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Infineon Technologies XE169FH200F100LABFXUMA1

Part No.:
XE169FH200F100LABFXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
176-LQFP Exposed Pad
Datasheet:
AetrixXE169FH200F100LABFXUMA1.pdf
Description:
IC MCU 16BIT 1.6MB FLASH 176LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,696

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Product details

Overview

XE169FH200F100LABFXUMA1 from Infineon Technologies is a 16-bit real-time signal controller in the XE166 Family High Line series, featuring a five-stage pipeline CPU running at 100 MHz (10 ns instruction cycle), 112 Kbytes on-chip SRAM (24 KB DSRAM + 112 KB PSRAM + 8 KB SBRAM + 2 KB DPRAM), 1.6 MB Flash memory with ECC protection, and integrated MultiCAN 2.0B (6 nodes, 256 message objects). It targets motor control and industrial automation systems requiring deterministic timing, high-resolution PWM, and multi-protocol serial connectivity.

For engineers reviewing the XE169FH200F100LABFXUMA1 datasheet, XE169FH200F100LABFXUMA1 pinout, XE169FH200F100LABFXUMA1 application, or XE169FH200F100LABFXUMA1 equivalent, key selection criteria include its 100 MHz real-time CPU performance, dual 10-bit ADCs with <1 µs conversion time and broken-wire detection, CCU6x-based flexible PWM generation, and 176-pin LQFP package with 150 GPIOs supporting external bus expansion up to 12 Mbytes.

Technical Context

The XE169FH200F100LABFXUMA1 implements a C166-compatible 16-bit CPU core with MPU, zero-cycle jumps, one-cycle MAC, and fast context switching via dual local register banks. Its memory subsystem includes ECC-protected Flash, multiple SRAM blocks mapped across a 16 Mbyte linear address space, and configurable external bus interface supporting multiplexed/demultiplexed 8/16-bit data paths.

Peripheral integration centers on deterministic real-time I/O: two synchronizable 10-bit ADCs (30 channels total), four CCU6x units for independent PWM channel control, six CAN nodes with gateway capability, ten USIC channels supporting UART/LIN/SPI/I²C/I²S, and hardware CRC checker with programmable polynomial for memory integrity verification.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Clock Speed 100 MHz - enables 10 ns instruction cycle for hard real-time loop execution in motor control.
Flash Memory 1.6 MB with ECC - supports large firmware images and runtime memory integrity checking.
On-Chip SRAM 112 KB PSRAM + 24 KB DSRAM + 8 KB SBRAM + 2 KB DPRAM - provides segregated memory spaces for code, data, standby, and dual-port access.
ADC Resolution & Speed 10-bit, <1 µs conversion - meets fast sampling requirements for current/voltage feedback in servo drives.
PWM Channels Up to 24 via CCU6x units - enables multi-phase inverter control with dead-time insertion and synchronization.
CAN Nodes 6 independent CAN 2.0B interfaces - supports distributed industrial networks with gateway routing between buses.
Package 176-pin LQFP, 0.5 mm pitch - provides 150 GPIOs and external bus interface for system expansion.

Pinout & Package

XE169FH200F100LABFXUMA1 is housed in a 176-pin Green LQFP package (19.7 mil pitch) with exposed thermal pad, rated for industrial temperature range (–40 °C to +125 °C) and compliant with RoHS and halogen-free standards.

Pin/Terminal Circuit Role Design Meaning
VDDP / VSSP Core Power / Ground 1.3 V ±5% supply for CPU and internal logic; requires low-noise decoupling near package.
VDDA / VSSA Analog Power / Ground 3.3 V ±10% isolated analog domain for ADC and reference circuitry; separation prevents digital noise coupling.
XTAL1 / XTAL2 Crystal Oscillator Input/Output Supports 1–20 MHz crystal; internal PLL generates 100 MHz CPU clock with jitter <±50 ppm.
ASC0_TX / ASC0_RX UART Channel 0 I/O Dedicated full-duplex asynchronous serial interface for bootloader communication or debug console.
CAN0_TX / CAN0_RX CAN Node 0 Differential I/O Direct connection to CAN transceiver; supports bit rates up to 1 Mbit/s with automatic retransmission.
CC60_OUT0–CC60_OUT3 CCU60 PWM Outputs Four independent PWM outputs with programmable dead-time, polarity, and synchronization to ADC triggers.

Key Features

Feature Design Value
Real-Time CPU Architecture Five-stage pipeline with 100 MHz operation, zero-cycle jumps, and one-cycle MAC - ensures deterministic interrupt latency ≤1 µs for closed-loop control.
Memory Protection Unit (MPU) Configurable region-based access control for code/data memory - enforces task isolation in RTOS environments like FreeRTOS or SafeRTOS.
Peripheral Event Controller (PEC) Eight-channel DMA with 24-bit addressing - enables zero-CPU-overhead transfers between ADC results and PWM shadow registers.
MultiCAN Gateway Functionality Hardware-accelerated message filtering and routing across six CAN nodes - eliminates software bottlenecks in vehicle or factory network gateways.
Hardware CRC Checker Programmable polynomial engine for on-the-fly ECC validation of Flash and SRAM blocks - reduces BOM cost vs. external error-checking ICs.

Applications

Industrial Motor Drives Automotive Body Control Modules

Use Scenario: Field-oriented control (FOC) of three-phase PMSM/BLDC motors in HVAC compressors and industrial pumps.

IC Role / Device Role / Timing Role: Real-time signal controller coordinating ADC sampling, PWM generation, and CAN diagnostics at 20 kHz switching frequency.

Use Value: Integrated CCU6x units synchronize PWM edges to ADC conversion start, eliminating phase delay errors in current reconstruction.

Use Scenario: Central body controller managing door locks, lighting, window lifts, and climate actuators via LIN and CAN subnetworks.

IC Role / Device Role / Timing Role: Multi-protocol hub processor handling concurrent LIN slave emulation and CAN message routing with <50 µs latency.

Use Value: Six independent CAN nodes and ten USIC channels allow simultaneous protocol stacks without external bridge ICs.

Renewable Energy Inverters Industrial PLC I/O Modules

Use Scenario: Grid-tied solar inverters requiring precise sine-wave synthesis, anti-islanding detection, and DC-link voltage regulation.

IC Role / Device Role / Timing Role: Deterministic controller executing PID loops, SVM modulation, and safety-critical monitoring within 50 µs deadlines.

Use Value: Dual 10-bit ADCs with broken-wire detection ensure reliable sensing of grid voltage/current under fault conditions.

Use Scenario: Modular PLC backplane I/O modules with hot-swap capability and distributed diagnostics over CANopen.

IC Role / Device Role / Timing Role: Intelligent peripheral node managing 32-channel digital I/O, analog input conditioning, and cyclic CANopen PDO exchange.

Use Value: 150 GPIOs and programmable external bus support direct attachment of FPGA-based I/O expansion ASICs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar real-time signal controller applications.

Alternative Part Technical Difference Application Difference Selection Advice
XE167FH200F100LACXUMA1 Same CPU, identical peripherals, but 144-pin LQFP package (120 GPIOs) and reduced Flash (1 MB). Limited external bus width (16-bit only) and no SBRAM - unsuitable for systems requiring standby RAM retention during deep sleep. Select when board space constraints prohibit 176-pin layout and external memory expansion is unnecessary.
TC1797FP-128F176HR TriCore™ 32-bit CPU (180 MHz), larger Flash (2 MB), but lacks CCU6x PWM units and has only 4 CAN nodes. No hardware broken-wire detection in ADC; requires external comparators for motor phase fault sensing. Choose for higher computational throughput in complex motion algorithms where PWM flexibility is secondary to floating-point performance.

Compared with XE169FH200F100LABFXUMA1, the XE167FH offers footprint reduction at the cost of memory and I/O scalability, while the TC1797 delivers superior CPU performance but sacrifices dedicated motor-control peripherals and diagnostic features essential for functional safety compliance.

Availability

XE169FH200F100LABFXUMA1 is available at Aetrix Electronics and suitable for industrial motor drives, automotive body controllers, renewable energy inverters, and PLC I/O modules requiring stable component supply, long-term lifecycle support, and qualified automotive-grade packaging.

Supply support for XE169FH200F100LABFXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and security solutions, with global R&D and manufacturing facilities.

The XE166 Family High Line was designed specifically for deterministic real-time control in industrial automation and automotive powertrain systems, emphasizing peripheral integration, memory reliability, and functional safety readiness.

FAQ

What is the maximum operating temperature for XE169FH200F100LABFXUMA1?

The device is qualified for industrial temperature range from –40 °C to +125 °C ambient, with thermal resistance θJA = 22.5 °C/W (JEDEC standard PCB layout). Junction temperature must not exceed +150 °C under continuous operation, requiring appropriate copper pour and airflow in high-power applications.

Does XE169FH200F100LABFXUMA1 support JTAG debugging?

Yes, it supports full on-chip debug via JTAG interface compliant with IEEE 1149.1, including real-time trace, breakpoint setting, and memory inspection through Infineon's DAP (Device Access Port). Debug access remains active in all power modes except deep power-down.

How is Flash memory protected against corruption during power loss?

Flash integrity is maintained using Error Correction Code (ECC) with single-bit correction and double-bit detection per 64-bit word. The hardware CRC checker also validates memory contents at boot and during runtime, triggering NMI on detected errors for safe fail-safe response.

Can the ADCs operate synchronously with PWM signals?

Yes, both ADCs support hardware trigger synchronization to CCU6x PWM events (e.g., center-aligned PWM zero-crossing), enabling precise current sampling at optimal inverter switching points. Each ADC can be configured independently for different sampling windows and data preprocessing.

XE169FH200F100LABFXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
176-LQFP Exposed Pad
Series:
XE16xxH
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
C166SV2
Core Size:
16-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals:
I2S, POR, PWM, WDT
Number of I/O:
118
Program Memory Size:
1.6MB (1.6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
112K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 30x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

XE169FH200F100LABFXUMA1 FAQ

1.How can I place an order for XE169FH200F100LABFXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for XE169FH200F100LABFXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XE169FH200F100LABFXUMA1 reliable?

The price and inventory of XE169FH200F100LABFXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XE169FH200F100LABFXUMA1 is usually 5 days.

3.What payment methods are accepted for XE169FH200F100LABFXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XE169FH200F100LABFXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XE169FH200F100LABFXUMA1?

XE169FH200F100LABFXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XE169FH200F100LABFXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XE169FH200F100LABFXUMA1?

For technical support, including XE169FH200F100LABFXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XE169FH200F100LABFXUMA1 requirements.

6.How does Aetrix verify that XE169FH200F100LABFXUMA1 is sourced from the original manufacturer or authorized distributors?

All XE169FH200F100LABFXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XE169FH200F100LABFXUMA1 meets industry standards.

7.What is the process for return or replacement of XE169FH200F100LABFXUMA1?

All XE169FH200F100LABFXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XE169FH200F100LABFXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XE169FH200F100LABFXUMA1 part is unused and in its original packaging.

Return procedure for XE169FH200F100LABFXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XE169FH200F100LABFXUMA1 Tags

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