Infineon Technologies TD570N18KOFHPSA1

Overview

TD570N18KOFHPSA1 from Infineon Technologies is a press-pack, double-sided cooled phase-control thyristor module rated for 1800 V repetitive peak off-state voltage (VDRM/VRRM), 566 A average on-state current (ITAVM) at TC = 85°C, and 20 kA non-repetitive surge current (ITSM). It features electrically insulated baseplate, pre-applied thermal interface material (TIM), and Advanced Medium Power Technology (AMPT) for high-reliability industrial power control in soft starters and UPS rectifiers.

For engineers reviewing the TD570N18KOFHPSA1 datasheet, TD570N18KOFHPSA1 pinout, TD570N18KOFHPSA1 application, or TD570N18KOFHPSA1 equivalent, key selection criteria include junction-to-case thermal resistance (0.055 K/W), threshold voltage (0.8 V), slope resistance (0.3 mΩ), critical dv/dt rating (1000 V/µs), and gate trigger current (≤250 mA) under drive and crowbar conditions.

Technical Context

This double-arm thyristor module implements pressure-contact die attachment for low-inductance, high-current conduction paths and thermally robust junction-to-case heat transfer. Its dual-gate configuration supports independent triggering of each arm, enabling full-wave phase-controlled rectification and static switching with precise firing-angle control.

The device operates with a maximum junction temperature of 125°C and requires forced-cooled heatsinking due to its 0.055 K/W RthJC (per module, DC) and 0.02 K/W RthCH (per arm). Its 19 mm creepage distance and 3.6 kV insulation test voltage (1 sec) meet IEC61140 Class 1 basic insulation requirements for industrial mains-connected equipment.

Key Specifications

Pinout & Package

TD570N18KOFHPSA1 uses a press-pack industrial module package with isolated copper baseplate (60 mm × 60 mm footprint), two main AC terminals (T1/T2 per arm), two gate terminals (G1/K1 and G2/K2), and mechanical mounting holes compliant with DIN 46244 A (2.8 × 0.8 mm control terminal profile). The module has no PCB pins; all connections are via M2 torque screws (12 Nm ±10%) for power and M1 screws (6 Nm ±15%) for gate leads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar phase-control thyristor module applications.

Compared with TT570N18KOF and TD570N16KOFHPSA1, TD570N18KOFHPSA1 uniquely combines 1800 V blocking, electrically isolated baseplate, and factory-applied TIM-enabling faster time-to-production, higher safety compliance, and improved thermal repeatability in mission-critical industrial power systems.

Availability

TD570N18KOFHPSA1 is available at Aetrix Electronics and suitable for soft starters, UPS rectifiers, crowbar protection circuits, and static switches requiring stable component supply across multi-year industrial equipment lifecycles.

Supply support for TD570N18KOFHPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for automotive, industrial, and energy markets.

This part belongs to Infineon's High-Power Thyristor Module product line, engineered specifically for ruggedized, high-current phase-control applications in industrial motor drives, power conditioning, and grid-tied energy systems.

FAQ

What is the maximum allowable case temperature for continuous operation?

The maximum allowable case temperature (TC) is +125°C, as defined by the device's thermal design limit. At this temperature, the average on-state current must be derated to 566 A per arm. Operation above this temperature risks irreversible junction damage and violates the 125°C Tvj max specification, even with adequate heatsinking.

Can TD570N18KOFHPSA1 be used in parallel configurations?

Yes, but only with strict dynamic current-sharing measures: matched gate drive timing (≤1 µs skew), symmetrical busbar layout, and individual snubbers. The module's 200 A/µs di/dt rating and pressure-contact construction support parallel operation, but unbalanced sharing may cause thermal runaway due to positive temperature coefficient of on-state voltage.

Does the pre-applied TIM require additional thermal grease?

No. The factory-applied thermal interface material is fully cured and optimized for direct mounting to flat, clean aluminum or copper heatsinks. Adding extra grease degrades interfacial contact, increases thermal resistance, and voids the module's thermal performance guarantee. Surface roughness must be ≤1.6 µm Ra for optimal bondline integrity.

What is the recommended gate drive circuit for reliable turn-on?

A gate drive delivering ≥1 A peak current with ≥1 A/µs di/dt and ≤2 V open-circuit voltage is required. Use a pulse transformer or isolated gate driver (e.g., Infineon 1ED020I12-F2) with 1–2 µs pulse width and 10–20 mA holding current. Avoid RC-triggered circuits due to insufficient di/dt for latching at high junction temperatures.