-power thyristor module product line, engineered for ruggedized AC power control in harsh industrial environments including motor drives, energy storage systems, and grid-tied equipment.

FAQ

What is the difference between TD250N18KOFHPSA1 and TT250N?

TD250N18KOFHPSA1 is the commercial-grade variant with pre-applied thermal interface material (TIM), while TT250N is the base version without TIM. The "HPSA1" suffix indicates Infineon's standard packaging with insulated baseplate, M2 terminal torque specification, and 1800 V VDRM rating. Both share identical electrical ratings and pressure-contact die construction.

Can TD250N18KOFHPSA1 be used in parallel configurations?

Yes - its matched dynamic characteristics (≤3 µs tgd variation, ≤10% V(TO) spread) and low-inductance press-pack structure support paralleling up to four units with external current-sharing reactors. Derating to 90% ITAVM per unit is recommended for thermal uniformity across modules operating above 85 °C case temperature.

What gate drive voltage is required for reliable triggering?

A minimum gate pulse of 12 V at ≥200 mA peak current is required for guaranteed turn-on at Tvj = 125 °C. Gate pulses must exceed 20 µs duration and maintain diG/dt ≥1 A/µs to ensure latching. Standard optocoupled triac drivers (e.g., MOC3063) with zero-crossing suppression are not suitable; dedicated phase-control gate drivers are required.

Does the pre-applied TIM require rework before heatsink mounting?

No - the TIM layer is factory-applied and fully cured, designed for direct mounting onto flat, clean, unlubricated aluminum or copper heatsinks. Surface roughness must be ≤1.6 µm Ra, and mounting pressure must be ≥0.5 MPa. No additional thermal paste or interface films should be added, as this degrades thermal performance and voids warranty.