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Infineon Technologies XC2265M56F66LABHXUMA1

Part No.:
XC2265M56F66LABHXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP Exposed Pad
Datasheet:
AetrixXC2265M56F66LABHXUMA1.pdf
Description:
IC MCU 16BIT 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,314

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Product details

Overview

XC2265M56F66LABHXUMA1 from Infineon Technologies is a 16/32-bit single-chip microcontroller in the XC2000 Base Line family, featuring a five-stage pipeline CPU delivering 80 MHz operation (12.5 ns instruction cycle), 56 KB Flash, 16 KB SRAM, and integrated MultiCAN Rev. 2.0B with up to 6 nodes. It targets automotive body control modules requiring deterministic real-time response, CAN-based networked sensor actuation, and functional safety-aware firmware execution.

For engineers reviewing the XC2265M56F66LABHXUMA1 datasheet, XC2265M56F66LABHXUMA1 pinout, XC2265M56F66LABHXUMA1 application, or XC2265M56F66LABHXUMA1 equivalent, key selection criteria include its 80 MHz C166-compatible CPU core, dual 10-bit ADCs (≤1 μs conversion), CCU6x PWM units for motor control, 76 GPIOs, and 100-pin LQFP package with industrial temperature range support.

Technical Context

The XC2265M56F66LABHXUMA1 implements a C166-derived 16/32-bit CPU with MPU, supporting 16 MB linear address space and fast context switching via dual local register banks. Its memory subsystem includes 56 KB on-chip Flash (with ECC), 16 KB SRAM (8 KB DSRAM + 8 KB PSRAM), and 2 KB DPRAM for concurrent CPU/peripheral access.

Peripheral integration centers on deterministic real-time I/O: MultiCAN with 256 message objects across six nodes, two synchronizable 10-bit ADCs with broken-wire detection and preprocessing, four CCU6x units for high-resolution PWM, and CAPCOM2 for capture/compare timing - all coordinated by a 24-bit PEC for zero-overhead data transfers.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core C166-compatible 16/32-bit with five-stage pipeline; enables 80 MHz operation and single-cycle 32-bit arithmetic for deterministic control loops.
Flash Memory 56 KB on-chip Flash with ECC protection; supports safe firmware storage and in-field updates without external memory.
SRAM 16 KB total SRAM (8 KB DSRAM + 8 KB PSRAM); provides sufficient buffer space for CAN message queues and real-time data processing.
ADC Two 10-bit ADCs, 16-channel total, ≤1 μs conversion time; enables high-speed sampling of analog sensors (e.g., temperature, position) with built-in range check.
CAN Interface MultiCAN Rev. 2.0B, up to 6 nodes, 256 message objects; supports full CAN networking in distributed automotive ECUs with gateway capability.
PWM Generation Four CCU6x units with dead-time insertion and emergency shutdown; suitable for three-phase motor control and power converter gate driving.
Package 100-pin Green LQFP, 0.5 mm pitch; RoHS-compliant surface-mount package compatible with standard reflow profiles and automotive PCB layouts.
Supply Voltage 3.0 V to 5.5 V single supply; eliminates need for multiple voltage rails in 5 V or mixed-voltage automotive systems.

Pinout & Package

XC2265M56F66LABHXUMA1 is housed in a 100-pin Green LQFP package (14 mm × 14 mm, 0.5 mm pitch), qualified for industrial and automotive temperature ranges (–40 °C to +125 °C). Pin definitions follow Infineon's standardized XC2000 pin mapping with dedicated CANH/CANL, ADC inputs, CCU6x outputs, and JTAG/DAP debug interface pins.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dual 3.3 V/5 V supply domains with separate analog/digital ground pins reduce noise coupling in mixed-signal operation.
CANH, CANL CAN bus differential pair Integrated CAN transceiver drivers compliant with ISO 11898-2; support direct connection to automotive CAN physical layer.
ADCTRIG0–3 ADC trigger inputs Hardware-synchronized sampling initiation from CCU6x or timer events ensures precise phase-aligned acquisition in motor control.
CC60–CC65 CCU6x output channels Six dedicated PWM output pins per CCU6x unit; support complementary outputs with programmable dead time for half/full-bridge drivers.
TCK, TMS, TDI, TDO JTAG debug interface Standard 4-pin JTAG port enabling boundary scan, flash programming, and real-time debugging via Infineon DAS tools.
BOOT0, BOOT1 Boot mode selection Two-pin strap configuration determines boot source (Flash, ROM, or external memory), critical for secure bootloader initialization.

Key Features

Feature Design Value
Memory Protection Unit (MPU) Enables hardware-enforced memory region access control, supporting ASIL-B software partitioning in automotive safety applications.
Peripheral Event Controller (PEC) Performs 24-bit addressable DMA transfers without CPU intervention, reducing interrupt latency for time-critical CAN or ADC data movement.
Hardware CRC Checker Programmable polynomial engine verifies Flash and SRAM integrity at runtime, meeting IEC 61508 diagnostic coverage requirements.
Real-Time Clock (RTC) Independent 32.768 kHz clock domain with calendar function; maintains timekeeping during stop modes for wake-up scheduling and logging.
Wake-Up Timer & Oscillator Watchdog Guarantees reliable low-power mode exit and detects crystal failure, satisfying ISO 26262 fault detection requirements for safety mechanisms.

Applications

Body Control Module Electric Power Steering (EPS)

Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC actuators in modern vehicle platforms.

IC Role / Device Role / Timing Role: Main system controller executing CAN message routing, PWM-driven motor control, and ADC-based sensor fusion.

Use Value: Integrated MultiCAN and 76 GPIOs eliminate external bus expanders; 80 MHz CPU ensures sub-millisecond response to LIN/CAN commands.

Use Scenario: Closed-loop torque assist control using steering angle, torque, and motor current feedback.

IC Role / Device Role / Timing Role: Real-time motor controller with synchronized ADC sampling, CCU6x PWM generation, and CAN communication to ADAS domain.

Use Value: Dual 10-bit ADCs with ≤1 μs conversion and CCU6x dead-time control enable precise field-oriented control at >10 kHz PWM frequency.

Seat Position Control Roof Module Gateway

Use Scenario: Motorized seat adjustment with position sensing, overload detection, and multi-axis coordination.

IC Role / Device Role / Timing Role: Dedicated motion controller managing H-bridge drivers, Hall-effect feedback, and LIN slave interface.

Use Value: CAPCOM2 timers provide precise encoder counting; DPRAM allows concurrent CPU and PEC access to position buffers without contention.

Use Scenario: Aggregation and translation of signals between CAN, LIN, and body domain networks in roof consoles.

IC Role / Device Role / Timing Role: Protocol gateway with message filtering, store-and-forward buffering, and error handling across multiple CAN nodes.

Use Value: 256 MultiCAN message objects and 6-node support allow simultaneous management of sunroof, ambient lighting, and sensor clusters without external ASIC.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2267M72F80LABHXUMA1 72 KB Flash, 80 KB SRAM, same CPU and peripheral set; higher memory density but identical pinout and package. Supports larger AUTOSAR BSW stacks and complex diagnostics; requires no PCB redesign. Select when firmware size exceeds 56 KB or additional RAM is needed for dynamic task allocation.
TC1766F128F133HRBAKXUMA1 TriCore™ CPU (133 MHz), 128 KB Flash, 64 KB SRAM; enhanced floating-point and DSP capabilities, different instruction set. Targeted at advanced driver assistance (ADAS) pre-processing; not binary-compatible with C166 code. Choose for new designs requiring higher computational throughput and ASIL-D compliance, accepting toolchain migration effort.

Compared with XC2265M56F66LABHXUMA1, the XC2267M72F80LABHXUMA1 offers drop-in memory scalability while preserving legacy software investment, whereas the TC1766 demands full architecture revalidation but delivers tripling of integer performance and native safety features for next-gen ECU platforms.

Availability

XC2265M56F66LABHXUMA1 is available at Aetrix Electronics and suitable for automotive body electronics, electric power steering systems, and seat control modules requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 2 qualification.

Supply support for XC2265M56F66LABHXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

This device belongs to the XC2000 Base Line microcontroller product line, designed specifically for cost-optimized, high-reliability automotive body and chassis control applications requiring CAN connectivity and real-time determinism.

FAQ

Does XC2265M56F66LABHXUMA1 support AEC-Q100 qualification?

Yes, this part is qualified to AEC-Q100 Grade 2 (–40 °C to +105 °C ambient), with full test documentation available from Infineon's official product change notices and qualification reports. The 100-pin LQFP package and internal design meet stress testing requirements for automotive under-hood environments.

What debug interfaces does XC2265M56F66LABHXUMA1 provide?

It supports both JTAG (TCK/TMS/TDI/TDO) and Infineon's Device Access Port (DAP) for non-intrusive real-time debugging, flash programming, and boundary scan. DAP enables single-wire debug over SWD, reducing PCB footprint versus full JTAG while maintaining full OCDS functionality.

Can the on-chip Flash be programmed in-system?

Yes, the 56 KB Flash supports in-application programming (IAP) via the on-chip bootloader, allowing firmware updates over CAN or UART without external programmers. Erase/write cycles are rated for 10,000 cycles with data retention exceeding 20 years at 125 °C junction temperature.

Is there hardware support for functional safety standards like ISO 26262?

The MCU includes MPU, ECC on Flash/SRAM, hardware CRC checker, oscillator watchdog, and lockstep-capable peripherals - collectively enabling ASIL-B decomposition. Full ASIL-B compliance requires system-level integration per ISO 26262 Part 5, supported by Infineon's safety manual and FMEDA reports.

XC2265M56F66LABHXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP Exposed Pad
Series:
XC22xxM
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
C166SV2
Core Size:
16/32-Bit
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals:
I2S, POR, PWM, WDT
Number of I/O:
76
Program Memory Size:
448KB (448K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
50K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

XC2265M56F66LABHXUMA1 FAQ

1.How can I place an order for XC2265M56F66LABHXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2265M56F66LABHXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2265M56F66LABHXUMA1 reliable?

The price and inventory of XC2265M56F66LABHXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2265M56F66LABHXUMA1 is usually 5 days.

3.What payment methods are accepted for XC2265M56F66LABHXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2265M56F66LABHXUMA1 transactions.

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4.How is shipping managed for XC2265M56F66LABHXUMA1?

XC2265M56F66LABHXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2265M56F66LABHXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2265M56F66LABHXUMA1?

For technical support, including XC2265M56F66LABHXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2265M56F66LABHXUMA1 requirements.

6.How does Aetrix verify that XC2265M56F66LABHXUMA1 is sourced from the original manufacturer or authorized distributors?

All XC2265M56F66LABHXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2265M56F66LABHXUMA1 meets industry standards.

7.What is the process for return or replacement of XC2265M56F66LABHXUMA1?

All XC2265M56F66LABHXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XC2265M56F66LABHXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2265M56F66LABHXUMA1 part is unused and in its original packaging.

Return procedure for XC2265M56F66LABHXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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