Infineon Technologies TLE7257SJXUMA1

Overview

TLE7257SJXUMA1 from Infineon Technologies is an AEC-Q100 qualified automotive LIN transceiver in PG-DSO-8 package, compliant with ISO 17987-4 and LIN 2.2A, supporting up to 20 kbps data rate, featuring integrated wake-up capability, <10 µA sleep current, and 3.3 V/5 V logic compatibility for microcontroller interfacing in body electronics networks.

For engineers reviewing the TLE7257SJXUMA1 datasheet, TLE7257SJXUMA1 pinout, TLE7257SJXUMA1 application, or TLE7257SJXUMA1 equivalent, key selection criteria include bus wake-up sensitivity, dominant time-out protection, BUS short-to-battery immunity, thermal shutdown behavior, and compatibility with partial-network supply architectures.

Technical Context

The TLE7257SJXUMA1 implements a single-wire LIN physical layer interface with bidirectional signal conversion between microcontroller UART-level signals (TxD/RxD) and the LIN bus, using slew-rate-controlled driver output and RC-filtered receiver input to meet stringent automotive EMC requirements (ISO 7637-2 transient robustness, ±10 kV IEC61000-4-2 ESD).

Its three-mode operation-Normal (EN=high), Standby (EN=low, INH=high), and Sleep (EN=low, INH=high-impedance)-is managed via EN pin control and internally monitored supply voltage (VS undervoltage detection) and die temperature (over-temperature protection), enabling system-level power management of external regulators via the INH output.

Key Specifications

Pinout & Package

Package: PG-DSO-8 (RoHS-compliant, lead-free, surface-mount SOIC-8 variant with exposed thermal pad not present in this variant).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LIN transceiver applications.

Compared with TLIN1029DRBR and ATA663211-GAQW, the TLE7257SJXUMA1 uniquely combines INH-driven power coordination, PG-DSO-8 manufacturability, and full 3.3 V/5 V logic support-making it optimal for cost-sensitive, thermally demanding body electronics where system-level power architecture matters.

Availability

TLE7257SJXUMA1 is available at Aetrix Electronics and suitable for body control modules, door modules, seat control units, and roof modules requiring stable component supply across automotive production lifecycles.

Supply support for TLE7257SJXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in automotive, power management, and security solutions, with global R&D and manufacturing infrastructure.

The TLE7257 belongs to Infineon's automotive LIN transceiver product line, engineered specifically for robust, low-power, single-wire communication in harsh vehicle environments-targeting body electronics, comfort systems, and distributed sensor networks.

FAQ

What LIN protocol versions does TLE7257SJXUMA1 support?

The TLE7257SJXUMA1 supports LIN 2.2A and ISO 17987-4 specifications, including all mandatory electrical characteristics, timing parameters, and fault-handling behaviors defined therein. It operates at standard LIN baud rates up to 20 kbps and maintains backward compatibility with LIN 1.x slave node implementations through its recessive/dominant voltage thresholds and bus wake-up sensitivity.

How does the INH output function in system power management?

The INH output is an open-drain, battery-referenced signal active high in Normal and Standby modes. It can directly drive the enable pin of external LDOs or PMICs, allowing the transceiver to coordinate power-up/down sequencing of the MCU and peripherals. When EN is pulled low, INH goes high-impedance, disabling downstream regulators and reducing system standby current.

Is external termination required for TLE7257SJXUMA1 in slave node configuration?

No external termination is required for slave node use: the TLE7257SJXUMA1 integrates a 30 kΩ internal pull-up on the BUS pin. For master node implementation, however, a 1 kΩ resistor and clamping diode between BUS and V_S must be added externally to meet LIN specification master termination requirements and ensure proper header detection.

What is the role of the N.C. pin (Pin 3) in PG-DSO-8 package?

Pin 3 is internally unconnected and must remain electrically floating-neither tied to GND nor V_S. This pin exists for mechanical symmetry and package compatibility with other Infineon devices but carries no electrical function. PCB layout should avoid routing traces or placing vias beneath this pad to prevent unintended coupling or solder bridging.