Infineon Technologies XC167CI32F40FBBAFXQMA1

Overview

XC167CI32F40FBBAFXQMA1 from Infineon Technologies is a 16-bit single-chip microcontroller based on the C166SV2 core, featuring 256 KB on-chip Flash, 12 KB total SRAM (2 KB DPRAM + 4 KB DSRAM + 6 KB PSRAM), and integrated TwinCAN 2.0B interface with 32 message objects across two CAN nodes. It operates at up to 40 MHz CPU clock (25 ns instruction cycle), supports 1-cycle MAC and 16×16 multiplication, and targets automotive powertrain and industrial motor control systems requiring deterministic real-time response.

For engineers reviewing the XC167CI32F40FBBAFXQMA1 datasheet, XC167CI32F40FBBAFXQMA1 pinout, XC167CI32F40FBBAFXQMA1 application, or XC167CI32F40FBBAFXQMA1 equivalent, key selection criteria include its 144-pin TQFP package, -40 °C to 125 °C extended temperature grade, on-chip PLL clock generation, 16-channel 10-bit ADC with 2.55 µs conversion time, and JTAG-based OCDS debug support.

Technical Context

The XC167CI32F40FBBAFXQMA1 implements a 5-stage pipelined C166SV2 CPU core with register-based architecture, dual local register banks for fast context switching, and zero-cycle jump execution. Its memory subsystem includes linear 16 MB address space, on-chip Flash with configurable wait states, and three distinct SRAM blocks optimized for data, program, and dual-port access.

Peripheral integration centers on real-time control: twin 16-channel CAPCOM units, CAPCOM6 for flexible PWM generation, GPT12E timer unit with five timers, TwinCAN with gateway functionality, and ASC/SSC serial interfaces. Clocking uses an on-chip PLL (1:0.15–1:10) or prescaler (1:1–60:1), with dedicated RTC oscillator and oscillator watchdog.

Key Specifications

Pinout & Package

XC167CI32F40FBBAFXQMA1 is housed in a 144-pin green TQFP (Thin Quad Flat Package) with 0.5 mm pitch, RoHS-compliant, designed for high-density PCB layouts and automotive-grade thermal performance (RΘJC = 15 K/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.

Compared with SAK-XC167CI-32F20F, this part delivers 2× CPU throughput and tighter ADC timing for demanding control loops; versus SAF-XC2267M-104F80L, it offers proven qualification for AEC-Q100 Grade 1, smaller footprint, and lower BOM cost where CAN FD is not required.

Availability

XC167CI32F40FBBAFXQMA1 is available at Aetrix Electronics and suitable for automotive engine control units, industrial motor drives, heavy-duty vehicle body control modules, and off-highway telematics gateways requiring stable component supply across extended temperature and long lifecycle programs.

Supply support for XC167CI32F40FBBAFXQMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.

The XC167 family was engineered for deterministic real-time control in automotive powertrain and industrial automation, emphasizing robustness, on-chip integration of CAN and analog peripherals, and toolchain maturity for safety-critical development.

FAQ

What is the maximum operating temperature range for XC167CI32F40FBBAFXQMA1?

This device is qualified for operation from -40 °C to +125 °C ambient temperature, meeting AEC-Q100 Grade 1 requirements for under-hood automotive applications. The 144-pin TQFP package uses green molding compound and achieves RΘJC = 15 K/W, enabling sustained 40 MHz operation within this range when PCB thermal design meets Infineon's layout guidelines.

Does XC167CI32F40FBBAFXQMA1 support CAN FD?

No, XC167CI32F40FBBAFXQMA1 implements TwinCAN compliant with ISO 11898-1:2003 (CAN 2.0B), supporting up to 1 Mbit/s with 29-bit identifiers and 32 message objects per node. It does not include CAN FD features such as flexible data-rate or extended payload length. For CAN FD, consider Infineon's XC2200 or Aurix TC2xx families.

How is the on-chip Flash memory programmed and verified?

Programming is performed via the on-chip bootstrap loader using ASC0 or ASC1 serial interface, or through JTAG using Infineon's DAS tools. Flash verification includes checksum calculation, erase/write cycle counters, and lock-bit protection. The datasheet specifies 10,000 write/erase cycles minimum and 20-year data retention at 125 °C, with ECC not implemented-external error handling must be applied for safety-critical storage.

What debug interfaces are supported, and what capabilities do they provide?

The device supports JTAG-based On-Chip Debug Support (OCDS) compliant with IEEE 1149.1, enabling non-intrusive breakpoints, watchpoints, real-time trace, and memory/register inspection. OCDS provides full visibility into CPU state, peripheral registers, and memory during run-time without halting execution, essential for validating timing-critical control loops and interrupt service routines in automotive environments.