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Infineon Technologies XC2361A72F100LAAHXUMA1

Part No.:
XC2361A72F100LAAHXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP Exposed Pad
Datasheet:
AetrixXC2361A72F100LAAHXUMA1.pdf
Description:
IC MCU 16BIT 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,466

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Product details

Overview

XC2361A72F100LAAHXUMA1 from Infineon Technologies is a 16/32-bit single-chip microcontroller in the XC2000 Base Line family, featuring an 80 MHz C166-compatible CPU with five-stage pipeline, 832 KB on-chip Flash, 16 KB DSRAM, and integrated MultiCAN (Rev. 2.0B) supporting up to 3 CAN nodes. It targets automotive powertrain control, industrial motor drives, and embedded real-time systems requiring deterministic interrupt response and memory protection.

For engineers reviewing the XC2361A72F100LAAHXUMA1 datasheet, XC2361A72F100LAAHXUMA1 pinout, XC2361A72F100LAAHXUMA1 application, or XC2361A72F100LAAHXUMA1 equivalent, key selection criteria include its 80 MHz CPU cycle time (12.5 ns), ECC-protected Flash/SRAM, dual 10-bit ADCs with <1 µs conversion, CCU6x PWM units, and LQFP-100 package compatibility with industrial temperature range (-40°C to +125°C).

Technical Context

The XC2361A72F100LAAHXUMA1 implements a C166v2 CPU core with MPU, supporting 16 MB linear address space and zero-cycle jumps. Its memory subsystem includes 832 KB Flash with ECC, 16 KB DSRAM, 32 KB PSRAM, 2 KB DPRAM, and 8 KB SBRAM - all accessible via unified addressing and protected by hardware CRC checker with programmable polynomial.

Peripheral integration centers on real-time control: two CCU6x units for high-resolution PWM generation, CAPCOM2 with 16 channels, GPT12E timer, MultiCAN with 64 message objects across 3 nodes, and dual 10-bit ADCs with preprocessing (range check, broken-wire detection). Clocking uses internal PLL with external crystal or oscillator input, enabling stable 80 MHz operation from 3.0–5.5 V supply.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreC166v2 16/32-bit with five-stage pipeline, 80 MHz max clock (12.5 ns instruction cycle)
Flash Memory832 KB on-chip, ECC-protected, supports in-application programming (IAP)
RAM16 KB DSRAM + 32 KB PSRAM + 2 KB DPRAM + 8 KB SBRAM, all MPU-protected
ADCDual 10-bit SAR converters, 16 total channels, <1 µs conversion time, built-in preprocessing
CAN InterfaceMultiCAN Rev. 2.0B, 3 independent nodes, 64 message objects, gateway functionality
PackageLQFP-100, 0.5 mm pitch, RoHS-compliant, rated for -40°C to +125°C ambient
Supply Voltage3.0 V to 5.5 V single supply, with internal voltage regulator and brown-out detection
Real-Time PeripheralsCCU6x ×2 (flexible PWM), CAPCOM2 (16-channel), GPT12E, RTC, system timer, watchdog

Pinout & Package

LQFP-100 package (14 × 14 mm body, 0.5 mm pitch), thermally enhanced with exposed thermal pad, JEDEC MS-026 compliant. Pinout defined per Data Sheet V2.12 Section 2.1 (pages 15–37), supporting multiplexed/demultiplexed external bus, configurable I/O drive strength, and dedicated debug (JTAG/DAP) pins.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundCore and I/O supply pins; separate analog/digital ground planes recommended for ADC integrity
OSCIN/OSCOUTCrystal oscillator interfaceSupports 1–20 MHz external crystal or CMOS clock input for PLL-based system clock generation
TS0–TS15General-purpose I/O / peripheral function multiplexConfigurable as GPIO, CAN TX/RX, UART, SPI, PWM, or ADC inputs - requires software pin function select
ADCTRIG0–ADCTRIG3ADC trigger inputsHardware-synchronized sampling initiation from timers, CCU6, or external event sources
TDO/TDI/TCK/TMS/TRSTJTAG debug interfaceIEEE 1149.1-compliant boundary scan and on-chip debug access via Device Access Port (DAP)
BSL0–BSL2Bootstrap loader configurationSet boot mode at reset: internal Flash, external memory, or serial bootloader activation

Key Features

FeatureDesign Value
Memory Protection Unit (MPU)Enforces privilege levels and region-based access control across full 16 MB address space
ECC-Protected Flash & SRAMSingle-bit error correction and double-bit error detection for safety-critical code/data storage
Peripheral Event Controller (PEC)Enables zero-CPU-overhead DMA-like transfers between peripherals and memory using 24-bit pointers
MultiCAN with Gateway ModeRoutes messages between up to 3 CAN networks without host CPU intervention, reducing latency
Real-Time ADC PreprocessingHardware-accelerated range checking and broken-wire detection eliminate software polling overhead
Fast Context SwitchingTwo local register banks enable sub-1 µs ISR entry/exit for time-critical interrupt handling

Applications

Automotive Engine Control Unit (ECU)Industrial Motor Drive Controller

Use Scenario: Real-time combustion timing, fuel injection pulse width modulation, and knock detection in gasoline/diesel engines.

IC Role / Device Role / Timing Role: Primary controller executing closed-loop PID algorithms with sub-microsecond jitter tolerance and CAN-based sensor/actuator communication.

Use Value: CCU6x PWM units deliver precise 150 ps resolution timing; MultiCAN handles simultaneous engine, transmission, and chassis CAN traffic.

Use Scenario: Field-oriented control (FOC) of 3-phase AC induction or PMSM motors in HVAC, pumps, and compressors.

IC Role / Device Role / Timing Role: Real-time execution of FOC math (Clarke/Park transforms), PWM generation, and current sensing via dual synchronized ADCs.

Use Value: Dual 10-bit ADCs sample phase currents simultaneously with <1 µs conversion and hardware range-checking to prevent overcurrent faults.

Onboard Charger (OBC) for EVsGrid-Tied Solar Inverter Control

Use Scenario: Bidirectional AC/DC conversion, battery charging profile management, and isolation monitoring in Level 2 EV chargers.

IC Role / Device Role / Timing Role: System coordinator managing power stage gate drivers, isolated communication, thermal monitoring, and CAN diagnostics.

Use Value: 832 KB ECC Flash stores multiple charging profiles and firmware updates; SBRAM retains critical state during brown-out events.

Use Scenario: MPPT tracking, grid synchronization, anti-islanding detection, and reactive power control in residential solar inverters.

IC Role / Device Role / Timing Role: High-precision timing source for PWM carrier signals and grid phase-locked loop (PLL) synchronization.

Use Value: Hardware CRC checker validates firmware integrity before execution; GPT12E and system timer ensure <100 ns jitter in grid sync loops.

Equivalent & Alternatives

The following parts are listed as comparable options for similar real-time microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC2365A72F100LAAHXUMA1Same package and pinout; adds 16 KB additional PSRAM and second MultiCAN node (total 4 CAN nodes)Required for systems needing >3 CAN buses or larger runtime data buffersSelect when expanding CAN topology or requiring >32 KB PSRAM for complex control algorithms
TC1767F128F133HRBAKXUMA1TriCore™ architecture, 133 MHz, 1.2 MB Flash, but LQFP-144 package and different peripheral set (no CCU6x, uses GTM)Targets higher-performance automotive ADAS or gateway ECU where TriCore toolchain and GTM timing precision are preferredChoose only if migrating to TriCore ecosystem or requiring >100 MHz deterministic execution with GTM-based signal generation

Compared with XC2365A72F100LAAHXUMA1, this part offers lower memory cost and identical CAN scalability up to 3 nodes; versus TC1767, it provides C166v2 software continuity and CCU6x PWM specialization ideal for motor control, but lacks TriCore's floating-point throughput and GTM flexibility.

Availability

XC2361A72F100LAAHXUMA1 is available at Aetrix Electronics and suitable for automotive engine control units, industrial motor drives, and onboard EV chargers requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualification alignment.

Supply support for XC2361A72F100LAAHXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions, with global R&D and manufacturing infrastructure.

This device belongs to the XC2000 Base Line microcontroller product line, designed specifically for cost-optimized, high-reliability real-time control in automotive powertrain and industrial automation applications where C166 software compatibility and CAN-centric peripheral integration are essential.

FAQ

What is the maximum operating frequency and corresponding instruction cycle time?

The XC2361A72F100LAAHXUMA1 operates at up to 80 MHz CPU clock frequency, delivering a 12.5 ns instruction cycle time for single-cycle execution of core arithmetic and logic operations. This timing is guaranteed under specified voltage (3.0–5.5 V) and temperature (-40°C to +125°C) conditions per Data Sheet V2.12 Section 4.1.2.

Does this microcontroller support in-system programming (ISP) of Flash memory?

Yes - the device integrates a ROM-resident bootstrap loader (BSL) accessible via UART, CAN, or SPI interfaces, enabling field firmware updates without external programmers. Flash programming supports sector erase, page write, and checksum verification, with ECC automatically applied during write operations per Section 4.5 of the datasheet.

How many CAN nodes does the MultiCAN module support, and what protocol versions are implemented?

The MultiCAN module supports up to 3 independent CAN nodes, each compliant with ISO 11898-1:2003 (CAN 2.0B Active), including both Full CAN and Basic CAN message objects. All nodes share a common 64-object message RAM and support hardware timestamping, message filtering, and gateway routing between nodes.

Is the LQFP-100 package thermally enhanced, and what is the recommended PCB layout for thermal management?

Yes - the LQFP-100 package includes an exposed thermal pad on the underside, requiring solder connection to a large copper pour on the PCB's inner layer for effective heat dissipation. Infineon recommends ≥4 thermal vias (0.3 mm diameter) under the pad connected to internal ground plane, per Section 5.2 of the datasheet, to maintain junction temperature within limits at full 80 MHz operation.

XC2361A72F100LAAHXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP Exposed Pad
Series:
XC23xxA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
C166SV2
Core Size:
16/32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals:
I2S, POR, PWM, WDT
Number of I/O:
75
Program Memory Size:
576KB (576K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
50K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

XC2361A72F100LAAHXUMA1 FAQ

1.How can I place an order for XC2361A72F100LAAHXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2361A72F100LAAHXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of XC2361A72F100LAAHXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2361A72F100LAAHXUMA1 is usually 5 days.

3.What payment methods are accepted for XC2361A72F100LAAHXUMA1?

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XC2361A72F100LAAHXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2361A72F100LAAHXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2361A72F100LAAHXUMA1?

For technical support, including XC2361A72F100LAAHXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2361A72F100LAAHXUMA1 requirements.

6.How does Aetrix verify that XC2361A72F100LAAHXUMA1 is sourced from the original manufacturer or authorized distributors?

All XC2361A72F100LAAHXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2361A72F100LAAHXUMA1 meets industry standards.

7.What is the process for return or replacement of XC2361A72F100LAAHXUMA1?

All XC2361A72F100LAAHXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XC2361A72F100LAAHXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2361A72F100LAAHXUMA1 part is unused and in its original packaging.

Return procedure for XC2361A72F100LAAHXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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