Infineon Technologies TDB6HK180N22RRPB11BPSA1

Overview

TDB6HK180N22RRPB11BPSA1 from Infineon is a 6-device EconoPACK™2 power module integrating two 1700 V / 100 A IGBTs (brake-chopper), two 1700 V / 50 A fast recovery diodes (brake-chopper), one 2200 V / 150 A RMS thyristor (rectifier), and one 2200 V / 150 A RMS rectifier diode - configured for half-controlled B6-bridge operation in industrial active rectification systems operating up to 125 °C baseplate temperature.

For engineers reviewing the TDB6HK180N22RRPB11BPSA1 datasheet, TDB6HK180N22RRPB11BPSA1 pinout, TDB6HK180N22RRPB11BPSA1 application, or TDB6HK180N22RRPB11BPSA1 equivalent, key selection criteria include validated junction-to-heatsink thermal resistance (0.445 K/W per IGBT), pre-applied TIM compatibility, PressFIT contact reliability, and IEC 60747/60749 qualification for industrial environments.

Technical Context

This module implements a half-controlled six-pulse bridge topology where the thyristor pair enables phase-controlled AC-to-DC conversion while the IGBT-diode brake-chopper pair handles regenerative energy dissipation. Gate drive requirements differ across devices: thyristors require pulsed gate triggers (I_GT = 70 mA, V_GT = 1.5 V), whereas IGBTs demand ±20 V-rated gate drivers with 0.91 Ω external gate resistors for specified switching timing.

Thermal management is unified via an Al₂O₃ substrate and IFX pre-applied Thermal Interface Material, enabling simultaneous thermal resistance values of 0.445 K/W (IGBT), 0.879 K/W (brake diode), 0.592 K/W (thyristor), and 0.548 K/W (rectifier diode) to a common heatsink - all validated under 125 °C baseplate operation with 3–6 Nm M5 mounting torque.

Key Specifications

Pinout & Package

EconoPACK™2 package: 32 mm × 90 mm footprint, Cu baseplate, Al₂O₃ ceramic substrate, PressFIT solderless terminals, RoHS-compliant, weight 180 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-controlled rectifier and brake-chopper applications.

Compared with FZ1200R17KE3 and FF600R17ME4, TDB6HK180N22RRPB11BPSA1 uniquely integrates thyristor-based phase control and IGBT-based regeneration in one thermally balanced module - eliminating inter-device thermal drift and reducing PCB area by 65% versus discrete solutions.

Availability

TDB6HK180N22RRPB11BPSA1 is available at Aetrix Electronics and suitable for active rectifier systems, regenerative braking drives, medium-voltage UPS inputs, and grid-tied energy storage converters requiring stable component supply across multi-year industrial equipment lifecycles.

Supply support for TDB6HK180N22RRPB11BPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and security solutions for industrial, automotive, and renewable energy markets.

This part belongs to Infineon's EconoPACK™2 power module product line, designed specifically for cost-optimized, thermally robust half-controlled converter stages in industrial motor drives and energy conversion systems.

FAQ

What is the maximum allowable heatsink temperature for continuous operation?

The module is qualified for continuous operation with a maximum baseplate temperature (T_BPmax) of 125 °C. This corresponds to a heatsink temperature ≤125 °C when using the IFX pre-applied TIM and proper mounting torque (3–6 Nm on M5 screws). Exceeding this limit risks accelerated aging of the Al₂O₃ substrate and reduced short-circuit withstand time.

Can the thyristor and IGBT sections be driven from the same gate driver IC?

No - thyristors require low-energy, single-pulse gate triggers (70 mA, 1.5 V, 2 µs delay), while IGBTs need continuous ±20 V-rated drivers with 0.91 Ω external gate resistors for controlled dv/dt. Mixing drive schemes risks misfiring thyristors or incomplete IGBT turn-on; separate isolated gate driver channels are mandatory.

Is PressFIT mounting compatible with standard aluminum heatsinks?

Yes - PressFIT pins are designed for direct insertion into machined copper or aluminum heatsinks with compliant M5 threaded inserts or press-fit receptacles. The 3–6 Nm torque specification ensures mechanical retention without solder or thermal epoxy, but surface flatness must be ≤30 µm and hardness ≥60 HB to prevent pin deformation during installation.

Does the pre-applied TIM remain effective after multiple thermal cycles?

Yes - the IFX TIM is qualified for ≥1000 thermal cycles between −40 °C and 125 °C per IEC 60068-2-14. Its silicone-based formulation maintains adhesion and thermal conductivity (≥1.5 W/m·K) without pump-out or dry-out, provided mounting torque remains within 3–6 Nm and no lateral shear forces are applied to the module during operation.