Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies TLE6251DXUMA1

Part No.:
TLE6251DXUMA1
Manufacturer:
Infineon Technologies
Category:
Drivers, Receivers, Transceivers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixTLE6251DXUMA1.pdf
Description:
IC TRANSCEIVER FULL 1/1 PGDSO816
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,980

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TLE6251DXUMA1 from Infineon is a high-speed CAN transceiver compliant with ISO 11898-2/-5, serving as the physical-layer interface between CAN controllers and differential bus lines. It supports data rates up to 1 Mbps, features bus wake-up detection via RxD signal change, operates across extended VCC (4.5–27 V) and VIO (3.0–5.5 V) supply ranges, and delivers <10 µA quiescent current in stand-by mode. It is deployed in automotive gateway modules requiring robust ESD immunity (±8 kV HBM), low EME, and fail-safe operation under load dump.

For engineers reviewing the TLE6251DXUMA1 datasheet, TLE6251DXUMA1 pinout, TLE6251DXUMA1 application, or TLE6251DXUMA1 equivalent, this page provides verified functional context, validated pin roles, confirmed automotive-grade operating parameters, and real-world use cases in mixed-supply CAN networks - all grounded in Infineon's AEC-Q100-qualified specification Rev. 1.11 (2019).

Technical Context

The TLE6251DXUMA1 implements a dual-mode architecture: normal-operating mode enables full-duplex HS-CAN communication with controlled slew-rate outputs on CANH/CANL, while stand-by mode disables VCC supply path but retains wake-up capability via low-leakage receiver monitoring of bus transitions. Its internal logic uses VIO-referenced thresholds for TxD/RxD/STB, enabling interoperability with both 3.3 V and 5 V microcontrollers without level-shifting circuitry.

Fail-safe functions include TxD time-out (prevents bus lock-up during controller fault), overtemperature shutdown (>150 °C), short-circuit protection on CANH/CANL to ground/battery/VCC, and undervoltage detection on VCC and VIO. The device achieves ±8 kV ESD immunity per IEC 61000-4-2 and meets stringent automotive EMI/EME requirements through symmetrical driver design and Smart Power Technology (SPT) integration.

Key Specifications

Parameter Value and Actual Design Meaning
Bus Data Rate Up to 1 Mbps - supports real-time control in high-bandwidth automotive networks like powertrain and ADAS domains.
Supply Voltage (VCC) 4.5 V to 27 V - accommodates wide battery voltage range including cold-crank (4.5 V) and load-dump (27 V) conditions.
Digital Supply (VIO) 3.0 V to 5.5 V - adapts logic-level thresholds to match MCU I/O rails without external translators.
Stand-by Current <10 µA - enables ultra-low-power sleep states in always-on ECUs such as body control modules.
Common-Mode Range −27 V to +40 V - ensures reliable operation under severe electromagnetic interference and ground offset in vehicle harnesses.
ESD Immunity ±8 kV HBM - protects against human-body-model electrostatic discharge during assembly and service.
Operating Temperature −40 °C to +150 °C - qualified per AEC-Q100 Grade 0 for under-hood and transmission-control applications.

Pinout & Package

Package: PG-DSO-8 (RoHS-compliant, exposed thermal pad, 150 °C max junction temperature).

Pin/Terminal Circuit Role Design Meaning
1 TxD Transmit data input CMOS-compatible input with internal VIO-referenced pull-up; dominant state = low; controls bus differential output.
2 GND Ground reference Primary analog/digital return path; decoupling capacitor required at VCC and VIO pins.
3 VCC Transceiver power supply Can be powered down in stand-by mode; requires 100 nF ceramic decoupling to GND.
4 RxD Receive data output CMOS-compatible output referenced to VIO; dominant state = low; used for wake-up detection in stand-by.
5 VIO Digital I/O supply Sets logic thresholds for TxD, RxD, STB; must be connected to MCU I/O rail (3.3 V or 5 V).
6 CANL CAN bus low terminal Differential bus I/O; "low" during dominant state; short-circuit protected to ground, battery, and VCC.
7 CANH CAN bus high terminal Differential bus I/O; "high" during dominant state; matched slew rate with CANL for low EME.
8 STB Stand-by mode control Active-low input with internal VIO-referenced pull-up; drives device into stand-by when high.

Key Features

Feature Design Value
Bus wake-up detection Enabled in stand-by mode via RxD signal transition - eliminates need for external wake-up circuitry in always-on gateways.
VIO voltage adaptation Supports 3.3 V and 5 V MCUs without level shifters - simplifies board layout and reduces BOM count in mixed-voltage ECUs.
TxD time-out function Automatically forces recessive bus state after ~1.5 ms of continuous dominant TxD - prevents bus lock-up during MCU hang/fault.
Power-down bus leakage <1 µA on CANH/CANL - ensures passive behavior and network integrity in partially-supplied CAN topologies.
Overtemperature protection Thermal shutdown at >150 °C with automatic recovery - maintains reliability in high-ambient under-hood environments.

Applications

Gateway Modules Body Control Modules (BCMs)

Use Scenario: Centralized communication hub linking powertrain, chassis, and infotainment domains over multi-speed CAN FD and legacy CAN buses.

IC Role / Device Role / Timing Role: Physical-layer transceiver handling HS-CAN traffic between microcontroller and twisted-pair bus, with wake-up arbitration and voltage-adapted logic interfacing.

Use Value: Enables selective node wake-up without waking entire network; VIO flexibility allows single PCB design across 3.3 V and 5 V MCU platforms.

Use Scenario: Distributed control unit managing door locks, lighting, HVAC, and window motors in modern vehicle architectures.

IC Role / Device Role / Timing Role: Robust CAN interface ensuring uninterrupted communication during battery voltage fluctuations and EMI exposure near motors/relays.

Use Value: ±27 V common-mode range and ±8 kV ESD immunity prevent false resets or latch-up in electrically noisy cabin environments.

Electric Power Steering (EPS) Battery Management Systems (BMS)

Use Scenario: Real-time torque feedback loop between steering angle sensor, EPS ECU, and motor driver via HS-CAN.

IC Role / Device Role / Timing Role: Low-latency, fail-safe transceiver supporting deterministic 500 kbps–1 Mbps messaging with TxD time-out and overtemperature shutdown.

Use Value: Slew-rate-controlled CANH/CANL outputs minimize radiated emissions critical for ASIL-B functional safety compliance.

Use Scenario: Cell monitoring and pack-level communication between BMS master and slave boards in 48 V mild-hybrid or EV traction batteries.

IC Role / Device Role / Timing Role: High-immunity transceiver operating across wide temperature (-40 °C to +105 °C ambient) and supply (4.5–27 V) ranges.

Use Value: Stand-by current <10 µA extends sleep-mode battery life; CAN short-circuit protection safeguards against cell-level fault propagation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed CAN transceiver applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP TJA1042T/3 Lower stand-by current (3 µA), no VIO pin - logic levels fixed to VCC; lacks RxD-based wake-up detection. Preferred in cost-sensitive, single-rail 5 V systems where MCU voltage matching is not required. Select when lowest possible quiescent current is prioritized and VIO adaptability is unnecessary.
ST TLE6250G Legacy pinout (SO-8), no STB pin - stand-by triggered only by VCC removal; lacks TxD time-out and VIO flexibility. Suitable for retrofit designs using older PCB footprints and simpler wake-up schemes. Choose only for backward compatibility with existing TLE6250-based layouts and non-wake-up-critical nodes.

Compared with NXP TJA1042T/3 and ST TLE6250G, the TLE6251DXUMA1 uniquely combines VIO-adaptive logic, RxD-triggered wake-up, and integrated TxD time-out - making it optimal for new-generation automotive ECUs demanding mixed-supply support, fail-safe autonomy, and AEC-Q100 Grade 0 operation.

Availability

TLE6251DXUMA1 is available at Aetrix Electronics and suitable for gateway modules, body control modules, electric power steering units, and battery management systems requiring stable component supply, automotive qualification, and long-term lifecycle support.

Supply support for TLE6251DXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.

The TLE6251DXUMA1 belongs to Infineon's automotive transceiver product line, engineered specifically for robust, fail-safe CAN communication in harsh vehicle environments - emphasizing electromagnetic compatibility, thermal resilience, and functional safety readiness.

FAQ

What is the purpose of the VIO pin on the TLE6251DXUMA1?

The VIO pin supplies the digital I/O interface and sets logic thresholds for TxD, RxD, and STB pins. It enables direct compatibility with 3.3 V or 5 V microcontrollers without external level shifters. A 100 nF decoupling capacitor to GND is mandatory, and VIO must remain powered during stand-by mode to maintain wake-up functionality.

How does the TLE6251DXUMA1 achieve bus wake-up in stand-by mode?

In stand-by mode, the TLE6251DXUMA1 disables its main transmitter but keeps a low-power receiver active. Wake-up is triggered by a signal transition on the RxD output - reflecting a dominant-to-recessive or recessive-to-dominant change on the CAN bus - which asserts an interrupt to the connected microcontroller via RxD.

Does the TLE6251DXUMA1 support partial networking or mixed-supply CAN topologies?

Yes. The device supports partially-supplied networks via ultra-low CANH/CANL leakage current (<1 µA) in power-down state and high-impedance receiver inputs. This ensures non-intrusive bus behavior when some nodes are unpowered, preserving communication integrity across heterogeneous ECU supply configurations.

What protection features prevent damage during automotive transients?

The TLE6251DXUMA1 integrates protection against load dump (up to +27 V on VCC), reverse battery (−27 V on CANH/CANL), ESD (±8 kV HBM), and short circuits on CANH/CANL to ground, battery, or VCC. Overtemperature shutdown (>150 °C) and undervoltage lockout on VCC/VIO further ensure safe operation under fault conditions.

TLE6251DXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
200 mV
Data Rate:
1MBd
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 150°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-DSO-8-16

TLE6251DXUMA1 FAQ

1.How can I place an order for TLE6251DXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TLE6251DXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLE6251DXUMA1 reliable?

The price and inventory of TLE6251DXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE6251DXUMA1 is usually 5 days.

3.What payment methods are accepted for TLE6251DXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE6251DXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLE6251DXUMA1?

TLE6251DXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLE6251DXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLE6251DXUMA1?

For technical support, including TLE6251DXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE6251DXUMA1 requirements.

6.How does Aetrix verify that TLE6251DXUMA1 is sourced from the original manufacturer or authorized distributors?

All TLE6251DXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE6251DXUMA1 meets industry standards.

7.What is the process for return or replacement of TLE6251DXUMA1?

All TLE6251DXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE6251DXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLE6251DXUMA1 part is unused and in its original packaging.

Return procedure for TLE6251DXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TLE6251DXUMA1 Tags

  • TLE6251DXUMA1
  • TLE6251DXUMA1 PDF
  • TLE6251DXUMA1 Datasheet
  • TLE6251DXUMA1 Specifications
  • TLE6251DXUMA1 Images
  • Infineon Technologies
  • Infineon Technologies TLE6251DXUMA1
  • Buy TLE6251DXUMA1
  • TLE6251DXUMA1 Price
  • TLE6251DXUMA1 Distributor
  • TLE6251DXUMA1 Supplier
  • TLE6251DXUMA1 Wholesale
Related Products
ATA6561-GAQW-N
ATA6561-GAQW-N

Microchip Technology

ATA6561-GBQW-N
ATA6561-GBQW-N

Microchip Technology

AM26LS32ACDR
AM26LS32ACDR

Texas Instruments

SP485CN-L/TR
SP485CN-L/TR

MaxLinear, Inc.

SP485EN-L/TR
SP485EN-L/TR

MaxLinear, Inc.

SP485EEN-L/TR
SP485EEN-L/TR

MaxLinear, Inc.

SP485ECN-L/TR
SP485ECN-L/TR

MaxLinear, Inc.

THVD1400DR
THVD1400DR

Texas Instruments

AM26C31IDR
AM26C31IDR

Texas Instruments

TLIN1021ADRQ1
TLIN1021ADRQ1

Texas Instruments

MAX232IDR
MAX232IDR

Texas Instruments

AM26C32IDR
AM26C32IDR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER