Infineon Technologies TT570N18KOFHPSA1

Overview

TT570N18KOFHPSA1 from Infineon Technologies is a pressure-contact thyristor module for phase-controlled AC power regulation, featuring 1800 V V_DRM/V_RRM, 566 A I_TAVM (T_C = 85°C), 20 kA I_TSM surge rating, 0.8 V V_T0, and 0.3 mΩ r_T. It is electrically insulated, pre-applied with TIM, and housed in an industrial-standard 60 mm baseplate package for high-reliability static switching in drive rectifiers and soft starters.

For engineers reviewing the TT570N18KOFHPSA1 datasheet, TT570N18KOFHPSA1 pinout, TT570N18KOFHPSA1 application, or TT570N18KOFHPSA1 equivalent, key selection criteria include junction-to-case thermal resistance (0.055 K/W), critical dv/dt (1000 V/µs), gate trigger current (≤250 mA), and crowbar-capable surge handling (20 kA, 10 ms).

Technical Context

This dual-thyristor, press-pack module implements phase-angle control in medium-power AC systems using silicon pellets with AlN-based internal insulation and a thermally optimized copper baseplate. Its 125°C maximum junction temperature and 0.055 K/W R_thJC support high-duty-cycle operation under forced-air or liquid-cooled heatsinking.

The device operates with gate-controlled turn-on only and requires external commutation for turn-off. Critical parameters-200 A/µs di/dt_cr, 1000 V/µs dv/dt_cr, and 250 µs typical turn-off time (t_q)-define its suitability for line-frequency applications like UPS rectifiers and static bypass switches where controlled conduction angle and robust fault-current handling are essential.

Key Specifications

Pinout & Package

TT570N18KOFHPSA1 is a dual-thyristor press-pack module in an industrial-standard insulated housing with 60 mm × 60 mm baseplate. Electrical terminals are M2 screw connections (12 Nm torque); gate control terminals conform to DIN 46244 A (2.8 × 0.8 mm). The baseplate provides Class 1 basic insulation (IEC 61140) with 3.6 kV isolation test voltage (1 sec).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar phase-control thyristor module applications.

Compared with TD570N18KOF and TT650N18KOF, TT570N18KOFHPSA1 uniquely combines integrated baseplate insulation, pre-applied TIM, and optimized 60 mm footprint-making it the preferred choice for space-constrained, safety-certified industrial drives and UPS systems requiring minimal external BOM components.

Availability

TT570N18KOFHPSA1 is available at Aetrix Electronics and suitable for soft starter systems, UPS rectifiers, and static bypass switches requiring stable component supply, long-lifecycle assurance, and certified isolation performance.

Supply support for TT570N18KOFHPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and industrial control solutions, with global manufacturing and quality certification to ISO 9001 and IATF 16949.

This part belongs to Infineon's High-Power Thyristor Module product line, engineered for ruggedized, high-current AC power control in mission-critical industrial infrastructure-including motor drives, energy storage systems, and grid-tied power conversion.

FAQ

What is the maximum allowable case temperature for continuous operation?

The maximum allowable case temperature (T_C) is defined by the I_TAVM derating curve: at 566 A, T_C must not exceed 85°C. Operation up to 125°C case temperature is permitted only at reduced current-e.g., 350 A at T_C = 110°C-as shown in Figure 7 of the technical information document.

Does TT570N18KOFHPSA1 require a heatsink? If so, what thermal resistance is recommended?

Yes-a heatsink is mandatory. For 566 A operation at T_C = 85°C, total thermal resistance from junction to ambient (R_thJA) must be ≤0.12 K/W. Given R_thJC = 0.055 K/W and R_thCH = 0.02 K/W, the heatsink-to-ambient resistance (R_thHA) should be ≤0.045 K/W under forced-air cooling (≥5 m/s) or liquid cooling.

Can this module be used in anti-parallel configuration for AC switching?

Yes. The dual-thyristor architecture supports anti-parallel connection (A1–K2 and A2–K1 tied) to enable bidirectional AC switching. Gate signals must be isolated and timed to avoid shoot-through; minimum dead time of 250 µs is required based on t_q = 250 µs typ. and dv/dt immunity.

Is the pre-applied TIM compatible with standard thermal greases or pastes?

No-the pre-applied TIM is a proprietary phase-change material designed for single-use, factory-applied bonding. Adding supplemental grease degrades interface integrity and voids thermal performance guarantees. Mounting must follow Infineon's specified torque (12 Nm for M2 terminals) and flatness tolerance (≤50 µm over 60 mm).