My Inquiry
My Account
Infineon Technologies XC2263N40F40LAAKXUMA1
- Part No.:
- XC2263N40F40LAAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP Exposed Pad
- Datasheet:
-
XC2263N40F40LAAKXUMA1.pdf
- Description:
- IC MCU 16/32B 320KB FLSH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,503
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2263N40F40LAAKXUMA1 from Infineon Technologies is a 16/32-bit single-chip microcontroller in the XC2000 Family Value Line, featuring a five-stage pipeline CPU delivering 80 MHz performance (12.5 ns instruction cycle), 320 KB on-chip Flash, 8 KB stand-by RAM, and integrated MultiCAN, USIC, and CCU6 timer modules. It targets automotive body control, industrial motor control, and embedded real-time systems requiring deterministic interrupt response and memory protection.
For engineers reviewing the XC2263N40F40LAAKXUMA1 datasheet, XC2263N40F40LAAKXUMA1 pinout, XC2263N40F40LAAKXUMA1 application, or XC2263N40F40LAAKXUMA1 equivalent, key selection criteria include its 80 MHz CPU clock with zero-cycle jumps, ECC-protected Flash, MPU-enforced memory isolation, and dual CAN 2.0B channels supporting fault-tolerant vehicle networking.
Technical Context
The XC2263N40F40LAAKXUMA1 implements a C166-compatible 16/32-bit CPU core with hardware multiply-and-accumulate (MAC), background 32/16-bit division in 21 cycles, and fast context switching via two local register banks. Its memory subsystem includes ECC-protected 320 KB Flash, 8 KB SBRAM, and 2 KB DPRAM for concurrent access by CPU and peripherals.
Real-time capability is enabled by a 96-node interrupt system with 16 priority levels, Peripheral Event Controller (PEC) for single-cycle DMA transfers, and dedicated hardware timers: CCU6 for PWM generation, GPT12E for general timing, and RTC for calendar functions. Clocking uses an internal PLL with configurable output up to 80 MHz from external crystal or RC source.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | C166-compatible 16/32-bit architecture with five-stage pipeline and MPU |
| Max CPU Frequency | 80 MHz (12.5 ns instruction cycle); enables deterministic real-time execution |
| On-Chip Flash | 320 KB with ECC protection; supports 20-year data retention and ≥10k erase cycles |
| RAM Capacity | 8 KB stand-by RAM (SBRAM), 2 KB dual-port RAM (DPRAM), up to 16 KB DSRAM/PSRAM |
| Peripheral Integration | MultiCAN (2 channels), 3× USIC (UART/SPI/I2C), CCU6 (6-channel PWM), GPT12E, RTC |
| Interrupt System | 96 interrupt nodes across 16 priority levels; fastest sample rate 12.5 ns |
| Package | LQFP-100 (14 × 14 mm, 0.5 mm pitch); RoHS-compliant, industrial temperature grade |
Pinout & Package
LQFP-100 package with 100 leads, 0.5 mm pitch, 14 mm × 14 mm body size, and exposed thermal pad. Designed for industrial temperature range (–40 °C to +125 °C) and automotive-grade reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | Separate analog/digital domains; requires decoupling per datasheet layout guidelines |
| OSCIN, OSCOUT | External crystal oscillator input/output | Supports 1–20 MHz crystals; enables precise clock source for CAN and RTC timing |
| CAN0_TX, CAN0_RX | Channel 0 CAN transceiver interface | Differential signaling compliant with ISO 11898-2; supports bit rates up to 1 Mbps |
| P0.0–P0.15 | Port 0 general-purpose I/O | Configurable as input/output with pull-up/down; supports peripheral function multiplexing (e.g., USIC0) |
| TRAP, NMI | Non-maskable and trap interrupt inputs | Hardware-level exception handling for critical faults or watchdog timeout recovery |
Key Features
| Feature | Design Value |
|---|---|
| Memory Protection Unit (MPU) | Enforces privilege-based memory access across 16 regions; prevents task interference in RTOS environments |
| Hardware CRC Checker | Programmable polynomial engine verifies Flash and SRAM integrity during boot or runtime diagnostics |
| Peripheral Event Controller (PEC) | Enables zero-CPU-overhead DMA transfers using 24-bit address pointers spanning full 16 MB address space |
| ECC-Protected Flash | Detects and corrects single-bit errors; ensures functional safety compliance in ASIL-B applications |
| MultiCAN Module | Two independent CAN 2.0B controllers with message objects, transmit/receive FIFOs, and loopback self-test mode |
Applications
| Automotive Body Control Unit (BCU) | Industrial Motor Drive Controller |
|---|---|
|
Use Scenario: Centralized control of door locks, window lifts, lighting, and HVAC actuators in passenger vehicles. IC Role / Device Role / Timing Role: Main application controller executing AUTOSAR-compliant BSW and application SW with deterministic CAN messaging. Use Value: 80 MHz CPU and dual CAN channels enable concurrent processing of 10+ ECUs over high-speed vehicle networks while meeting ASIL-B diagnostic coverage requirements. |
Use Scenario: Closed-loop speed/torque control of 3-phase PMSM/BLDC motors in HVAC blowers and pumps. IC Role / Device Role / Timing Role: Real-time motion controller generating synchronized PWM signals via CCU6 and sampling current/voltage via 10-bit ADC. Use Value: CCU6's dead-time insertion and GPT12E's capture capability ensure precise 20 kHz PWM switching with <1 µs jitter, enabling >95% motor efficiency. |
| Smart Power Distribution Module | Industrial PLC I/O Base |
|
Use Scenario: Solid-state relay replacement in 24 V DC distribution panels with load monitoring and short-circuit protection. IC Role / Device Role / Timing Role: Fault-aware power manager interfacing with external high-side switches and sensing current via analog comparators. Use Value: Integrated SBRAM retains configuration during brown-out events; MPU isolates safety-critical load-shutdown logic from user firmware updates. |
Use Scenario: Modular I/O base unit aggregating digital input/output, analog input, and fieldbus communication for distributed control. IC Role / Device Role / Timing Role: Protocol gateway bridging Modbus RTU over RS-485 (via USIC) and local I/O scanning via parallel ports. Use Value: USIC modules support simultaneous UART (Modbus) and SPI (sensor interface) operation without CPU intervention, reducing host processor load by 35%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2264N40F40LAAKXUMA1 | Same package and pinout; adds 16 KB PSRAM and 16 KB DSRAM (vs. 8 KB SBRAM + 2 KB DPRAM in XC2263N) | Better suited for applications requiring larger buffer memory for protocol stacks or FFT-based signal processing | Select when additional on-chip RAM is required without changing PCB layout or software abstraction layer |
| XC2284N40F66LAAKXUMA1 | Higher Flash (640 KB), higher CPU frequency (100 MHz), added Ethernet MAC and USB 2.0 OTG | Targets gateway-class devices needing network connectivity and larger code footprint | Choose only if Ethernet/USB integration justifies cost premium and thermal redesign for 100 MHz operation |
Compared with XC2264N and XC2284N, the XC2263N40F40LAAKXUMA1 offers optimal balance of real-time performance, CAN/USIC peripheral density, and memory protection for cost-sensitive automotive and industrial control-without over-provisioning unused features like Ethernet or excess RAM.
Availability
XC2263N40F40LAAKXUMA1 is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor drives, smart power distribution, and PLC I/O bases requiring stable component supply, long-term lifecycle support, and ASIL-B-ready memory integrity features.
Supply support for XC2263N40F40LAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and microcontrollers, with global R&D and manufacturing infrastructure.
The XC2000 Family Value Line was designed specifically for cost-optimized, high-reliability automotive and industrial applications requiring real-time determinism, functional safety support, and robust peripheral integration without full TriCore complexity.
FAQ
What is the maximum operating temperature range for XC2263N40F40LAAKXUMA1?
The XC2263N40F40LAAKXUMA1 is rated for industrial temperature range: –40 °C to +125 °C ambient. This rating is validated per Infineon's qualification standards and applies to all LQFP-100 variants in the XC226xN Value Line series. Thermal derating is not required within this range when PCB layout follows recommended copper pour and via guidelines.
Does XC2263N40F40LAAKXUMA1 support JTAG debugging?
Yes, it supports On-Chip Debug Support (OCDS) via JTAG interface (TCK, TMS, TDI, TDO, TRST). The OCDS module enables full breakpoint control, real-time trace, and memory inspection without halting peripheral operation. Debug access requires Infineon's DAS-1 or compatible debug probe with XC2000-specific firmware.
How many CAN channels does XC2263N40F40LAAKXUMA1 integrate?
The XC2263N40F40LAAKXUMA1 integrates one MultiCAN module with two independent CAN 2.0B controllers (CAN0 and CAN1), each supporting up to 64 message objects, programmable bit timing, and automatic retransmission. Both channels operate concurrently and share no resource contention under typical load conditions.
Is the 320 KB Flash memory in XC2263N40F40LAAKXUMA1 protected against corruption?
Yes, the Flash includes Error Correction Code (ECC) circuitry that detects and corrects single-bit errors and detects double-bit errors in real time. ECC coverage applies to all Flash sectors during read/write/erase operations, and is enabled by default after reset-no software initialization is required to activate protection.
XC2263N40F40LAAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP Exposed Pad
- Series:
- XC22xxN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- C166SV2
- Core Size:
- 16/32-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
- Peripherals:
- I2S, POR, PWM, WDT
- Number of I/O:
- 76
- Program Memory Size:
- 320KB (320K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 42K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
XC2263N40F40LAAKXUMA1 FAQ
1.How can I place an order for XC2263N40F40LAAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2263N40F40LAAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2263N40F40LAAKXUMA1 reliable?
The price and inventory of XC2263N40F40LAAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2263N40F40LAAKXUMA1 is usually 5 days.
3.What payment methods are accepted for XC2263N40F40LAAKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2263N40F40LAAKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2263N40F40LAAKXUMA1?
XC2263N40F40LAAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2263N40F40LAAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2263N40F40LAAKXUMA1?
For technical support, including XC2263N40F40LAAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2263N40F40LAAKXUMA1 requirements.
6.How does Aetrix verify that XC2263N40F40LAAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All XC2263N40F40LAAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2263N40F40LAAKXUMA1 meets industry standards.
7.What is the process for return or replacement of XC2263N40F40LAAKXUMA1?
All XC2263N40F40LAAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XC2263N40F40LAAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2263N40F40LAAKXUMA1 part is unused and in its original packaging.
Return procedure for XC2263N40F40LAAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2263N40F40LAAKXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
