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Infineon Technologies XC2387C136F100LABKXUMA1

Part No.:
XC2387C136F100LABKXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
144-LQFP Exposed Pad
Datasheet:
AetrixXC2387C136F100LABKXUMA1.pdf
Description:
IC MCU 16/32BIT 1.088MB FLASH
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,925

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Product details

Overview

XC2387C136F100LABKXUMA1 from Infineon Technologies is a 16/32-bit single-chip microcontroller in the XC2000 High Line family, featuring a 100 MHz TriCore CPU with five-stage pipeline, 1.6 MB on-chip Flash memory, 24 KB data SRAM, and integrated MultiCAN (3 nodes, 64 message objects) and optional FlexRay v2.1 (2-node) controllers. It operates from a single 3.0–5.5 V supply and targets automotive powertrain and chassis control systems requiring real-time determinism and functional safety support.

For engineers reviewing the XC2387C136F100LABKXUMA1 datasheet, XC2387C136F100LABKXUMA1 pinout, XC2387C136F100LABKXUMA1 application, or XC2387C136F100LABKXUMA1 equivalent, key selection criteria include its 100 MHz deterministic execution, ECC-protected Flash/SRAM, dual A/D converters (24 channels, <1 µs conversion), CCU6x PWM units, and E-Ray/FlexRay timing compliance per ISO 17458-4.

Technical Context

The XC2387C136F100LABKXUMA1 integrates a TriCore CPU core with MPU, supporting mixed 16-/32-bit instruction execution and zero-cycle jumps. Its memory subsystem includes 1.6 MB Flash with ECC, 24 KB DSRAM, 8 KB SBRAM, and 2 KB DPRAM - all mapped within a unified 16 MB linear address space.

Peripheral integration centers on deterministic real-time I/O: two synchronizable 10-bit ADCs (24-channel, broken-wire detection), four CCU6x units for high-resolution PWM, MultiCAN Rev. 2.0B (3 nodes), and optional E-Ray FlexRay controller compliant with protocol spec v2.1. Clock generation uses an internal PLL with programmable bandwidth and startup time tSPO specified at power-on.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core TriCore 1.6.1, 100 MHz max, 10 ns instruction cycle, five-stage pipeline with MPU
Flash Memory 1,600 KB on-chip, ECC-protected, 100 kcycle endurance, sector erase capability
Data RAM 24 KB DSRAM + 8 KB SBRAM + 2 KB DPRAM, all with error detection/correction support
ADC Two 10-bit converters, up to 24 channels total, <1 µs conversion time, range check & broken-wire detection
CAN Interface MultiCAN Rev. 2.0B, 3 independent nodes, 64 message objects, gateway functionality enabled
FlexRay E-Ray module, 2-node support, compliant with FlexRay Protocol Specification v2.1, configurable timing parameters
I/O Lines Up to 118 general-purpose digital I/O pins, programmable pull-up/down, interrupt-capable inputs
Supply Voltage 3.0 V to 5.5 V single supply, supports automotive battery voltage transients per ISO 7637-2

Pinout & Package

XC2387C136F100LABKXUMA1 is housed in a 144-pin Green LQFP package (19.7 mil / 0.5 mm pitch), RoHS-compliant, with exposed thermal pad. Pin functions are defined across eight port groups (P0–P7), each supporting multiple alternate functions including CANH/CANL, FlexRay CHA/CHB, USIC channels, and ADC inputs.

Pin/Terminal Circuit Role Design Meaning
P0.0–P0.15 Port 0 bidirectional I/O Configurable as GPIO, CAN0_TX/RX, or USIC0 channel signals; supports slew-rate control and Schmitt-trigger input
P1.0–P1.7 Port 1 bidirectional I/O Supports FlexRay CHA differential pair (P1.0/P1.1), E-Ray clock (P1.2), and ADC0 inputs (P1.4–P1.7)
P2.0–P2.7 Port 2 bidirectional I/O Includes CAN1_TX/RX (P2.0/P2.1), USIC1 channels, and CCU60 PWM outputs (P2.4–P2.7)
P3.0–P3.7 Port 3 bidirectional I/O Hosts CAN2_TX/RX (P3.0/P3.1), ADC1 inputs (P3.2–P3.7), and GPT12E timer signals
VDD, VSS Power supply terminals Multiple VDD/VSS pairs distributed across package edges for low-noise operation and EMI reduction
OSCIN/OSCOUT External crystal oscillator interface Supports 1–20 MHz external crystal; internal oscillator circuitry enables clock source redundancy
TRST, TCK, TMS, TDO, TDI JTAG debug interface IEEE 1149.1-compliant boundary-scan and on-chip debug access via Device Access Port (DAP)

Key Features

Feature Design Value
TriCore CPU with MPU Enables real-time task isolation and memory protection for ASIL-B software partitioning without external MMU
ECC-protected Flash & SRAM Corrects single-bit errors and detects double-bit errors in program/data memory, meeting ISO 26262 FIT requirements
Dual synchronizable ADCs Allows simultaneous sampling of engine position and current feedback in motor control, reducing phase mismatch latency
CCU6x PWM units Four independent capture/compare units with dead-time insertion and emergency shutdown for 3-phase inverter gate drive
MultiCAN with gateway mode Routes messages between three CAN networks (e.g., powertrain, chassis, body) without host CPU intervention
FlexRay E-Ray module Meets ISO 17458-4 timing constraints for time-triggered communication in brake-by-wire and steer-by-wire ECUs

Applications

Engine Control Unit (ECU) Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel engines.

IC Role / Device Role / Timing Role: Primary controller executing ASAM-MCD2 MC calibration routines with deterministic 100 MHz instruction throughput and hardware CRC for flash integrity.

Use Value: Integrated MultiCAN (3 nodes) enables direct connection to crankshaft/camshaft sensors, throttle actuator, and exhaust gas recirculation valve - eliminating external bus bridges.

Use Scenario: Closed-loop torque assist control using motor current, steering angle, and vehicle speed inputs.

IC Role / Device Role / Timing Role: Safety-critical host MCU managing dual-core lockstep monitoring, CCU6x PWM for 3-phase inverter, and FlexRay for steering column ECU synchronization.

Use Value: On-chip E-Ray controller meets ISO 17458-4 jitter and latency specs (<2 µs deviation), enabling time-triggered coordination with brake and suspension ECUs.

Brake-by-Wire System Transmission Control Module (TCM)

Use Scenario: Redundant hydraulic pressure modulation and fail-operational braking response under fault conditions.

IC Role / Device Role / Timing Role: Dual-core capable controller running ASIL-D software partitions with MPU-enforced memory separation and ECC-protected code storage.

Use Value: 1.6 MB Flash with ECC allows full diagnostic stack, boot loader, and application firmware in one die - reducing BOM count and board area.

Use Scenario: Gear shift scheduling, clutch engagement timing, and torque converter lock-up control in automatic transmissions.

IC Role / Device Role / Timing Role: High-speed deterministic processor interfacing with transmission solenoids via PWM (CCU6x), gear position sensors (ADC), and CAN network (MultiCAN).

Use Value: Two synchronizable 10-bit ADCs sample turbine and output shaft speed simultaneously, enabling precise slip ratio calculation without external synchronization logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2388C136F100LABKXUMA1 Same package and pinout; adds 128 KB additional PSRAM (1248 KB vs. 1120 KB), no change to Flash or peripheral set Preferred where larger runtime data buffers are required (e.g., adaptive learning algorithms in TCM) Select when >1120 KB PSRAM needed; otherwise identical footprint and software compatibility
TC275T128F133NACXUMA1 TriCore-based successor with 200 MHz CPU, 2 MB Flash, 512 KB RAM, and enhanced safety features (lockstep, SMU) Targets ASIL-D systems requiring higher compute throughput and certified safety mechanisms not present in XC2387C Choose for new designs needing ISO 26262 ASIL-D certification; not drop-in compatible due to pinout and peripheral register changes

Compared with XC2387C136F100LABKXUMA1, XC2388C offers expanded PSRAM for complex state estimation, while TC275 provides higher performance and integrated safety mechanisms - but requires full hardware and software redesign.

Availability

XC2387C136F100LABKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering modules, and brake-by-wire systems requiring stable component supply, long-term automotive lifecycle support, and traceable sourcing.

Supply support for XC2387C136F100LABKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing facilities.

This device belongs to the XC2000 High Line microcontroller product line, designed specifically for deterministic real-time automotive applications including powertrain, chassis, and advanced driver assistance systems (ADAS) control.

FAQ

Does XC2387C136F100LABKXUMA1 support JTAG debugging?

Yes, it supports IEEE 1149.1-compliant JTAG debugging via dedicated TRST, TCK, TMS, TDO, and TDI pins. The on-chip Device Access Port (DAP) enables full visibility into CPU registers, memory, and peripheral states during development and validation - critical for AUTOSAR OS integration and timing analysis.

What is the maximum operating temperature range for this MCU?

The XC2387C136F100LABKXUMA1 is qualified for automotive grade AEC-Q100 Grade 2 operation, with ambient temperature range from −40 °C to +105 °C. Thermal resistance values (RthJA = 32.5 K/W) are specified for the 144-pin LQFP package under JEDEC JESD51-2 conditions.

Is FlexRay functionality enabled by default on this part?

No - FlexRay (E-Ray) is an optional peripheral; its presence depends on factory configuration and fuse settings. The XC2387C136F100LABKXUMA1 datasheet confirms E-Ray is included, but operation requires correct pad configuration (e.g., P1.0/P1.1 as CHA differential pair) and initialization of E-Ray registers per ISO 17458-4 timing constraints.

How does the Peripheral Event Controller (PEC) improve real-time performance?

The PEC enables eight-channel, interrupt-driven, single-cycle data transfers between peripherals and memory without CPU involvement. It uses 24-bit pointers covering the full 16 MB address space, allowing autonomous DMA-like movement of ADC results or CAN message objects - reducing interrupt latency and freeing CPU cycles for control law computation.

XC2387C136F100LABKXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
144-LQFP Exposed Pad
Series:
XC23xxC
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
C166SV2
Core Size:
16/32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
I2S, POR, PWM, WDT
Number of I/O:
118
Program Memory Size:
1.088MB (1.088M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
90K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

XC2387C136F100LABKXUMA1 FAQ

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Please submit a Request for Quotation (RFQ) for XC2387C136F100LABKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of XC2387C136F100LABKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2387C136F100LABKXUMA1 is usually 5 days.

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XC2387C136F100LABKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2387C136F100LABKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2387C136F100LABKXUMA1?

For technical support, including XC2387C136F100LABKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2387C136F100LABKXUMA1 requirements.

6.How does Aetrix verify that XC2387C136F100LABKXUMA1 is sourced from the original manufacturer or authorized distributors?

All XC2387C136F100LABKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2387C136F100LABKXUMA1 meets industry standards.

7.What is the process for return or replacement of XC2387C136F100LABKXUMA1?

All XC2387C136F100LABKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XC2387C136F100LABKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2387C136F100LABKXUMA1 part is unused and in its original packaging.

Return procedure for XC2387C136F100LABKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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