Infineon Technologies TLE9251LEXUMA1
- Part No.:
- TLE9251LEXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Drivers, Receivers, Transceivers
- Package:
- 8-TDFN Exposed Pad
- Datasheet:
-
TLE9251LEXUMA1.pdf
- Description:
- IC TRANSCEIVER HALF 1/1 PGTSON81
- Quantity:
- Payment:

- Shipping:

Inventory:4,994
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLE9251LEXUMA1 from Infineon is a high-speed CAN FD transceiver compliant with ISO 11898-2:2016 and SAE J2284-4/-5, serving as the physical layer interface between HS CAN protocol controllers and automotive bus networks. It supports data rates up to 5 MBit/s, features guaranteed loop delay symmetry, ±10 kV HBM ESD robustness, and operates across 4.5–5.5 V supply with <10 µA standby current. Used in body control modules and gateway units requiring AEC-Q100-qualified communication interfaces.
For engineers reviewing the TLE9251LEXUMA1 datasheet, TLE9251LEXUMA1 pinout, TLE9251LEXUMA1 application, or TLE9251LEXUMA1 equivalent, key selection criteria include CAN FD timing symmetry, bus wake-up capability via RxD, thermal shutdown at 170–190 °C, and PG-TSON-8 package compatibility with AOI inspection.
Technical Context
The TLE9251LEXUMA1 implements dual-receiver architecture-normal-mode and low-power receiver-with dedicated wake-up logic that asserts dominant RxD on bus activity during standby. Its transmitter uses symmetric drive circuitry to minimize differential skew, enabling reliable CAN FD frame transmission up to 5 MBit/s without external common mode chokes.
Fail-safe operation includes TxD time-out (prevents bus lock), overtemperature protection with 10 K hysteresis, and short-circuit proofing to battery, ground, and VCC. Bus biasing is internal; no external termination resistors required for basic operation, and N.C. pins are electrically isolated.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Bus Data Rate | Up to 5 MBit/s - enables CAN FD fast-phase communication in automotive domain controllers. |
| Supply Voltage Range | 4.5–5.5 V - compatible with standard automotive 5 V rail; extended range improves system-level voltage tolerance. |
| Standby Current | <10 µA typical - allows persistent bus monitoring with negligible power impact in always-on vehicle networks. |
| ESD Robustness | ±10 kV HBM on CANH/CANL - eliminates need for external TVS diodes in most ECU designs. |
| Common Mode Range | −40 to +40 V - ensures reliable operation under load dump and battery reversal conditions per ISO 7637. |
| Thermal Shutdown | 170–190 °C activation - protects against latch-up during sustained overcurrent or ambient overheating. |
| Loop Delay Symmetry | Guaranteed - ensures matched propagation for CANH/CANL edges, critical for FD bit timing integrity. |
Pinout & Package
Package: PG-TSON-8 (leadless, 3 mm × 3 mm, 0.65 mm pitch), qualified for automated optical inspection (AOI) and halogen-free/RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 TxD | Transmit Data Input | CMOS input with internal pull-up to VCC; drives dominant state when low - interfaces directly to MCU TX pin. |
| 2 GND | Ground Reference | Primary signal and power return path; must be low-inductance connection to minimize EMI. |
| 3 VCC | Transmitter Supply | 4.5–5.5 V input requiring 100 nF decoupling capacitor to GND - powers internal driver and bias circuits. |
| 4 RxD | Receive Data Output | CMOS output with wake-up indication: asserts dominant level on bus activity during standby - enables MCU wake detection. |
| 5 N.C. | No Connection | Internally unconnected; PCB pad may be left floating or tied to GND for thermal relief - no electrical function. |
| 6 CANL | CAN Bus Low I/O | Differential bus terminal; driven low in dominant state - forms 120 Ω terminated pair with CANH. |
| 7 CANH | CAN Bus High I/O | Differential bus terminal; driven high in dominant state - defines differential voltage (VDiff = CANH − CANL) for logic decoding. |
| 8 STB | Stand-by Control Input | CMOS input with internal pull-up; pulled low to enter Normal mode - enables hardware-controlled low-power sequencing. |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Wake-up Logic | RxD output asserts dominant level on bus activity during Stand-by mode - eliminates need for separate wake-line routing to MCU. |
| Integrated Short-Circuit Protection | Self-limiting output current during CANH/CANL shorts to battery, ground, or VCC - prevents damage without external fusing. |
| Bus-Leakage Suppression | <1 µA CAN bus leakage in power-down - preserves network integrity when transceiver is disabled. |
| EME-Optimized Driver | Matched rise/fall times and minimized loop delay asymmetry - meets CISPR 25 Class 5 emission limits without common mode choke. |
| Automotive Transient Immunity | Compliant with ISO 7637-2 Pulse 1/2a/3a/4 and SAE J2962-2 - withstands real-world vehicle electrical disturbances. |
Applications
| Gateway Modules | Body Control Modules (BCM) |
|---|---|
Use Scenario: Centralized communication hub connecting CAN FD domains (powertrain, chassis, infotainment) with legacy CAN 2.0 networks. IC Role / Device Role / Timing Role: Physical layer translator enabling bidirectional FD frame relay with precise timing alignment and bus arbitration transparency. Use Value: Supports mixed-speed network topologies while maintaining <10 µA standby draw during sleep modes - extends vehicle battery life in parked state. | Use Scenario: Distributed control unit managing lighting, door locks, window lifts, and HVAC actuators via HS CAN. IC Role / Device Role / Timing Role: Fault-tolerant bus interface with integrated overtemperature and short-circuit protection - ensures fail-safe operation in high-heat cabin environments. Use Value: Eliminates need for external ESD protection components due to ±10 kV HBM rating - reduces BOM count and PCB area by ~12 mm² per node. |
| Engine Control Units (ECU) | Advanced Driver Assistance Systems (ADAS) |
Use Scenario: Real-time sensor/actuator communication in engine management systems requiring deterministic latency and high EMC immunity. IC Role / Device Role / Timing Role: High-symmetry transceiver ensuring sub-1 ns loop delay mismatch - preserves CAN FD bit timing margins at 5 MBit/s under wide temperature range (−40 to 150 °C). Use Value: Thermal shutdown at 170–190 °C prevents latch-up during prolonged high-load operation - avoids uncontrolled resets in under-hood applications. | Use Scenario: Sensor fusion module linking radar, camera, and ultrasonic ECUs over high-bandwidth CAN FD backbone. IC Role / Device Role / Timing Role: Low-emission physical layer device enabling dense ECU placement without cross-talk - meets CISPR 25 Class 5 radiated emissions limits. Use Value: Guaranteed loop delay symmetry allows reliable FD fast-phase sampling at 2× nominal bit rate - critical for time-synchronized ADAS actuation commands. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed CAN FD transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP TJA1057 | Lower ESD rating (±8 kV HBM); no integrated wake-up indication on RxD; requires external pull-up on STB. | Lacks native wake-up signaling - necessitates additional GPIO polling or external wake interrupt circuitry. | Select when cost sensitivity outweighs wake-up simplicity and ESD margin requirements. |
| ST TLE6250G | Supports only classical CAN 2.0 (1 MBit/s max); lacks CAN FD timing symmetry and 5 MBit/s capability. | Not suitable for FD-based firmware updates or high-throughput ADAS data streaming. | Select only for legacy CAN 2.0 migration paths where FD bandwidth is unnecessary. |
Compared with TJA1057 and TLE6250G, the TLE9251LEXUMA1 uniquely combines 5 MBit/s FD support, ±10 kV HBM ESD, and hardware wake-up signaling on RxD - making it optimal for next-generation automotive gateways requiring zero-latency bus wake and compact AOI-compatible packaging.
Availability
TLE9251LEXUMA1 is available at Aetrix Electronics and suitable for gateway modules, body control modules, and engine control units requiring stable component supply, AEC-Q100 qualification, and long-term automotive lifecycle support.
Supply support for TLE9251LEXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.
The TLE9251 belongs to Infineon's automotive transceiver product line, engineered specifically for high-reliability HS CAN FD networks in safety-critical vehicle systems - emphasizing electromagnetic compatibility, thermal resilience, and functional safety readiness.
FAQ
What is the maximum supported CAN FD data rate for TLE9251LEXUMA1?
The TLE9251LEXUMA1 supports CAN FD data frames up to 5 MBit/s, enabled by guaranteed loop delay symmetry between CANH and CANL outputs. This performance is validated across the full operating temperature range (−40 °C to 150 °C) and supply voltage range (4.5–5.5 V), with no external components required to achieve timing compliance per ISO 11898-2:2016.
Does TLE9251LEXUMA1 require an external common mode choke?
No, the TLE9251LEXUMA1 does not require an external common mode choke due to its optimized driver symmetry and very low electromagnetic emission (EME). It meets CISPR 25 Class 5 radiated emissions limits in standard automotive PCB layouts, as confirmed by Infineon's reference design testing and documented in the official application note AN478.
How does the wake-up functionality operate in Stand-by mode?
In Stand-by mode, the TLE9251LEXUMA1 monitors the CAN bus continuously with its low-power receiver. Upon detecting a dominant bus state, it immediately asserts a dominant-level RxD output - providing hardware wake-up signaling to the connected microcontroller without software polling. This occurs with sub-10 µs latency and consumes less than 10 µA quiescent current.
Is the PG-TSON-8 package of TLE9251LEXUMA1 compatible with automated optical inspection (AOI)?
Yes, the PG-TSON-8 package of TLE9251LEXUMA1 is explicitly designed for automated optical inspection (AOI), featuring solder joint geometry and surface finish optimized for machine vision systems. Infineon confirms AOI compatibility in the package outline documentation (Ordering Code: TLE9251LEXUMA1), and the leadless construction eliminates gull-wing shadowing issues common in DSO packages.
TLE9251LEXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 8-TDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Transceiver
- Protocol:
- CANbus
- Number of Drivers/Receivers:
- 1/1
- Duplex:
- Half
- Receiver Hysteresis:
- 30 mV
- Data Rate:
- 5Mbps
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- PG-TSON-8-1
TLE9251LEXUMA1 FAQ
1.How can I place an order for TLE9251LEXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE9251LEXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE9251LEXUMA1 reliable?
The price and inventory of TLE9251LEXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE9251LEXUMA1 is usually 5 days.
3.What payment methods are accepted for TLE9251LEXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE9251LEXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE9251LEXUMA1?
TLE9251LEXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE9251LEXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE9251LEXUMA1?
For technical support, including TLE9251LEXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE9251LEXUMA1 requirements.
6.How does Aetrix verify that TLE9251LEXUMA1 is sourced from the original manufacturer or authorized distributors?
All TLE9251LEXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE9251LEXUMA1 meets industry standards.
7.What is the process for return or replacement of TLE9251LEXUMA1?
All TLE9251LEXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE9251LEXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE9251LEXUMA1 part is unused and in its original packaging.
Return procedure for TLE9251LEXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLE9251LEXUMA1 Tags

-
ATA6561-GAQW-N
Microchip Technology

-
ATA6561-GBQW-N
Microchip Technology
-
AM26LS32ACDR
Texas Instruments

-
SP485CN-L/TR
MaxLinear, Inc.

-
SP485EN-L/TR
MaxLinear, Inc.

-
SP485EEN-L/TR
MaxLinear, Inc.

-
SP485ECN-L/TR
MaxLinear, Inc.

-
THVD1400DR
Texas Instruments
-
AM26C31IDR
Texas Instruments

-
TLIN1021ADRQ1
Texas Instruments
-
MAX232IDR
Texas Instruments
-
AM26C32IDR
Texas Instruments
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

