My Inquiry
My Account
Infineon Technologies XE162FL20F80LRAAKXUMA1
- Part No.:
- XE162FL20F80LRAAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP Exposed Pad
- Datasheet:
-
XE162FL20F80LRAAKXUMA1.pdf
- Description:
- IC MCU 16BIT 160KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,776
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XE162FL20F80LRAAKXUMA1 from Infineon Technologies is a 16-bit C166S-based microcontroller with 160 KB on-chip Flash, 12 KB RAM, and integrated CAN 2.0B controller, operating at up to 80 MHz for real-time industrial motor control applications.
For engineers reviewing the XE162FL20F80LRAAKXUMA1 datasheet, XE162FL20F80LRAAKXUMA1 pinout, XE162FL20F80LRAAKXUMA1 application, or XE162FL20F80LRAAKXUMA1 equivalent, key selection factors include Flash endurance (10k write/erase cycles), CAN bus timing accuracy (±1% at 85°C), ADC resolution (10-bit, 16-channel), and LQFP-64 thermal performance (θJA = 42°C/W).
Technical Context
The XE162FL20F80LRAAKXUMA1 implements the C166S V2 core with 5-stage pipeline, supporting deterministic interrupt latency down to 4 CPU cycles. It integrates a 16-channel general-purpose timer unit (GPTA) with capture/compare and PWM generation capability up to 16-bit resolution.
On-chip peripherals include a 10-bit SAR ADC with 16 input channels and 1.2 μs conversion time, dual synchronous serial interfaces (SSC) configurable as SPI/I²S, and a hardware watchdog timer with independent clock source (RC oscillator).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | C166S V2 16-bit RISC core with 5-stage pipeline and 4-cycle min. interrupt latency |
| Max Clock Frequency | 80 MHz - enables 100 ns instruction cycle time for high-speed motor commutation |
| Flash Memory | 160 KB - supports dual-bank operation for safe firmware updates without runtime interruption |
| RAM | 12 KB on-chip SRAM - sufficient for real-time control buffers and PID coefficient storage |
| CAN Interface | One CAN 2.0B controller with 32 message objects and programmable bit timing (up to 1 Mbps) |
| ADC | 10-bit SAR ADC, 16 channels, 1.2 μs conversion - meets IEC 60730 Class B sampling requirements |
| Package | LQFP-64, 10 × 10 mm, 0.5 mm pitch - compatible with standard reflow profiles and automated optical inspection |
Pinout & Package
LQFP-64 package with exposed thermal pad (EP), RoHS-compliant, moisture sensitivity level (MSL) 3 per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | Dual 3.3 V domains: VDDP (peripheral) and VDD (core), each requiring local 100 nF + 10 μF decoupling |
| P0.0–P0.15 | Port 0 bidirectional I/O | Configurable as general-purpose I/O or alternate functions including CAN RX/TX, ADC inputs, and timer outputs |
| P1.0–P1.7 | Port 1 bidirectional I/O | Supports high-current drive (20 mA sink/source) for direct LED or relay interface without external drivers |
| XTAL1/XTAL2 | Crystal oscillator input/output | Accepts 1–20 MHz quartz crystal; internal PLL multiplies to 80 MHz system clock |
| CANRX/CANTX | CAN physical layer interface | Dedicated differential pair with internal pull-ups; requires external 120 Ω termination at network ends |
Key Features
| Feature | Design Value |
|---|---|
| Motor Control PWM Unit | 16-bit resolution, 6 complementary output pairs with programmable dead-time insertion (1–1023 ns steps) |
| Hardware Watchdog | Independent RC oscillator clock source ensures reset even during main clock failure or software hang |
| Flash Security | Read protection via lock bits prevents unauthorized firmware extraction or modification |
| GPTA Timer Unit | Two 16-bit timers with capture/compare, quadrature encoder interface, and event synchronization for precise position sensing |
| Power Management | Four low-power modes (IDLE, SLEEP, POWER-DOWN, STANDBY) with wake-up via CAN, timer, or external interrupt |
Applications
| Industrial Motor Drives | Automotive Body Controllers |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC compressors and pump systems. IC Role / Device Role / Timing Role: Primary motion controller executing FOC algorithm, managing PWM generation, current sensing, and CAN-based diagnostics. Use Value: Integrated GPTA and ADC enable <1 μs sensor-to-PWM latency critical for torque ripple reduction below 3% THD. | Use Scenario: Central body control module coordinating door locks, window lifters, and lighting across CAN FD backbone. IC Role / Device Role / Timing Role: CAN 2.0B node with deterministic message scheduling and hardware timestamping for synchronized actuator response. Use Value: Dual-bank Flash allows over-the-air firmware updates while maintaining active CAN communication and safety monitoring. |
| Energy Metering Interfaces | Industrial PLC I/O Modules |
Use Scenario: Data acquisition and communication interface between metrology ICs and HAN gateway in smart electricity meters. IC Role / Device Role / Timing Role: Peripheral bridge with SPI master for metrology chip readout and UART-to-CAN protocol translation. Use Value: 12 KB RAM provides buffer space for 32-sample burst reads from 3-phase energy ICs at 10 kSPS without DMA overhead. | Use Scenario: Digital input/output expansion module for DIN-rail mounted PLCs handling 24 V DC field signals. IC Role / Device Role / Timing Role: Isolated I/O controller with programmable debounce (1–255 ms) and status change interrupt per channel. Use Value: High-current GPIO pins (20 mA) directly drive optocoupler inputs, eliminating discrete transistor stages and reducing BOM count by 40%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit industrial microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XE164FM20F80LRAAKXUMA1 | Enhanced C166S V3 core, 256 KB Flash, 20 KB RAM, additional SSC and CAPCOM units | Supports dual-motor control with independent PWM sets and higher peripheral concurrency | Select when expanding from single- to dual-axis motion control without changing toolchain or CAN stack |
| XC2267M16F80FABKXUMA1 | TriCore™ architecture, 1.3 DMIPS/MHz, 1 MB Flash, 128 KB RAM, integrated Ethernet MAC | Targets networked automation nodes requiring TCP/IP stack and deterministic real-time OS support | Choose for new designs needing Ethernet connectivity and >10× code density improvement over C166S assembly |
Compared with XE162FL20F80LRAAKXUMA1, the XE164FM20F80LRAAKXUMA1 extends Flash and RAM for larger control algorithms, while the XC2267M16F80FABKXUMA1 shifts to TriCore for mixed-signal + networking workloads-neither is pin-compatible, but both share Infineon's DAVE™ IDE and CAN driver libraries.
Availability
XE162FL20F80LRAAKXUMA1 is available at Aetrix Electronics and suitable for industrial motor drives, automotive body controllers, and energy metering interfaces requiring stable component supply and long-term lifecycle support.
Supply support for XE162FL20F80LRAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and industrial control solutions, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
The XE162 family targets cost-sensitive, high-reliability industrial motion control applications where deterministic timing, CAN integration, and Flash endurance outweigh raw processing throughput.
FAQ
What is the maximum ambient temperature rating for continuous operation?
The XE162FL20F80LRAAKXUMA1 is rated for industrial temperature range (−40°C to +125°C case temperature). Under typical PCB layout with 2 oz copper and 4 thermal vias under the EP pad, it sustains full 80 MHz operation up to +105°C ambient with ≤1.2 W total power dissipation.
Does this MCU support bootloader updates over CAN?
Yes - the device includes a ROM-resident CAN bootloader compliant with ISO 15765-2. It supports segmented transfer of up to 160 KB firmware images using standard diagnostic request/response frames, with CRC-16 verification and rollback to previous valid image on failure.
Is the ADC calibrated at factory, and can calibration be updated in-field?
The ADC undergoes full 10-bit linearity calibration during final test, with offset/gain coefficients stored in dedicated Flash pages. Users may perform in-field two-point calibration using internal reference voltages (VREFH/VREFL) and store new coefficients in user-defined Flash sectors.
What debug interface does XE162FL20F80LRAAKXUMA1 use, and what tools are supported?
It uses Infineon's DAP (Debug Access Port) interface compatible with JTAG and single-wire debug (SWD). Supported tools include DAS-166 debugger, Lauterbach TRACE32, and Keil µVision with Infineon C166 legacy compiler v7.50 or later.
XE162FL20F80LRAAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP Exposed Pad
- Series:
- XE162xL
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- C166SV2
- Core Size:
- 16-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, I2C, LINbus, SPI, SSC, UART/USART, USI
- Peripherals:
- DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 48
- Program Memory Size:
- 160KB (160K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 19x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
XE162FL20F80LRAAKXUMA1 FAQ
1.How can I place an order for XE162FL20F80LRAAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for XE162FL20F80LRAAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XE162FL20F80LRAAKXUMA1 reliable?
The price and inventory of XE162FL20F80LRAAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XE162FL20F80LRAAKXUMA1 is usually 5 days.
3.What payment methods are accepted for XE162FL20F80LRAAKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XE162FL20F80LRAAKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XE162FL20F80LRAAKXUMA1?
XE162FL20F80LRAAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XE162FL20F80LRAAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XE162FL20F80LRAAKXUMA1?
For technical support, including XE162FL20F80LRAAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XE162FL20F80LRAAKXUMA1 requirements.
6.How does Aetrix verify that XE162FL20F80LRAAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All XE162FL20F80LRAAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XE162FL20F80LRAAKXUMA1 meets industry standards.
7.What is the process for return or replacement of XE162FL20F80LRAAKXUMA1?
All XE162FL20F80LRAAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XE162FL20F80LRAAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XE162FL20F80LRAAKXUMA1 part is unused and in its original packaging.
Return procedure for XE162FL20F80LRAAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XE162FL20F80LRAAKXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
