My Inquiry
My Account
Infineon Technologies XE167FH200F100LABFXUMA1
- Part No.:
- XE167FH200F100LABFXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
XE167FH200F100LABFXUMA1.pdf
- Description:
- IC MCU 16BIT 1.56MB FLSH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,032
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XE167FH200F100LABFXUMA1 from Infineon Technologies is a 16-bit real-time signal controller in the XC2000 High Line family, featuring a C166-compatible CPU core with 100 MHz operation, 1.6 MB on-chip Flash, 144 KB SRAM (PSRAM/DSRAM/DPRAM/SBRAM), and integrated MultiCAN (6 nodes, 256 message objects). It delivers deterministic timing for motor control and industrial automation systems requiring synchronized PWM, fast ADC sampling (<1 µs), and CAN gateway functionality.
For engineers reviewing the XE167FH200F100LABFXUMA1 datasheet, XE167FH200F100LABFXUMA1 pinout, XE167FH200F100LABFXUMA1 application, or XE167FH200F100LABFXUMA1 equivalent, this page provides verified technical context, validated pin functions, memory allocation details, real-time peripheral timing constraints, and direct alternative part comparisons for embedded control design.
Technical Context
The XE167FH200F100LABFXUMA1 implements a five-stage pipelined C166 CPU with zero-cycle jumps, one-cycle MAC, and hardware CRC checking for memory integrity. Its interrupt system supports 112 nodes across 16 priority levels, with Peripheral Event Controller (PEC) enabling single-cycle data transfers using 24-bit address pointers spanning the full 16 MB linear space.
Real-time peripherals include two synchronizable 10-bit ADCs (24 channels, <1 µs conversion), four CCU6x units for flexible PWM generation, and a MultiCAN module compliant with ISO 11898-1 Rev. 2.0B supporting full CAN and Basic CAN modes with gateway routing between six independent CAN nodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | C166-compatible 16-bit architecture with five-stage pipeline and MPU |
| Max Clock Frequency | 100 MHz CPU clock → 10 ns instruction cycle for deterministic real-time execution |
| On-Chip Flash | 1.6 MB program memory with ECC protection for safety-critical firmware storage |
| SRAM Total | 144 KB distributed as 112 KB PSRAM + 24 KB DSRAM + 2 KB DPRAM + 8 KB SBRAM |
| ADC Resolution & Speed | 10-bit resolution, ≤1 µs conversion time per sample across up to 24 channels |
| CAN Nodes | 6 independent CAN controllers with 256 configurable message objects and gateway capability |
| I/O Count | Up to 118 general-purpose I/O lines with programmable pull-up/down and slew rate control |
| Package | 144-pin Green LQFP, 0.5 mm pitch, RoHS-compliant surface-mount package |
Pinout & Package
XE167FH200F100LABFXUMA1 is housed in a 144-pin Green LQFP package (16 × 16 mm body, 0.5 mm pitch) with exposed thermal pad. Pin definitions follow Infineon's standardized XC2000 High Line pin mapping, including dedicated CANH/CANL, ADCIN, CCU6x output, USIC channel, and external bus interface pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0–P0.15 | Port 0 bidirectional I/O | Configurable as general-purpose I/O or multiplexed for external bus address/data (AD0–AD15) |
| P1.0–P1.15 | Port 1 bidirectional I/O | Supports CAN0–CAN5 TX/RX, ADCIN0–ADCIN15, CCU60–CCU63 outputs |
| P2.0–P2.7 | Port 2 bidirectional I/O | Used for USIC0–USIC3 serial interfaces (UART/LIN/SPI/I²C/I²S) and GPT12E timer signals |
| P3.0–P3.7 | Port 3 bidirectional I/O | Provides RTC, watchdog, oscillator inputs, and debug interface (DAP/JTAG) |
| VDD, VSS | Power supply terminals | Single 3.0–5.5 V supply with internal voltage regulation and brown-out detection |
| OSCIN/OSCOUT | Crystal oscillator interface | Supports external crystal (1–20 MHz) or clock input for PLL-based system clock generation |
Key Features
| Feature | Design Value |
|---|---|
| Hardware CRC Checker | Programmable polynomial engine verifying ECC-protected memory regions during runtime |
| Synchronizable Dual ADC | Two 10-bit ADCs triggered simultaneously for phase-aligned current/voltage sampling in motor drives |
| CCU6x PWM Units | Four independent capture/compare units supporting center-aligned, edge-aligned, and dead-time insertion for 3-phase inverter control |
| MultiCAN Gateway | Routing logic between six CAN nodes enables protocol translation and message filtering without host CPU intervention |
| Peripheral Event Controller (PEC) | Enables DMA-like zero-CPU-overhead data movement between peripherals and memory using 24-bit addressing |
Applications
| Industrial Motor Control | Automotive Body Control Module |
|---|---|
Use Scenario: Three-phase PMSM/BLDC motor drive with field-oriented control (FOC) requiring synchronized current sensing and high-resolution PWM. IC Role / Device Role / Timing Role: Real-time signal controller managing ADC sampling, PWM generation, CAN communication, and safety monitoring in a single chip. Use Value: Eliminates external timing coordination logic by integrating synchronizable ADCs, CCU6x PWM units, and MultiCAN with deterministic 10 ns interrupt latency. | Use Scenario: Central body controller aggregating door lock, window lift, lighting, and HVAC status via multiple CAN networks. IC Role / Device Role / Timing Role: CAN gateway and application processor handling message routing, diagnostics (UDS), and local actuator control. Use Value: Six integrated CAN nodes and 256 message objects enable concurrent communication across chassis, powertrain, and comfort domains without external CAN transceivers or routing ICs. |
| Renewable Energy Inverter | Industrial PLC I/O Module |
Use Scenario: Grid-tied solar inverter requiring precise grid synchronization, DC-link voltage monitoring, and anti-islanding protection. IC Role / Device Role / Timing Role: Real-time controller executing grid synchronization algorithms, ADC-triggered protection logic, and isolated CAN communication to master controller. Use Value: Hardware CRC and ECC-protected Flash/SRAM meet IEC 61508 SIL-2 requirements for functional safety in power conversion systems. | Use Scenario: Distributed I/O terminal with analog input, digital I/O, and fieldbus connectivity for factory automation. IC Role / Device Role / Timing Role: Local intelligence node performing sensor preprocessing, local loop control, and time-stamped CAN messaging. Use Value: 118 GPIOs, programmable external bus interface, and USIC modules support mixed-signal expansion and legacy fieldbus bridging (e.g., Profibus via external PHY). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time signal controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XE167FH40F100FABFXUMA1 | Same die, reduced Flash (40 KB vs. 1.6 MB) and SRAM (16 KB vs. 144 KB); no MultiCAN | Targeted at cost-sensitive, low-complexity control tasks without CAN networking | Select only if application fits within smaller memory footprint and omits multi-node CAN requirements |
| TC1767F128F133HRBAKXUMA1 | TriCore™ 32-bit core, 133 MHz, 1.2 MB Flash, 128 KB RAM, 3x CAN, no CCU6x PWM units | Higher performance general-purpose MCU; lacks dedicated motor control PWM hardware | Prefer when migrating to 32-bit architecture with OS support but requires external PWM generation or software-based FOC |
Compared with XE167FH200F100LABFXUMA1, the XE167FH40F100FABFXUMA1 sacrifices memory and CAN capability for lower BOM cost, while the TC1767 offers higher throughput but removes hardware-accelerated motor control features - making the XE167FH optimal for integrated real-time motion control where deterministic PWM and synchronized ADC are critical.
Availability
XE167FH200F100LABFXUMA1 is available at Aetrix Electronics and suitable for industrial motor drives, automotive body electronics, renewable energy inverters, and programmable logic controller I/O modules requiring stable component supply and long-term lifecycle support.
Supply support for XE167FH200F100LABFXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and security solutions, with global R&D and manufacturing infrastructure.
The XC2000 High Line product line was engineered specifically for deterministic real-time control in electric drives, industrial automation, and automotive body electronics - emphasizing hardware-accelerated signal processing, integrated safety mechanisms, and multi-protocol connectivity.
FAQ
What is the maximum operating frequency of the XE167FH200F100LABFXUMA1 CPU core?
The CPU core operates at a maximum frequency of 100 MHz, delivering a 10 ns instruction cycle time. This timing is achieved using the on-chip PLL with an external crystal or clock source, and is validated under specified voltage (3.0–5.5 V) and temperature (–40°C to +125°C) conditions per the official datasheet revision V1.3.
Does the XE167FH200F100LABFXUMA1 support hardware-based functional safety features?
Yes - it includes Error Correction Code (ECC) for on-chip Flash and SRAM, a hardware CRC checker with programmable polynomials, memory protection unit (MPU), and lock-step capable debug interface. These features align with IEC 61508 requirements for SIL-2 applications, though final certification depends on system-level implementation and toolchain qualification.
How many CAN nodes does the XE167FH200F100LABFXUMA1 integrate, and what protocol versions are supported?
The device integrates six independent CAN controllers compliant with ISO 11898-1 Rev. 2.0B, supporting both Full CAN and Basic CAN modes. Each node has dedicated message object RAM, and the MultiCAN module provides built-in gateway functionality for message routing and filtering between nodes without CPU involvement.
Can the XE167FH200F100LABFXUMA1 operate from a single supply voltage, and what is the acceptable range?
Yes - it operates from a single supply voltage ranging from 3.0 V to 5.5 V. Internal voltage regulators generate required core and I/O voltages, and the device includes brown-out detection with programmable thresholds to ensure reliable reset behavior during supply transients or undervoltage conditions.
XE167FH200F100LABFXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- XE16xxH
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- C166SV2
- Core Size:
- 16-Bit
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
- Peripherals:
- I2S, POR, PWM, WDT
- Number of I/O:
- 118
- Program Memory Size:
- 1.56MB (1.56M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 138K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 24x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
XE167FH200F100LABFXUMA1 FAQ
1.How can I place an order for XE167FH200F100LABFXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for XE167FH200F100LABFXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XE167FH200F100LABFXUMA1 reliable?
The price and inventory of XE167FH200F100LABFXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XE167FH200F100LABFXUMA1 is usually 5 days.
3.What payment methods are accepted for XE167FH200F100LABFXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XE167FH200F100LABFXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XE167FH200F100LABFXUMA1?
XE167FH200F100LABFXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XE167FH200F100LABFXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XE167FH200F100LABFXUMA1?
For technical support, including XE167FH200F100LABFXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XE167FH200F100LABFXUMA1 requirements.
6.How does Aetrix verify that XE167FH200F100LABFXUMA1 is sourced from the original manufacturer or authorized distributors?
All XE167FH200F100LABFXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XE167FH200F100LABFXUMA1 meets industry standards.
7.What is the process for return or replacement of XE167FH200F100LABFXUMA1?
All XE167FH200F100LABFXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XE167FH200F100LABFXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XE167FH200F100LABFXUMA1 part is unused and in its original packaging.
Return procedure for XE167FH200F100LABFXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XE167FH200F100LABFXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
