Infineon Technologies XE167G96F66LACFXQMA1
- Part No.:
- XE167G96F66LACFXQMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
XE167G96F66LACFXQMA1.pdf
- Description:
- IC MCU 16BIT 768KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,571
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XE167G96F66LACFXQMA1 from Infineon Technologies is a 16-bit real-time signal controller with 768 KB on-chip Flash, 64 KB PSRAM, dual 10-bit ADCs (8+8 channels), CCU6x PWM units, and MultiCAN interface supporting 2 CAN nodes. It operates at up to 80 MHz, features JTAG-based on-chip debug support, and targets motor control and industrial automation systems requiring deterministic timing and integrated analog/digital I/O.
For engineers reviewing the XE167G96F66LACFXQMA1 datasheet, XE167G96F66LACFXQMA1 pinout, XE167G96F66LACFXQMA1 application, or XE167G96F66LACFXQMA1 equivalent, key selection criteria include Flash size, CAN node count, ADC channel allocation, CCU6 module availability, and LQFP-144 package compatibility with industrial thermal and EMI requirements.
Technical Context
The XE167G96F66LACFXQMA1 implements a five-stage pipeline C166-compatible CPU core running at 80 MHz (12.5 ns instruction cycle), with single-cycle 16×16 multiply, MAC, and 32-bit arithmetic. Its interrupt system supports 16 priority levels across 87 sources, with Peripheral Event Controller enabling zero-wait-state DMA transfers using 24-bit address pointers.
It integrates two synchronized 10-bit ADCs (total 16 channels), four CCU6 modules for flexible PWM generation, and a MultiCAN Rev. 2.0B controller with 2 dedicated CAN nodes and gateway capability. Clocking uses an on-chip PLL with external crystal or oscillator input, and power supply range is 3.0–5.5 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | C166-compatible 16-bit RISC with five-stage pipeline; enables deterministic real-time execution at 80 MHz. |
| Flash Memory | 768 KB on-chip Flash; sufficient for complex motor control firmware with safety routines and bootloader space. |
| SRAM | 64 KB PSRAM + 1 KB SBRAM + 2 KB DPRAM + 16 KB DSRAM; supports multi-buffered real-time data processing. |
| ADC | Dual 10-bit converters, 8+8 channels total, sub-1 µs conversion time; enables simultaneous current/voltage sensing in 3-phase drives. |
| CAN Interface | MultiCAN Rev. 2.0B with 2 dedicated nodes and up to 128 message objects; supports distributed industrial network topology. |
| Package | 144-pin Green LQFP, 0.5 mm pitch; RoHS-compliant, suitable for automated SMT assembly and industrial PCB layouts. |
| Operating Voltage | 3.0 V to 5.5 V single supply; simplifies power design and enables direct interfacing with legacy 5 V peripherals. |
Pinout & Package
XE167G96F66LACFXQMA1 is housed in a 144-pin Green LQFP package (19.7 mil pitch) with exposed thermal pad. Pin definitions follow Infineon's standardized XE167 pin mapping for signal integrity, ESD robustness, and mixed-signal partitioning.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP / VSSP | Power / Ground (I/O) | Separate I/O supply domain ensures noise immunity for digital peripherals and GPIO switching. |
| VDDA / VSSA | Analog Power / Ground | Dedicated analog domain minimizes coupling noise into ADC reference and sampling circuitry. |
| XTAL1 / XTAL2 | Crystal Oscillator Input/Output | Supports external quartz crystal (1–20 MHz) or CMOS clock source for precise system timing. |
| CANRX0 / CANTX0 | CAN Node 0 Receive/Transmit | Differential CAN bus interface compliant with ISO 11898-2; requires external transceiver for physical layer. |
| ADCTRIG0–3 | ADC Trigger Inputs | Hardware-synchronized sampling triggers from CCU6 or timer events enable jitter-free current loop capture. |
| JTAG_TCK / TMS / TDI / TDO | JTAG Debug Interface | Enables full on-chip debug, flash programming, and real-time trace without halting CPU operation. |
Key Features
| Feature | Design Value |
|---|---|
| Real-time interrupt latency | As low as 12.5 ns sample rate with 16 priority levels; guarantees sub-microsecond response to critical events like overcurrent. |
| CCU6x PWM generation | Four independent CCU6 modules with dead-time insertion, shadow register update, and center-aligned mode; essential for 3-phase inverter gate drive. |
| Dual synchronized ADCs | Two 10-bit converters with hardware-triggered parallel sampling and preprocessing (range check, averaging); eliminates software overhead in motor phase current acquisition. |
| MultiCAN with gateway | 2-node CAN controller with message object RAM and automatic ID filtering; enables bridging between separate CAN subnets in modular machinery. |
| On-chip memory architecture | 768 KB Flash + 64 KB PSRAM + dedicated SBRAM/DPRAM/DSRAM banks; supports safe boot, dual-bank firmware updates, and real-time data buffering. |
Applications
| Industrial Motor Drive | Automated Packaging Machinery |
|---|---|
|
Use Scenario: Closed-loop control of 3-phase PMSM/BLDC motors in conveyor systems with torque ripple suppression and field-oriented control (FOC). IC Role / Device Role / Timing Role: Real-time signal controller executing FOC algorithm, generating PWM via CCU6, sampling current via dual ADCs, and communicating status over CAN. Use Value: Deterministic 80 MHz execution and hardware-triggered ADC sampling reduce current loop jitter below 500 ns, improving torque smoothness and efficiency. |
Use Scenario: Coordinated motion control across multiple servo axes and pneumatic actuators in high-speed packaging lines. IC Role / Device Role / Timing Role: Central motion sequencer managing axis synchronization, I/O monitoring, and CAN-based HMI/PLC communication. Use Value: 2-node MultiCAN and 118 GPIOs enable local I/O expansion and daisy-chained CAN networks without external bridges, reducing BOM cost and wiring complexity. |
| Energy-Efficient HVAC Inverters | Modular PLC Backplane Interface |
|
Use Scenario: Variable-speed compressor control in commercial HVAC systems with thermal protection, soft-start, and energy optimization. IC Role / Device Role / Timing Role: Main controller handling inverter modulation, temperature sensing, fan speed regulation, and RS-485/CAN diagnostics. Use Value: Integrated 10-bit ADCs with hardware preprocessing offload microcontroller resources, allowing 100% CPU bandwidth for PID tuning and predictive maintenance algorithms. |
Use Scenario: Intelligent backplane controller in modular PLC systems managing slot detection, module configuration, and inter-module data exchange. IC Role / Device Role / Timing Role: Backplane master coordinating hot-swap sequencing, EEPROM configuration read/write, and CAN-based module health reporting. Use Value: On-chip SBRAM retains critical state during hot-insertion events, while JTAG debug access enables in-system firmware updates without removing modules from rack. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time signal controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SAF-XE167F96F66L | 768 KB Flash, 64 KB PSRAM, same package, but includes 5 CAN nodes and 6 serial channels vs. 2 CAN/4 serial. | Supports larger distributed networks (e.g., factory-wide CAN backbone) where gateway functionality across >2 subnets is required. | Select when full 5-node MultiCAN and additional USIC channels are needed; otherwise XE167G96F66LACFXQMA1 reduces pin count and firmware complexity. |
| SAF-XE167H96F66L | 768 KB Flash, 64 KB PSRAM, no CAN interface, 6 serial channels including LIN and IIC. | Suitable for non-networked embedded control (e.g., standalone inverters) relying on UART/LIN for diagnostics and IIC for sensor interfacing. | Choose when CAN is unnecessary and higher serial peripheral density is prioritized; avoids CAN PHY cost and layout constraints. |
Compared with SAF-XE167F96F66L and SAF-XE167H96F66L, XE167G96F66LACFXQMA1 balances CAN connectivity and peripheral count for mid-tier industrial drives-offering sufficient networking for machine-level coordination without over-provisioning for plant-wide infrastructure or omitting CAN entirely.
Availability
XE167G96F66LACFXQMA1 is available at Aetrix Electronics and suitable for industrial motor drives, automated packaging machinery, HVAC inverters, and modular PLC interfaces requiring stable component supply, long-lifecycle support, and RoHS-compliant LQFP packaging.
Supply support for XE167G96F66LACFXQMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial microcontrollers, with global R&D and manufacturing infrastructure.
The XE167 family was designed specifically for real-time signal control in motor drives and industrial automation, emphasizing deterministic timing, integrated analog front-ends, and robust communication interfaces under harsh electrical conditions.
FAQ
What is the maximum operating frequency and associated instruction cycle time?
The XE167G96F66LACFXQMA1 achieves a maximum CPU clock frequency of 80 MHz, resulting in a 12.5 ns instruction cycle time for single-cycle operations. This timing is guaranteed under specified voltage (3.0–5.5 V) and temperature (−40 °C to +85 °C) conditions per the V2.1 datasheet. The five-stage pipeline enables consistent throughput for real-time control loops.
Does this device support hardware-based PWM dead-time insertion?
Yes, the CCU6x modules integrated into XE167G96F66LACFXQMA1 provide configurable hardware dead-time insertion with programmable delay values and automatic update synchronization. This feature is used directly by the PWM generator logic and does not require CPU intervention, ensuring reliable gate-drive timing in inverter applications.
How many analog input channels are accessible, and what is their resolution and conversion speed?
The device provides two independent 10-bit ADC modules with 8 channels each (ADC0 and ADC1), totaling 16 analog inputs. Each converter achieves conversion times below 1 µs with hardware-triggered sampling, and both support optional preprocessing such as range checking and averaging before data transfer to memory.
Is JTAG debugging supported, and what capabilities does it provide?
Yes, XE167G96F66LACFXQMA1 includes full On-Chip Debug Support (OCDS) via standard 5-pin JTAG interface. It enables non-intrusive real-time debugging, flash programming, breakpoint setting, watchpoint monitoring, and trace data capture without halting CPU execution or affecting real-time performance.
XE167G96F66LACFXQMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- XE16x
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- C166SV2
- Core Size:
- 16-Bit
- Speed:
- 66MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
- Peripherals:
- I2S, POR, PWM, WDT
- Number of I/O:
- 118
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 82K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
XE167G96F66LACFXQMA1 FAQ
1.How can I place an order for XE167G96F66LACFXQMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for XE167G96F66LACFXQMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XE167G96F66LACFXQMA1 reliable?
The price and inventory of XE167G96F66LACFXQMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XE167G96F66LACFXQMA1 is usually 5 days.
3.What payment methods are accepted for XE167G96F66LACFXQMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XE167G96F66LACFXQMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XE167G96F66LACFXQMA1?
XE167G96F66LACFXQMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XE167G96F66LACFXQMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XE167G96F66LACFXQMA1?
For technical support, including XE167G96F66LACFXQMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XE167G96F66LACFXQMA1 requirements.
6.How does Aetrix verify that XE167G96F66LACFXQMA1 is sourced from the original manufacturer or authorized distributors?
All XE167G96F66LACFXQMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XE167G96F66LACFXQMA1 meets industry standards.
7.What is the process for return or replacement of XE167G96F66LACFXQMA1?
All XE167G96F66LACFXQMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XE167G96F66LACFXQMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XE167G96F66LACFXQMA1 part is unused and in its original packaging.
Return procedure for XE167G96F66LACFXQMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XE167G96F66LACFXQMA1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

