My Inquiry
My Account
Infineon Technologies TLE7258LEXUMA1
- Part No.:
- TLE7258LEXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Drivers, Receivers, Transceivers
- Package:
- 8-TDFN Exposed Pad
- Datasheet:
-
TLE7258LEXUMA1.pdf
- Description:
- IC TRANSCEIVER 1/1 PGTSON81
- Quantity:
- Payment:
- Shipping:
Inventory:4,641
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLE7258LEXUMA1 from Infineon is a single-wire LIN transceiver compliant with ISO 17987-4, LIN 2.2A, and SAE J2602, supporting data rates up to 20 kbps. It serves as the physical layer interface between microcontrollers and automotive LIN buses, featuring integrated wake-up detection, dominant time-out protection on TxD, BUS short-to-VBAT/GND handling, and AEC-Q100 qualification for under-hood use in rain sensors and window lifters.
For engineers reviewing the TLE7258LEXUMA1 datasheet, TLE7258LEXUMA1 pinout, TLE7258LEXUMA1 application, or TLE7258LEXUMA1 equivalent, key selection considerations include sleep-mode current (<10 µA), ±10 kV ESD robustness per IEC61000-4-2, 3.3 V/5 V logic compatibility, BUS leakage current <1 µA, and PG-TSON-8 package suitability for AOI inspection.
Technical Context
The TLE7258LEXUMA1 implements a BiCMOS-based LIN physical layer with integrated receiver filter network for noise suppression and optimized transmitter slew rate control to minimize electromagnetic emissions across battery voltage ranges. Its wake-up circuit monitors RxD for bus activity while in sleep mode, triggering transition to standby upon detection.
Three distinct operating modes-normal, standby, and sleep-are controlled via the EN pin, with INH output enabling external regulator control. The transceiver supports master-node configuration using external 1 kΩ termination and diode, and includes overtemperature shutdown and VS undervoltage detection with hysteresis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Bus Data Rate | Up to 20 kbps - Enables full compliance with LIN 2.2A timing budgets for slave node communication. |
| Sleep Current | Typ. 8 µA - Allows sustained network monitoring in battery-critical applications like parking aid modules. |
| ESD Robustness | ±10 kV HBM (IEC61000-4-2) - Ensures reliability during vehicle assembly and service without additional protection circuitry. |
| BUS Leakage | <1 µA - Permits use in partially powered LIN networks where bus remains active while nodes are asleep. |
| Logic Compatibility | 3.3 V and 5 V microcontroller I/O - Eliminates level-shifting requirements for mixed-voltage ECUs. |
| Supply Range | 5.5 V to 27 V - Covers cold-crank (5.5 V) to load-dump (27 V) conditions in 12 V automotive systems. |
| Thermal Shutdown | 165 °C activation - Protects against latch-up or thermal runaway during prolonged bus fault conditions. |
Pinout & Package
Package: PG-TSON-8 (leadless, thermally enhanced), RoHS-compliant, qualified for automated optical inspection (AOI). PAD1 connects to PCB heat sink area (GND only).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RxD | Receive data output | Open-drain output requiring external pull-up; signals dominant/recessive bus state to MCU; indicates wake-up event in standby mode. |
| EN | Enable input | Active-high control for mode selection; internal pull-down ensures default sleep mode at power-up. |
| N.C. | No connect | Unbonded pin - must remain unconnected per design; no routing or soldering required. |
| TxD | Transmit data input | CMOS input with internal pull-up; dominant time-out prevents bus lock-up if MCU fails to release low state. |
| GND | Ground reference | Primary return path for VS supply and BUS driver; must be low-inductance connection to minimize EMC coupling. |
| BUS | Single-wire LIN bus interface | Integrated slave termination; handles bidirectional signaling with ±10 kV ESD protection and short-to-VBAT/GND recovery. |
| Vs | Battery supply input | Accepts 5.5–27 V; requires 100 nF ceramic decoupling capacitor placed ≤3 mm from pin to suppress transients. |
| INH | Inhibit output | Open-drain, battery-referenced output active in normal/standby modes; controls external LDO enable for system power sequencing. |
Key Features
| Feature | Design Value |
|---|---|
| Dominant time-out on TxD | Prevents indefinite bus dominance if MCU firmware hangs; auto-resets after timeout to restore bus arbitration. |
| Wake-up capable sleep mode | Draws <10 µA while detecting LIN bus edges on RxD - enables zero-power network monitoring until wake event. |
| Integrated BUS termination | Eliminates need for external 30 kΩ slave resistor; reduces BOM count and PCB footprint in space-constrained modules. |
| High EMC immunity/emission performance | Meets CISPR 25 Class 5 emission limits and ISO 11452-4 immunity without ferrite beads or shielding. |
| Overtemperature and undervoltage protection | Shuts down transmitter and asserts INH low on fault; resumes operation automatically after recovery with hysteresis. |
Applications
| Rain and Light Sensor Module | Window Lifter Control Unit |
|---|---|
|
Use Scenario: Integrated cabin sensor cluster communicating LIN status (wiper speed, headlight on/off) to body control module. IC Role / Device Role / Timing Role: LIN slave transceiver providing physical layer interface between 3.3 V MCU and shared vehicle LIN bus. Use Value: Low sleep current extends battery life during vehicle off-state; ±10 kV ESD withstands assembly handling and environmental exposure. |
Use Scenario: Motor-driven window lift mechanism with position feedback and anti-pinch logic. IC Role / Device Role / Timing Role: Bus driver translating MCU commands into LIN-compliant bus signals for master coordination. Use Value: Dominant time-out prevents bus lock during MCU reset; BUS short-to-VBAT protection avoids fuse blow during wiring faults. |
| Parking Aid System Node | Seat Position Memory Module |
|
Use Scenario: Ultrasonic sensor node reporting proximity data via LIN to central display unit. IC Role / Device Role / Timing Role: Low-emission transceiver ensuring minimal interference with RF receivers in rear bumper. Use Value: Optimized slew rate and integrated filtering meet strict CISPR 25 radiated emission limits for Class 5 systems. |
Use Scenario: Memory retention module storing seat position settings and transmitting via LIN on ignition cycle. IC Role / Device Role / Timing Role: Wake-up enabled slave device responding to master query only when bus traffic detected. Use Value: Sub-10 µA sleep current prevents parasitic drain on 12 V battery during extended vehicle storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LIN transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLIN1029DR | Higher 100 kbps max data rate; lower 3 µA sleep current; no integrated BUS termination. | Targeted at high-speed diagnostics or multi-master LIN clusters; requires external 30 kΩ termination resistor. | Select when >20 kbps bandwidth or ultra-low sleep current is mandatory; verify external termination layout. |
| ATA663211-GAQW | Integrated voltage regulator (5 V); higher 15 µA sleep current; same 20 kbps limit and PG-TSON-8 package. | Reduces external BOM count for 5 V MCU supply; less suitable for partial-network sleep due to higher quiescent draw. | Choose when co-located 5 V regulation is needed and sleep current budget allows ≥15 µA. |
Compared with TLIN1029DR and ATA663211-GAQW, the TLE7258LEXUMA1 offers balanced trade-offs: integrated termination simplifies layout, 8 µA sleep current supports long-term battery monitoring, and its proven AEC-Q100 qualification streamlines automotive qualification cycles.
Availability
TLE7258LEXUMA1 is available at Aetrix Electronics and suitable for rain/light sensors, window lifters, parking aid systems, and seat memory modules requiring stable component supply across automotive production lifecycles.
Supply support for TLE7258LEXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in automotive, power management, and security ICs, with global manufacturing and qualification infrastructure.
The TLE7258 belongs to Infineon's automotive LIN transceiver product line, engineered specifically for robust, low-power slave-node communication in harsh vehicle environments including engine bay and door modules.
FAQ
What is the function of the INH pin on the TLE7258LEXUMA1?
The INH (Inhibit) pin is an open-drain, battery-referenced output that goes active-high in normal and standby modes. It is designed to control external voltage regulators or power switches, enabling coordinated power sequencing. During sleep mode, INH enters high-impedance state to isolate downstream circuitry and minimize system-level leakage.
Does the TLE7258LEXUMA1 require an external pull-up resistor on the RxD pin?
Yes - the RxD pin is open-drain and requires an external pull-up resistor to the microcontroller's I/O supply rail (3.3 V or 5 V). Typical value is 10 kΩ to 30 kΩ. This resistor establishes the recessive logic high level and enables wake-up detection by pulling RxD high after power-up or bus activity.
Can the TLE7258LEXUMA1 be used in a LIN master node configuration?
Yes, but requires external components: a 1 kΩ termination resistor and a diode connected between BUS and Vs. The transceiver itself is optimized for slave operation; master functionality relies on this external network to meet LIN specification bus impedance and voltage clamping requirements.
How does the dominant time-out feature protect the LIN bus?
The dominant time-out monitors TxD input duration: if held low beyond ~20 ms, the transmitter automatically disables to force bus release. This prevents a failed MCU from locking the bus in dominant state, preserving arbitration integrity and allowing other nodes to communicate - critical for fail-operational safety in body electronics.
TLE7258LEXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 8-TDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Transceiver
- Protocol:
- LINbus
- Number of Drivers/Receivers:
- 1/1
- Duplex:
- -
- Receiver Hysteresis:
- 120 mV
- Data Rate:
- 20kbps
- Voltage - Supply:
- 5.5V ~ 18V
- Operating Temperature:
- -40°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- PG-TSON-8-1
TLE7258LEXUMA1 FAQ
1.How can I place an order for TLE7258LEXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE7258LEXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE7258LEXUMA1 reliable?
The price and inventory of TLE7258LEXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE7258LEXUMA1 is usually 5 days.
3.What payment methods are accepted for TLE7258LEXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE7258LEXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE7258LEXUMA1?
TLE7258LEXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE7258LEXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE7258LEXUMA1?
For technical support, including TLE7258LEXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE7258LEXUMA1 requirements.
6.How does Aetrix verify that TLE7258LEXUMA1 is sourced from the original manufacturer or authorized distributors?
All TLE7258LEXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE7258LEXUMA1 meets industry standards.
7.What is the process for return or replacement of TLE7258LEXUMA1?
All TLE7258LEXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE7258LEXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE7258LEXUMA1 part is unused and in its original packaging.
Return procedure for TLE7258LEXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLE7258LEXUMA1 Tags
-
ATA6561-GAQW-N
Microchip Technology
-
ATA6561-GBQW-N
Microchip Technology
-
AM26LS32ACDR
Texas Instruments
-
SP485CN-L/TR
MaxLinear, Inc.
-
SP485EN-L/TR
MaxLinear, Inc.
-
SP485EEN-L/TR
MaxLinear, Inc.
-
SP485ECN-L/TR
MaxLinear, Inc.
-
THVD1400DR
Texas Instruments
-
AM26C31IDR
Texas Instruments
-
TLIN1021ADRQ1
Texas Instruments
-
MAX232IDR
Texas Instruments
-
AM26C32IDR
Texas Instruments
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
