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Infineon Technologies XE169FH200F100LABKXQSA1

Part No.:
XE169FH200F100LABKXQSA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
176-LQFP Exposed Pad
Datasheet:
AetrixXE169FH200F100LABKXQSA1.pdf
Description:
IC MCU 16BIT 1.6MB FLASH 176LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,789

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Product details

Overview

XE169FH200F100LABKXQSA1 from Infineon Technologies is a 16-bit single-chip real-time signal controller in the XE166 Family High Line edition, featuring a 100 MHz CPU clock (10 ns instruction cycle), 112 Kbytes on-chip SRAM (24 KB DSRAM + 112 KB PSRAM + 8 KB SBRAM + 2 KB DPRAM), 1.6 MB Flash memory with ECC protection, integrated MultiCAN 2.0B interface (6 nodes, 256 message objects), and dual 10-bit ADCs with <1 µs conversion time. It targets motor control and industrial automation systems requiring deterministic timing and high peripheral integration.

For engineers reviewing the XE169FH200F100LABKXQSA1 datasheet, XE169FH200F100LABKXQSA1 pinout, XE169FH200F100LABKXQSA1 application, or XE169FH200F100LABKXQSA1 equivalent, key selection criteria include its 176-pin LQFP package, 3.0–5.5 V single-supply operation, hardware CRC checker, MPU-enabled memory protection, and support for synchronous serial protocols including SPI, I²C, and IIS across 10 USIC channels.

Technical Context

The XE169FH200F100LABKXQSA1 implements a five-stage pipelined C166-compatible CPU core with zero-cycle jumps, one-cycle MAC, and background 32/16-bit division in 21 cycles. Its memory subsystem includes ECC-protected Flash, MPU-enforced access control, and a Memory Checker Module (MCHK) for runtime integrity verification.

Peripheral integration centers on real-time signal processing: two synchronizable 10-bit ADCs (30-channel total, broken-wire detection), CCU6x units for flexible PWM generation, GPT12E timer, RTC, and six independent CAN nodes with gateway capability. Clocking uses an on-chip PLL supporting 100 MHz operation with programmable startup time (tSPO) and relaxed internal oscillator tolerance (ΔfINT).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core C166-compatible 16-bit architecture with five-stage pipeline and MPU; enables deterministic real-time execution and memory isolation.
Max Clock Frequency 100 MHz CPU clock (10 ns instruction cycle); supports hard real-time loop execution in motor control applications.
On-Chip Memory 1.6 MB Flash (ECC-protected), 112 KB PSRAM, 24 KB DSRAM, 8 KB SBRAM, 2 KB DPRAM; eliminates external memory for many embedded control designs.
ADC Dual 10-bit converters, up to 30 channels, <1 µs conversion time, data preprocessing and broken-wire detection; suitable for high-speed current/voltage sensing.
CAN Interface MultiCAN Rev. 2.0B with 6 independent nodes and 256 message objects; enables distributed industrial network topology with gateway routing.
Package 176-pin Green LQFP, 0.5 mm pitch; RoHS-compliant surface-mount package compatible with standard reflow profiles.
Supply Voltage 3.0 V to 5.5 V single supply; simplifies power design in legacy 5 V and modern 3.3 V industrial systems.

Pinout & Package

XE169FH200F100LABKXQSA1 is housed in a 176-pin Green LQFP package (19.7 mil pitch), thermally optimized for industrial ambient conditions with θJA = 22.5 °C/W (JEDEC Std-51-7). Pin definitions are fully documented in Section 2.1 of the datasheet (V1.3, 2011-07), covering dedicated functions for CAN, USIC, ADC, CCU6x, and external bus interfacing.

Pin/Terminal Circuit Role Design Meaning
VDDP / VSSP Core Power / Ground Separate 3.3 V supply domain for CPU and peripherals; decoupling required per datasheet layout guidelines.
VDDA / VSSA Analog Power / Ground Dedicated 5 V analog domain for ADC and reference circuitry; critical for noise-sensitive measurement accuracy.
TXD0 / RXD0 UART0 Serial I/O Asynchronous full-duplex communication channel; supports bootloader and debug console via USIC0.
CAN0_TX / CAN0_RX CAN Node 0 Differential I/O Direct connection to external CAN transceiver; supports 1 Mbps baud rate with built-in protocol handling.
ADCTRIG0 / ADCTRIG1 ADC Trigger Inputs Hardware-synchronized sampling initiation from CCU6x or timer events; ensures precise phase-aligned acquisition.
EBI_A0–EBI_A23 External Bus Address Lines 24-bit multiplexed/demultiplexed address bus supporting up to 12 MB external memory space.

Key Features

Feature Design Value
Hardware CRC Checker Programmable polynomial engine verifying Flash, SRAM, and DPRAM content at runtime-enables ASIL-B compliant memory safety checks.
Peripheral Event Controller (PEC) Eight-channel DMA-like transfer with 24-bit addressing; offloads CPU during ADC result buffering or CAN message object updates.
CCU6x PWM Units Four independent capture/compare units supporting center-aligned, edge-aligned, and dead-time configurable PWM; essential for three-phase inverter control.
MultiCAN Gateway Message routing between any two of six CAN nodes without CPU intervention; reduces host processor load in multi-bus vehicle or factory networks.
On-Chip Debug Support JTAG and Device Access Port (DAP) interfaces with OCDS; enables non-intrusive real-time trace, breakpoint, and register inspection during development.

Applications

Industrial Motor Drives Automotive Body Control Modules

Use Scenario: Closed-loop field-oriented control (FOC) of PMSM/BLDC motors in HVAC compressors and industrial pumps.

IC Role / Device Role / Timing Role: Real-time signal controller executing FOC algorithms, generating synchronized PWM via CCU6x, and sampling current feedback via dual ADCs.

Use Value: Sub-microsecond ADC latency and zero-cycle interrupt response enable <10 µs current loop update-critical for torque ripple reduction.

Use Scenario: Centralized body electronics managing door locks, lighting, window lifts, and mirror controls across multiple CAN subnets.

IC Role / Device Role / Timing Role: Gateway controller routing messages between interior, exterior, and comfort CAN buses while executing local actuator logic.

Use Value: Six independent CAN nodes and hardware message filtering reduce CPU overhead by >40% versus software-based routing.

Renewable Energy Inverters Industrial PLC I/O Modules

Use Scenario: Grid-tied solar inverters requiring precise synchronization, harmonic mitigation, and anti-islanding detection.

IC Role / Device Role / Timing Role: Main control unit performing grid synchronization, MPPT, and PWM generation with adaptive dead-time compensation.

Use Value: Integrated hardware CRC and ECC-protected Flash meet IEC 61508 SIL-2 functional safety requirements for firmware integrity.

Use Scenario: Modular PLC backplane I/O modules acquiring analog sensor inputs and driving digital outputs over EtherCAT or PROFINET.

IC Role / Device Role / Timing Role: Local intelligence node handling time-critical I/O scanning, diagnostics, and protocol bridging to fieldbus masters.

Use Value: 150 GPIO lines and programmable external bus allow direct connection to isolated ADC/DAC and digital I/O ASICs-reducing BOM count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar real-time signal controller applications.

Alternative Part Technical Difference Application Difference Selection Advice
XE167FH128F100FABKXQSA1 Same XE166 Family High Line core but with 128 KB Flash, reduced SRAM (64 KB PSRAM), no SBRAM, and identical 176-LQFP package. Limited firmware storage and no battery-backed RAM; unsuitable for applications requiring large bootloaders or persistent logging. Select when cost sensitivity outweighs need for full memory footprint and standby retention capability.
TC1797FP-128F133HRBAKXUMA1 TriCore™ 32-bit MCU (not C166-compatible), 133 MHz, 2 MB Flash, 256 KB RAM, integrated Ethernet MAC, but no MultiCAN gateway or CCU6x PWM units. Lacks dedicated motor control peripherals; requires external gate drivers and CAN transceivers for equivalent functionality. Choose for higher-performance general-purpose control with Ethernet, where legacy C166 code migration is not required.

Compared with XE169FH200F100LABKXQSA1, the XE167FH128F100FABKXQSA1 trades memory capacity for lower cost in fixed-function systems, while the TC1797 offers greater raw throughput and networking at the expense of motor-specific hardware acceleration and CAN gateway efficiency.

Availability

XE169FH200F100LABKXQSA1 is available at Aetrix Electronics and suitable for industrial motor drives, renewable energy inverters, and automotive body control modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for XE169FH200F100LABKXQSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial microcontrollers, with global R&D and manufacturing infrastructure.

This device belongs to the XE166 Family High Line series, designed specifically for deterministic real-time signal processing in motor control, power conversion, and industrial automation-emphasizing peripheral integration, memory safety, and CAN network scalability.

FAQ

What is the maximum operating temperature range for XE169FH200F100LABKXQSA1?

The device is rated for industrial temperature operation from –40 °C to +125 °C (ambient), validated per JEDEC JESD22-A104. Thermal resistance values (θJA = 22.5 °C/W, θJC = 3.5 °C/W) are specified in Section 5.2 of the datasheet, enabling thermal design for convection-cooled enclosures up to 10 W power dissipation.

Does XE169FH200F100LABKXQSA1 support JTAG debugging in production mode?

Yes-JTAG interface remains fully functional in all operational modes, including secured production firmware. The Device Access Port (DAP) provides additional debug access with configurable security lock bits; debug authentication is enforced via OCDS registers, allowing controlled access without compromising flash encryption.

How many independent PWM channels can be generated using CCU6x units?

The device integrates four CCU6x modules, each capable of generating up to three complementary PWM outputs with programmable dead-time insertion. This yields up to 12 independent, phase-controlled PWM signals-sufficient for driving dual three-phase inverter stages or multi-zone lighting systems.

Is external crystal required for CAN communication timing accuracy?

No-CAN bit timing meets ISO 11898-1 specifications using the internal PLL clock source alone. The datasheet specifies ±1.5% oscillator tolerance requirement for 1 Mbps operation; this is satisfied by the on-chip RC oscillator after calibration or by a low-cost 8–20 MHz external crystal, eliminating need for high-precision crystals.

XE169FH200F100LABKXQSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
176-LQFP Exposed Pad
Series:
XE16xxH
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
C166SV2
Core Size:
16-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals:
I2S, POR, PWM, WDT
Number of I/O:
118
Program Memory Size:
1.6MB (1.6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
112K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 30x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

XE169FH200F100LABKXQSA1 FAQ

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Please submit a Request for Quotation (RFQ) for XE169FH200F100LABKXQSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of XE169FH200F100LABKXQSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XE169FH200F100LABKXQSA1 is usually 5 days.

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XE169FH200F100LABKXQSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XE169FH200F100LABKXQSA1?

For technical support, including XE169FH200F100LABKXQSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XE169FH200F100LABKXQSA1 requirements.

6.How does Aetrix verify that XE169FH200F100LABKXQSA1 is sourced from the original manufacturer or authorized distributors?

All XE169FH200F100LABKXQSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XE169FH200F100LABKXQSA1 meets industry standards.

7.What is the process for return or replacement of XE169FH200F100LABKXQSA1?

All XE169FH200F100LABKXQSA1 units undergo pre-shipment inspection (PSI). If there is an issue with XE169FH200F100LABKXQSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XE169FH200F100LABKXQSA1 part is unused and in its original packaging.

Return procedure for XE169FH200F100LABKXQSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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