Infineon Technologies XE162FM72F80LAAFXUMA1
- Part No.:
- XE162FM72F80LAAFXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
XE162FM72F80LAAFXUMA1.pdf
- Description:
- IC MCU 16BIT 576KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,065
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Product details
Overview
XE162FM72F80LAAFXUMA1 from Infineon Technologies is a 16-bit real-time signal controller in the XE166 family, featuring an 80 MHz CPU clock (12.5 ns instruction cycle), 576 KB on-chip Flash, 16 KB DSRAM, and integrated MultiCAN Rev. 2.0B with up to 64 message objects across two CAN nodes. It supports motor control, industrial automation, and power conversion systems requiring deterministic timing and robust peripheral integration.
For engineers reviewing the XE162FM72F80LAAFXUMA1 datasheet, XE162FM72F80LAAFXUMA1 pinout, XE162FM72F80LAAFXUMA1 application, or XE162FM72F80LAAFXUMA1 equivalent, key selection criteria include its 80 MHz C166-compatible CPU core, dual 10-bit ADCs with <1 µs conversion time, CCU60-based PWM generation, and 64-pin LQFP package with 40 GPIO lines and JTAG/DAP debug support.
Technical Context
The XE162FM72F80LAAFXUMA1 implements a five-stage pipelined C166 CPU core with MPU, supporting single-cycle 16×16 multiply and MAC operations, zero-cycle jumps, and fast context switching via dual local register banks. Its memory subsystem includes ECC-protected Flash, SBRAM, DPRAM, and PSRAM with 16 MB linear addressing.
Peripheral integration centers on real-time control: two synchronizable 10-bit ADCs (9 channels total), CCU60 for flexible PWM, CAPCOM2 (16-channel), GPT12E timers, MultiCAN (2 nodes, 64 message objects), and USIC modules configurable as UART/LIN/SPI/I²C/I²S. Clocking uses an on-chip PLL with selectable internal/external sources and wakeup timer support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | C166 v3, 5-stage pipeline, 80 MHz max clock (12.5 ns cycle time) |
| Flash Memory | 576 KB on-chip, ECC-protected, program/data storage with boot loader support |
| RAM | 16 KB DSRAM + 8 KB SBRAM + 2 KB DPRAM + up to 32 KB PSRAM |
| ADC | Two 10-bit converters, 9 total channels, <1 µs conversion time, broken-wire detection |
| PWM Generation | CCU60 unit with center-aligned, edge-aligned, and dead-time configurable outputs |
| CAN Interface | MultiCAN Rev. 2.0B, 2 independent nodes, 64 message objects, gateway functionality |
| Package | 64-pin Green LQFP, 0.5 mm pitch, RoHS-compliant |
| I/O Lines | Up to 40 general-purpose digital I/O pins with programmable pull-up/down |
Pinout & Package
XE162FM72F80LAAFXUMA1 is housed in a 64-pin Green LQFP package (10 mm × 10 mm, 0.5 mm pitch) with exposed thermal pad per Infineon's packaging specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Single 3.0–5.5 V supply domain; multiple VDD/VSS pairs ensure low-noise analog/digital separation |
| P0.0–P0.15 | Port 0 bidirectional I/O | 16-bit port with alternate functions including CAN0_TX/RX, USIC0, and timer capture inputs |
| P1.0–P1.15 | Port 1 bidirectional I/O | 16-bit port supporting ADC input channels, CCU60 outputs, and external interrupt sources |
| P2.0–P2.7 | Port 2 bidirectional I/O | 8-bit port with JTAG/DAP debug interface pins (TCK, TMS, TDI, TDO, TRST) |
| OSCIN/OSCOUT | Crystal oscillator input/output | Supports external crystal (1–20 MHz) or external clock source for PLL input |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; debounced by on-chip oscillator watchdog |
| BOOT0 | Boot mode select | Configures boot source: internal Flash (high) or on-chip ROM bootloader (low) |
Key Features
| Feature | Design Value |
|---|---|
| Memory Protection Unit (MPU) | Enables secure partitioning of code/data space with region-based access control and violation trapping |
| Peripheral Event Controller (PEC) | Enables eight-channel DMA-like transfers without CPU intervention, using 24-bit address pointers |
| Hardware CRC Checker | Programmable polynomial engine for ECC supervision of Flash, SRAM, and peripheral register blocks |
| Real-Time Clock (RTC) | Dedicated 32-bit counter with calendar support, battery-backed operation, and alarm interrupt |
| On-Chip Debug Support | Full JTAG and Device Access Port (DAP) interfaces for non-intrusive trace, breakpoint, and memory inspection |
Applications
| Motor Control Systems | Industrial PLC Modules |
|---|---|
Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase PMSM/BLDC motors in HVAC compressors and industrial drives. IC Role / Device Role / Timing Role: Real-time signal controller executing FOC algorithms, generating synchronized PWM via CCU60, sampling current/voltage via dual ADCs, and managing CAN-based command interface. Use Value: Deterministic 80 MHz execution enables sub-µs current loop update rates; dual ADC synchronization ensures precise phase current measurement without skew. | Use Scenario: Modular I/O processing and logic execution in DIN-rail mounted programmable logic controllers for factory automation. IC Role / Device Role / Timing Role: Central controller handling discrete I/O scanning, ladder logic execution, serial protocol bridging (CAN ↔ RS-485), and real-time task scheduling. Use Value: Integrated MultiCAN with 64 message objects allows concurrent management of multiple fieldbus nodes; 40 GPIO lines support direct connection to opto-isolated digital inputs/outputs. |
| Renewable Energy Inverters | Automotive Body Control Units |
Use Scenario: Grid-tied solar microinverters requiring high-efficiency MPPT tracking and isolated DC-AC conversion. IC Role / Device Role / Timing Role: Signal controller managing MPPT algorithm, isolated gate driver timing, grid-synchronization via PLL, and safety monitoring (overvoltage, overtemperature). Use Value: On-chip PLL with fast lock time (<100 µs) enables rapid grid re-synchronization after fault recovery; ECC-protected Flash ensures firmware integrity under EMI stress. | Use Scenario: Central body controller coordinating door locks, lighting, window lift, and climate fan in mid-tier passenger vehicles. IC Role / Device Role / Timing Role: CAN-connected node executing LIN master/slave communication, PWM-controlled LED dimming, and analog sensor signal conditioning (NTC, potentiometer). Use Value: Dual USIC modules support simultaneous LIN (body network) and SPI (LED driver IC) interfaces; 10-bit ADCs provide 12-bit effective resolution via oversampling for precision cabin temperature sensing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time signal controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XE164FM72F80LAAFXUMA1 | Enhanced peripheral set: additional CCU61 unit, extra USIC channel, larger PSRAM (64 KB vs. 32 KB) | Required for multi-motor systems needing independent PWM domains or higher serial protocol concurrency | Select when additional hardware timer resources or expanded memory bandwidth are needed beyond XE162FM baseline |
| XC2267M-104F80LAAFXUMA1 | TriCore™ architecture, 80 MHz, 1 MB Flash, 128 KB RAM, but no MultiCAN-only single CAN node with 32 objects | Suitable for high-performance control where CAN gateway or dual-node routing is not required | Prefer for applications prioritizing raw compute throughput and large code footprint over dual-CAN topology |
Compared with XE164FM72F80LAAFXUMA1, this part trades peripheral expansion for cost-sensitive integration; versus XC2267M, it retains dual-CAN routing capability at lower memory density-making it optimal for CAN-based distributed control where node count and message object depth are critical.
Availability
XE162FM72F80LAAFXUMA1 is available at Aetrix Electronics and suitable for motor control systems, industrial PLC modules, and renewable energy inverters requiring stable component supply, long-term lifecycle support, and automotive-grade reliability.
Supply support for XE162FM72F80LAAFXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and security solutions, headquartered in Munich.
The XE166 family targets real-time embedded control in industrial, automotive, and renewable energy applications, emphasizing deterministic timing, functional safety readiness, and integrated analog/mixed-signal peripherals.
FAQ
What is the maximum operating frequency and corresponding instruction cycle time?
The XE162FM72F80LAAFXUMA1 operates at a maximum CPU clock frequency of 80 MHz, delivering a 12.5 ns instruction cycle time. This timing is achieved using the on-chip PLL with external crystal or clock input, and is validated across the full industrial temperature range (−40°C to +125°C) per datasheet Section 4.1.2.
Does this device support hardware-based memory protection and error correction?
Yes-it integrates a Memory Protection Unit (MPU) for region-based code/data access control and Error Correction Code (ECC) circuitry for on-chip Flash and SRAM. ECC detects and corrects single-bit errors and detects double-bit errors, as specified in Sections 3.3 and 4.5 of the datasheet.
How many CAN nodes and message objects does the MultiCAN module support?
The MultiCAN module supports up to two independent CAN nodes (CAN0 and CAN1), each configurable with up to 64 message objects in total. Message objects are allocated dynamically across nodes and support Full CAN and Basic CAN modes per ISO 11898-1 Rev. 2.0B, as detailed in Section 3.13.
What debug interfaces are available and how are they accessed?
The device provides both JTAG and Device Access Port (DAP) interfaces for on-chip debug. JTAG uses standard TCK/TMS/TDI/TDO/TRST pins on Port 2; DAP operates over a 2-pin SWD-like serial interface accessible via dedicated DAP pins. Both support full breakpoint, trace, and memory access per Section 3.6.
XE162FM72F80LAAFXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP
- Series:
- XE16x
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- C166SV2
- Core Size:
- 16-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
- Peripherals:
- I2S, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 576KB (576K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 50K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 9x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
XE162FM72F80LAAFXUMA1 FAQ
1.How can I place an order for XE162FM72F80LAAFXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for XE162FM72F80LAAFXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XE162FM72F80LAAFXUMA1 reliable?
The price and inventory of XE162FM72F80LAAFXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XE162FM72F80LAAFXUMA1 is usually 5 days.
3.What payment methods are accepted for XE162FM72F80LAAFXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XE162FM72F80LAAFXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XE162FM72F80LAAFXUMA1?
XE162FM72F80LAAFXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XE162FM72F80LAAFXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XE162FM72F80LAAFXUMA1?
For technical support, including XE162FM72F80LAAFXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XE162FM72F80LAAFXUMA1 requirements.
6.How does Aetrix verify that XE162FM72F80LAAFXUMA1 is sourced from the original manufacturer or authorized distributors?
All XE162FM72F80LAAFXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XE162FM72F80LAAFXUMA1 meets industry standards.
7.What is the process for return or replacement of XE162FM72F80LAAFXUMA1?
All XE162FM72F80LAAFXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XE162FM72F80LAAFXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XE162FM72F80LAAFXUMA1 part is unused and in its original packaging.
Return procedure for XE162FM72F80LAAFXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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