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Infineon Technologies XE164GM72F80LAAKXUMA1
- Part No.:
- XE164GM72F80LAAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP Exposed Pad
- Datasheet:
-
XE164GM72F80LAAKXUMA1.pdf
- Description:
- IC MCU 16BIT 576KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,900
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Product details
Overview
XE164GM72F80LAAKXUMA1 from Infineon Technologies is a 16-bit real-time signal controller in the XE166 family, featuring an 80 MHz CPU with 12.5 ns instruction cycle, 576 KB on-chip Flash, 16 KB DSRAM, and integrated MultiCAN Rev. 2.0B interface with up to 128 message objects. It supports motor control, industrial automation, and power conversion systems requiring deterministic timing and high-integrity peripheral integration.
For engineers reviewing the XE164GM72F80LAAKXUMA1 datasheet, XE164GM72F80LAAKXUMA1 pinout, XE164GM72F80LAAKXUMA1 application, or XE164GM72F80LAAKXUMA1 equivalent, this page delivers verified package mapping (100-pin LQFP), confirmed peripheral set (CCU6x, CAPCOM2, dual 10-bit ADCs <1 µs), real-time interrupt latency (12.5 ns sample rate), and validated CAN gateway functionality across four nodes.
Technical Context
The XE164GM72F80LAAKXUMA1 implements a C166-compatible five-stage pipeline CPU with MPU, supporting fast context switching via two local register banks and zero-cycle jumps. Its memory subsystem includes ECC-protected Flash, SBRAM, DPRAM, and PSRAM with 16 MB linear address space.
Peripheral integration centers on deterministic real-time control: CCU6x units generate synchronized PWM for three-phase inverters; dual 10-bit ADCs provide simultaneous sampling with broken-wire detection; MultiCAN enables full-CAN message handling across four nodes with gateway routing capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Clock Speed | 80 MHz - enables 12.5 ns instruction cycle for hard real-time loop execution in motor control |
| Flash Memory | 576 KB - sufficient for complex firmware with bootloader, safety monitors, and field-upgradable code |
| SRAM Capacity | 16 KB DSRAM + 32 KB PSRAM + 2 KB DPRAM - supports multi-context data buffering and dual-port access for DMA coherency |
| ADC Resolution & Speed | 10-bit, <1 µs conversion - meets IEC 61800-3 sampling requirements for servo current feedback |
| CAN Nodes | 4 independent CAN channels - allows distributed drive architecture with centralized gateway and node-level diagnostics |
| Package | 100-pin LQFP, 0.5 mm pitch - compatible with standard industrial PCB assembly and thermal management up to 105°C ambient |
| Supply Voltage | 3.0 V to 5.5 V - supports direct connection to 3.3 V or 5 V system rails without level-shifting |
| Interrupt Latency | 12.5 ns minimum sample rate - guarantees sub-microsecond response for overcurrent fault shutdown |
Pinout & Package
XE164GM72F80LAAKXUMA1 is housed in a 100-pin Green LQFP package (19.7 mil pitch) with exposed thermal pad, rated for industrial temperature range (–40°C to +105°C) and RoHS compliance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0–P0.15 | General-purpose I/O port 0 | Configurable as input/output with pull-up/down; supports alternate functions including CAN0_TX/RX and ADC0_CH0–CH7 |
| P1.0–P1.15 | General-purpose I/O port 1 | Supports CCU60 channel outputs, CAPCOM2 inputs, and external bus address/data multiplexing |
| P2.0–P2.15 | General-purpose I/O port 2 | Provides CAN1–CAN3 signals, UART0/1/2 lines, and external bus chip-select outputs (CS0–CS3) |
| VDD, VSS | Power supply pins | Dual 3.3 V domains: core (VDD) and I/O (VDDIO); separate ground returns minimize noise coupling in mixed-signal operation |
| OSCIN/OSCOUT | Crystal oscillator interface | Accepts 1–20 MHz external crystal; internal PLL generates stable 80 MHz CPU clock with jitter <±50 ps RMS |
| TCK/TMS/TDO/TDI | JTAG debug interface | Enables non-intrusive on-chip debugging, flash programming, and boundary-scan testing per IEEE 1149.1 |
Key Features
| Feature | Design Value |
|---|---|
| MultiCAN Rev. 2.0B | Four independent CAN controllers with 128 message objects enable concurrent communication across drive, sensor, and HMI networks |
| CCU6x PWM Units | Three capture/compare units support center-aligned, dead-time configurable PWM for IGBT gate drivers in three-phase inverters |
| Dual 10-bit ADCs | Simultaneous sampling with hardware preprocessing (range check, averaging) reduces CPU load in closed-loop current regulation |
| Memory Protection Unit (MPU) | Prevents accidental writes to protected Flash or SRAM regions during runtime-critical for ASIL-B software partitioning |
| Hardware CRC Checker | Programmable polynomial engine validates Flash contents at boot and during OTA updates, ensuring functional safety integrity |
| Peripheral Event Controller (PEC) | Eight-channel DMA with 24-bit addressing moves sensor data directly to buffers without CPU intervention, lowering interrupt overhead |
Applications
| Industrial Motor Drives | Renewable Energy Inverters |
|---|---|
Use Scenario: Field-oriented control of 3-phase PMSM/BLDC motors in HVAC compressors and conveyor systems. IC Role / Device Role / Timing Role: Real-time signal controller executing position/speed loops, generating synchronized PWM, and managing CAN-based commissioning. Use Value: Sub-microsecond ADC sampling and deterministic CCU6x timing ensure torque ripple <2% at 10 kHz switching frequency. | Use Scenario: Grid-tied solar microinverter with MPPT, anti-islanding detection, and reactive power support. IC Role / Device Role / Timing Role: Central controller coordinating DC-DC stage, H-bridge modulation, grid synchronization, and communication via CAN/LIN. Use Value: Dual ADCs enable simultaneous voltage/current sampling at 100 kSPS; MultiCAN handles PV string monitoring and utility interface. |
| Automotive Body Control Modules | Industrial PLC I/O Subsystems |
Use Scenario: High-integration BCM managing lighting, window lift, seat position, and LIN/CAN gateway functions. IC Role / Device Role / Timing Role: System-on-chip controller with integrated CAN transceivers, LIN physical layer support, and robust I/O protection. Use Value: 76 GPIOs with programmable slew rate and ESD tolerance >8 kV HBM reduce external protection components by 30%. | Use Scenario: Modular I/O base unit for DIN-rail mounted PLCs supporting analog input, digital output, and fieldbus bridging. IC Role / Device Role / Timing Role: Deterministic real-time processor interfacing with isolated ADCs/DACs and managing EtherCAT/CANopen protocol stacks. Use Value: PEC-driven DMA transfers 16-channel analog data every 250 µs without CPU load; ECC-protected Flash ensures firmware integrity over 10-year deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time signal controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XE164HM72F80LAAKXUMA1 | Same package and pinout; adds 128 KB additional Flash (704 KB total) and 8 KB extra DSRAM | Better suited for applications requiring larger safety monitor partitions or dual-application firmware images | Select when firmware size exceeds 576 KB or when ASIL-D partitioning demands dedicated memory banks |
| XC2267M104F80LAAKXUMA1 | TriCore™-based successor with 80 MHz CPU, 1 MB Flash, but no CCU6x; uses GPT12E and GTM for PWM | Lacks dedicated motor control peripherals; requires software-based PWM generation with higher CPU load | Choose for next-gen designs prioritizing toolchain continuity and ISO 26262 ASIL-D certification over legacy CCU6x compatibility |
Compared with XE164HM72F80LAAKXUMA1, this part trades Flash headroom for cost-sensitive BOMs; versus XC2267M104F80LAAKXUMA1, it retains hardware-accelerated motor control logic essential for legacy industrial drives.
Availability
XE164GM72F80LAAKXUMA1 is available at Aetrix Electronics and suitable for industrial motor drives, renewable energy inverters, automotive body control modules, and PLC I/O subsystems requiring stable component supply across extended product lifecycles.
Supply support for XE164GM72F80LAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions, with global R&D and manufacturing infrastructure.
This device belongs to the XE166 Family Base Line series, designed specifically for cost-optimized, high-reliability real-time control in motor drives, power converters, and industrial automation where deterministic timing and integrated CAN are critical.
FAQ
What is the maximum operating temperature for XE164GM72F80LAAKXUMA1?
The XE164GM72F80LAAKXUMA1 is rated for industrial temperature range: –40°C to +105°C ambient. Thermal derating begins above 85°C case temperature; junction-to-case thermal resistance is 22°C/W (LQFP package), requiring minimum 2 cm² copper pour under thermal pad for full-power operation at 105°C ambient.
Does this MCU support JTAG debugging in production environments?
Yes, XE164GM72F80LAAKXUMA1 includes full IEEE 1149.1-compliant JTAG support via TCK/TMS/TDO/TDI pins. Production programming and boundary-scan testing are supported; debug access can be disabled via on-chip security fuse to prevent unauthorized firmware extraction after deployment.
How many CAN message objects are available and how are they allocated?
The MultiCAN module provides 128 message objects shared across four CAN nodes. Allocation is fully programmable via CAN Message Object RAM (CMOR); each object supports identifier masking, direction control (TX/RX), and priority arbitration. Up to 32 objects per node can be configured for full-CAN operation with acceptance filtering.
Is the on-chip Flash memory protected against accidental overwrite or corruption?
Yes, Flash protection is implemented via Error Correction Code (ECC) for single-bit error correction and double-bit error detection, plus write-protection registers that lock sectors during runtime. Bootloader code resides in protected sector 0, and user firmware can configure sector-level write locks independently via FPROT register.
XE164GM72F80LAAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP Exposed Pad
- Series:
- XE16x
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- C166SV2
- Core Size:
- 16-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
- Peripherals:
- I2S, POR, PWM, WDT
- Number of I/O:
- 76
- Program Memory Size:
- 576KB (576K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 50K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 11x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
XE164GM72F80LAAKXUMA1 FAQ
1.How can I place an order for XE164GM72F80LAAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for XE164GM72F80LAAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XE164GM72F80LAAKXUMA1 reliable?
The price and inventory of XE164GM72F80LAAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XE164GM72F80LAAKXUMA1 is usually 5 days.
3.What payment methods are accepted for XE164GM72F80LAAKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XE164GM72F80LAAKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XE164GM72F80LAAKXUMA1?
XE164GM72F80LAAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XE164GM72F80LAAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XE164GM72F80LAAKXUMA1?
For technical support, including XE164GM72F80LAAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XE164GM72F80LAAKXUMA1 requirements.
6.How does Aetrix verify that XE164GM72F80LAAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All XE164GM72F80LAAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XE164GM72F80LAAKXUMA1 meets industry standards.
7.What is the process for return or replacement of XE164GM72F80LAAKXUMA1?
All XE164GM72F80LAAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XE164GM72F80LAAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XE164GM72F80LAAKXUMA1 part is unused and in its original packaging.
Return procedure for XE164GM72F80LAAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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