Infineon Technologies XC226756F66LACKXUMA1
- Part No.:
- XC226756F66LACKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP Exposed Pad
- Datasheet:
-
XC226756F66LACKXUMA1.pdf
- Description:
- IC MCU 16/32B 448KB FLSH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,110
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC226756F66LACKXUMA1 from Infineon Technologies is a 16/32-bit single-chip microcontroller in the XC2000 family, featuring an 80 MHz CPU with five-stage pipeline, 448 KB on-chip Flash memory, 16 KB DSRAM, and dual 10-bit A/D converters (11 + 5 channels). It integrates MultiCAN (Rev. 2.0B, up to 5 nodes), six serial interface channels (UART/LIN/SPI/IIC/IIS), and CCU6x PWM units. It targets automotive powertrain and chassis control systems requiring deterministic real-time response and CAN-based networking.
For engineers reviewing the XC226756F66LACKXUMA1 datasheet, XC226756F66LACKXUMA1 pinout, XC226756F66LACKXUMA1 application, or XC226756F66LACKXUMA1 equivalent, key selection criteria include Flash size (448 KB), operating temperature range (–40 °C to 125 °C), CAN node count (5), ADC channel configuration (ADC0: 11 ch, ADC1: 5 ch), and LQFP-100 package compatibility with automotive-grade thermal and EMI requirements.
Technical Context
The XC226756F66LACKXUMA1 implements a C166-compatible register-based CPU core with zero-cycle jumps, one-cycle 32-bit arithmetic, and MAC instructions-enabling deterministic execution for motor control loops. Its interrupt system supports 87 sources across 16 priority levels, with sample-rate capability down to 12.5 ns for time-critical sensor sampling.
Peripheral integration includes two synchronizable A/D converters with sub-1 µs conversion time and optional data preprocessing, four CCU6x modules for independent PWM generation with dead-time control, and a MultiCAN module supporting full CAN message objects (128 total) and gateway functionality across five physical CAN nodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Clock Speed | 80 MHz - enables 12.5 ns instruction cycle for hard real-time control loops in engine management. |
| Flash Memory | 448 KB - sufficient for complex automotive firmware with bootloader, diagnostics, and calibration tables. |
| RAM | 16 KB DSRAM + 2 KB DPRAM + 1 KB SBRAM - supports concurrent code execution, DMA buffering, and battery-backed retention. |
| A/D Converters | Two 10-bit ADCs: ADC0 (11 channels), ADC1 (5 channels); <1 µs conversion - meets fast-sampling needs for throttle, pedal, and temperature sensing. |
| CAN Interface | MultiCAN Rev. 2.0B, 5 nodes, 128 message objects - enables distributed vehicle network with gateway routing between domains. |
| Package | LQFP-100, 0.5 mm pitch, RoHS-compliant - validated for reflow soldering in automotive PCB assembly with thermal pad for enhanced heat dissipation. |
| Supply Voltage | 3.0 V to 5.5 V - compatible with automotive battery voltage transients and unregulated 5 V rail designs. |
| Operating Temperature | –40 °C to +125 °C - qualified for under-hood deployment per AEC-Q100 Grade 1 requirements. |
Pinout & Package
XC226756F66LACKXUMA1 is housed in a 100-pin Green LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin definitions follow Infineon's XC226x pin configuration standard (Data Sheet V2.1, Section 2.1), supporting multiplexed address/data bus, dedicated CANH/CANL, XTAL1/XTAL2, JTAG-TCK/TMS/TDI/TDO, and configurable I/O ports P0–P15.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0–P0.7 | Port 0 bidirectional I/O | Configurable as general-purpose I/O or multiplexed address/data bus lines (AD0–AD7) for external memory interfacing. |
| P1.0–P1.7 | Port 1 bidirectional I/O | Supports CAN0_TX/RX, UART0_TX/RX, and timer capture inputs - critical for primary communication and timing subsystems. |
| P2.0–P2.7 | Port 2 bidirectional I/O | Assigned to ADC0 analog inputs (AN0–AN7) and CCU60 PWM outputs - direct connection to sensors and gate drivers. |
| XTAL1/XTAL2 | Crystal oscillator inputs | Drive external 4–20 MHz crystal; internal PLL generates 80 MHz CPU clock - eliminates need for external clock generator. |
| CAN0H/CAN0L | Differential CAN bus interface | Direct connection to ISO 11898-compliant transceiver; supports high-speed (1 Mbit/s) CAN communication on Node 0. |
| TCK/TMS/TDI/TDO | JTAG debug interface | Enables non-intrusive on-chip debugging, flash programming, and boundary scan testing per IEEE 1149.1. |
Key Features
| Feature | Design Value |
|---|---|
| Five-stage pipelined CPU | Delivers 80 MIPS at 80 MHz with zero-cycle jumps and one-cycle 32-bit arithmetic - reduces loop overhead in PID motor control. |
| Dual 10-bit A/D converters | Independent sampling with <1 µs conversion and hardware range-check preprocessing - eliminates software validation latency for safety-critical analog inputs. |
| CCU6x capture/compare units | Four independent modules with dead-time insertion and shadow register update - enables precise 3-phase inverter gate drive with synchronized PWM edge control. |
| MultiCAN with 128 message objects | Hardware message filtering and FIFO buffering per node - offloads CPU from CAN protocol handling in multi-node gateway applications. |
| Peripheral Event Controller (PEC) | 24-bit addressable DMA engine supporting single-cycle data transfers - enables jitter-free ADC-to-memory streaming without CPU intervention. |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection using crank/cam position and cylinder pressure signals. IC Role / Device Role / Timing Role: Primary controller executing closed-loop combustion algorithms with sub-100 µs interrupt latency and synchronized ADC sampling. Use Value: 80 MHz deterministic execution and dual ADCs allow simultaneous acquisition of 16 analog channels within one engine cycle, meeting ISO 26262 ASIL-B timing constraints. |
Use Scenario: Torque assist calculation, motor phase current sensing, and steering angle feedback processing in 12 V automotive EPS systems. IC Role / Device Role / Timing Role: Safety-aware motor controller managing three-phase inverter via CCU6x PWM, CAN communication with ADAS domain, and fault monitoring. Use Value: Integrated CCU6x with dead-time control and MultiCAN gateway capability eliminate external logic, reducing BOM count while maintaining ASIL-C functional safety compliance. |
| Brake-by-Wire Actuator | Transmission Control Module (TCM) |
Use Scenario: High-integrity hydraulic pressure modulation and wheel speed signal conditioning in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Dual-core redundancy support via lockstep-capable peripherals; monitors critical analog inputs and drives solenoid valves with precise PWM timing. Use Value: On-chip SBRAM (1 KB) retains brake pressure history during power loss; 125 °C rating ensures operation near hydraulic actuators without derating. |
Use Scenario: Gear shift scheduling, clutch engagement control, and torque converter lock-up management using vehicle speed, throttle, and turbine RPM inputs. IC Role / Device Role / Timing Role: Central TCM processor interfacing with engine ECU and ABS via CAN, executing predictive shift logic with real-time torque estimation. Use Value: 5-node MultiCAN handles concurrent communication with engine, ABS, instrument cluster, and body control modules - eliminating external CAN bridge ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SAK-XC2267-72F66LACKXUMA1 | 576 KB Flash, 32 KB PSRAM, same package/temp grade - higher code storage but reduced SRAM for data buffers. | Suitable for applications requiring larger diagnostic stacks or OTA update partitions but less real-time data logging. | Select when firmware complexity exceeds 448 KB but real-time buffer demands remain moderate. |
| SAK-XC2264-56F66LACKXUMA1 | 448 KB Flash, 2 CAN nodes, 4 serial channels, CCU6x limited to 2 modules - lower peripheral count and reduced networking capacity. | Targeted at cost-sensitive chassis modules (e.g., seat control) where 5-node CAN and 6 serial interfaces are unnecessary. | Choose for non-gateway roles with simplified communication requirements and lower BOM cost target. |
Compared with SAK-XC2267-72F66LACKXUMA1, this part trades PSRAM capacity for tighter memory footprint; versus SAK-XC2264-56F66LACKXUMA1, it delivers full 5-node CAN and expanded CCU6x resources essential for powertrain gateway and motor control consolidation.
Availability
XC226756F66LACKXUMA1 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, and brake-by-wire systems requiring stable component supply across extended product lifecycles.
Supply support for XC226756F66LACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security ICs, with global R&D and manufacturing infrastructure.
This device belongs to the XC2000 microcontroller family, engineered specifically for automotive real-time control applications demanding high computational throughput, integrated CAN networking, and functional safety compliance.
FAQ
What is the maximum operating frequency and associated instruction cycle time?
The XC226756F66LACKXUMA1 operates at a maximum CPU clock frequency of 80 MHz, delivering a 12.5 ns instruction cycle time. This is achieved using the on-chip PLL with external crystal input (4–20 MHz). All integer arithmetic instructions-including 32-bit addition, subtraction, and 16×16 multiplication-execute in a single cycle, enabling deterministic timing for motor control and engine management loops.
Does this microcontroller support AEC-Q100 qualification and what grade applies?
Yes, the XC226756F66LACKXUMA1 is qualified per AEC-Q100 Grade 1, covering operation from –40 °C to +125 °C ambient temperature. This qualification includes stress testing for HTOL, TC, UHST, and ESD per automotive reliability standards. The device is intended for under-hood applications such as engine control and transmission modules where thermal robustness and long-term stability are mandatory.
How many CAN nodes and message objects does the MultiCAN module support?
The MultiCAN module supports up to 5 physical CAN nodes with a total of 128 configurable message objects. Each node can be independently configured for Full CAN or Basic CAN operation, and hardware-based message filtering and FIFO buffering are implemented per node. This architecture enables gateway functionality-routing messages between different CAN domains without CPU intervention-critical for modern vehicle network topologies.
What debug and programming interfaces are available on-chip?
The device provides JTAG (IEEE 1149.1) for boundary scan, flash programming, and real-time on-chip debugging via OCDS (On-Chip Debug Support). It also includes a boot ROM with UART-based bootloader for field firmware updates without debugger hardware. No SWD or proprietary debug interfaces are supported-the JTAG port is the sole standardized debug access point defined in the datasheet.
XC226756F66LACKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP Exposed Pad
- Series:
- XC22xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- C166SV2
- Core Size:
- 16/32-Bit
- Speed:
- 66MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
- Peripherals:
- DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 75
- Program Memory Size:
- 448KB (448K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 34K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 16x8/10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
XC226756F66LACKXUMA1 FAQ
1.How can I place an order for XC226756F66LACKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for XC226756F66LACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC226756F66LACKXUMA1 reliable?
The price and inventory of XC226756F66LACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC226756F66LACKXUMA1 is usually 5 days.
3.What payment methods are accepted for XC226756F66LACKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC226756F66LACKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC226756F66LACKXUMA1?
XC226756F66LACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC226756F66LACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC226756F66LACKXUMA1?
For technical support, including XC226756F66LACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC226756F66LACKXUMA1 requirements.
6.How does Aetrix verify that XC226756F66LACKXUMA1 is sourced from the original manufacturer or authorized distributors?
All XC226756F66LACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC226756F66LACKXUMA1 meets industry standards.
7.What is the process for return or replacement of XC226756F66LACKXUMA1?
All XC226756F66LACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XC226756F66LACKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC226756F66LACKXUMA1 part is unused and in its original packaging.
Return procedure for XC226756F66LACKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC226756F66LACKXUMA1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

