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Infineon Technologies XMC1100Q040F0032ABXUMA1

Part No.:
XMC1100Q040F0032ABXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
40-VFQFN Exposed Pad
Datasheet:
AetrixXMC1100Q040F0032ABXUMA1.pdf
Description:
IC MCU 32BIT 32KB FLASH 40VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,981

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Product details

Overview

XMC1100Q040F0032ABXUMA1 from Infineon Technologies is an ARM® Cortex™-M0 32-bit microcontroller with 32 kB Flash, 16 kB SRAM, 12-bit VADC (12-channel), two USIC channels supporting UART/SPI/I²C/I²S/LIN, and CCU4 timer units - deployed in industrial motor control, power supply supervision, and smart sensor interface applications.

For engineers reviewing the XMC1100Q040F0032ABXUMA1 datasheet, XMC1100Q040F0032ABXUMA1 pinout, XMC1100Q040F0032ABXUMA1 application, or XMC1100Q040F0032ABXUMA1 equivalent, key selection criteria include Flash/SRAM size, integrated analog peripherals (VADC, temperature sensor), real-time timer resources (CCU4), debug interface (SWD/SPD), and industrial-grade operating temperature range (–40 °C to +105 °C).

Technical Context

The XMC1100Q040F0032ABXUMA1 implements a single-core ARM Cortex-M0 processor running at up to 32 MHz, with AHB-Lite and APB bus architecture enabling deterministic peripheral access. It integrates a dedicated analog subsystem including a 12-bit VADC with hardware sequencer and post-processing, plus a calibrated on-die temperature sensor with ±2.5 °C accuracy over full temperature range.

Its programmable port driver module (PORTS) supports per-pin configuration for push-pull, open-drain, or input modes with configurable hysteresis and slew rate control. The ERU enables event-driven logic routing between peripherals and GPIOs without CPU intervention, supporting fast response to external triggers in safety-critical timing loops.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M0, 32-bit, up to 32 MHz - delivers deterministic real-time execution with Thumb/Thumb-2 instruction set support.
Flash Memory32 kB on-chip Flash with ECC and read-while-write capability - enables robust firmware updates and dual-bank operation.
SRAM16 kB high-speed SRAM with parity protection - supports critical data buffers and stack operations with error detection.
VADC12-bit successive approximation ADC, 12 channels, hardware sequencer - allows synchronized sampling of multiple analog signals without CPU overhead.
Temperature SensorOn-die calibrated sensor, ±2.5 °C accuracy from –40 °C to +105 °C - provides system thermal monitoring without external components.
Debug InterfaceSerial Wire Debug (SWD) + Single Pin Debug (SPD) - enables low-pin-count in-circuit debugging and programming in space-constrained designs.
Operating Temp–40 °C to +105 °C - qualified for extended industrial environments including motor drives and power converters.

Pinout & Package

Package: QFN-40 (6 × 6 mm, 0.5 mm pitch, exposed thermal pad). Pin count and layout conform to Infineon's standardized XMC1100 QFN-40 footprint, supporting automated assembly and thermal dissipation in compact industrial modules.

Pin/TerminalCircuit RoleDesign Meaning
VDDP / VSSPCore power / groundDedicated 1.3 V supply domain for CPU and digital logic - requires local decoupling for stable 32 MHz operation.
VDDA / VSSAAnalog power / groundSeparate 3.3 V analog domain for VADC and temperature sensor - isolation prevents digital noise coupling into precision measurements.
P0.0–P0.15General-purpose I/OConfigurable as input/output with hysteresis, slew rate control, and interrupt capability - supports direct connection to encoders, buttons, or status LEDs.
P1.0–P1.9Peripheral function pinsMap to USIC0/1, CCU4, ERU, RTC, and SWD - enables flexible peripheral routing without external signal multiplexing.
OSC_IN / OSC_OUTExternal crystal oscillator interfaceSupports 1–25 MHz crystal or external clock source - required for precise timing in communication protocols and RTC operation.

Key Features

FeatureDesign Value
USIC ChannelsTwo fully configurable serial interfaces supporting UART, SPI (single/dual/quad), I²C, I²S, and LIN - eliminates need for discrete protocol translators in multi-interface systems.
CCU4 Timer UnitsFour independent 16-bit capture/compare units with dead-time insertion and shadow register support - enables precise PWM generation for BLDC motor gate drivers.
ERU Event RouterProgrammable hardware event matrix linking GPIOs, timers, and peripherals - reduces interrupt latency and CPU load in time-critical fault-handling paths.
Integrated Temperature SensorFactory-calibrated on-die sensor with 12-bit resolution and linear output - provides real-time thermal feedback for thermal foldback in power stages without external ICs.
PRNG ModuleDedicated pseudo-random number generator with fast seed initialization - supports secure boot sequence randomization and cryptographic nonce generation in resource-limited firmware.

Applications

Industrial Motor ControlSmart Power Supply Monitoring

Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC blowers and industrial pumps.

IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, generating PWM via CCU4, sampling current/voltage via VADC, and managing thermal limits using on-die temperature sensor.

Use Value: Integrated CCU4 dead-time control and VADC hardware sequencing reduce external component count and ensure sub-microsecond timing consistency across phases.

Use Scenario: Real-time monitoring and protection of AC/DC and DC/DC power supplies in telecom rectifiers and server PSUs.

IC Role / Device Role / Timing Role: Supervisor MCU reading rail voltages/currents via VADC, logging faults via USIC UART, triggering shutdown via GPIO, and maintaining RTC-stamped event history.

Use Value: On-chip 12-bit VADC with hardware averaging and temperature-compensated reference enables accurate voltage regulation without external precision references.

Industrial Sensor HubProgrammable Logic Controller I/O Module

Use Scenario: Aggregation and preprocessing of analog and digital sensor data (pressure, humidity, vibration) in factory-floor condition monitoring nodes.

IC Role / Device Role / Timing Role: Edge node processor acquiring multi-channel analog inputs, filtering data in SRAM, and transmitting processed results via USIC SPI/I²C to host controller.

Use Value: 16 kB SRAM with parity and hardware VADC post-processing allow local FFT or RMS computation without external memory or DSP co-processor.

Use Scenario: Distributed digital I/O expansion module with isolated inputs/outputs in modular PLC backplanes.

IC Role / Device Role / Timing Role: Local intelligence unit managing opto-isolated input debouncing, output pulse-width modulation, and diagnostics reporting via USIC LIN bus.

Use Value: ERU-based hardware event routing enables <10 µs response to input state changes - meeting SIL-2 response time requirements without CPU polling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar industrial microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XMC1100T016F0032ABXUMA1Same core and peripherals, but 16 kB Flash and QFN-24 package - fewer I/O pins and reduced code capacity.Suitable for simpler sensor nodes or fixed-function I/O modules where firmware size <16 kB and pin count ≤24 suffices.Select when board space, BOM cost, or firmware footprint constraints outweigh need for expandability.
XMC1200Q048F0064ABXUMA1Upgraded to 64 kB Flash, 32 kB SRAM, additional USIC channel and CCU8 timer - same QFN-48 package.Required for complex motion control algorithms, multi-protocol gateways, or firmware-over-the-air (FOTA) capable devices.Choose when future firmware growth, enhanced analog processing, or dual-motor control is anticipated.

Compared with XMC1100Q040F0032ABXUMA1, the T016 variant trades Flash and I/O for lower cost and smaller footprint, while the XMC1200 offers scalable memory and peripherals - making the Q040F0032 optimal for balanced industrial control where 32 kB Flash and 40-pin I/O meet functional and thermal requirements.

Availability

XMC1100Q040F0032ABXUMA1 is available at Aetrix Electronics and suitable for industrial motor control, smart power supply monitoring, and programmable logic controller I/O modules requiring stable component supply, long-term lifecycle assurance, and industrial temperature qualification.

Supply support for XMC1100Q040F0032ABXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.

The XMC1000 family - including the XMC1100 series - was designed specifically for cost-sensitive, real-time industrial applications requiring integrated analog peripherals, deterministic timing, and robust debug capabilities in compact packages.

FAQ

What is the maximum operating frequency of the XMC1100Q040F0032ABXUMA1?

The XMC1100Q040F0032ABXUMA1 operates at a maximum CPU frequency of 32 MHz, supported by its internal PLL and system clock configuration. This frequency is validated across the full industrial temperature range (–40 °C to +105 °C) and under all specified supply voltage conditions (1.3 V core, 3.3 V I/O). No external clock multiplier is required to achieve this speed.

Does this device include hardware support for motor control PWM generation?

Yes - it integrates four CCU4 (Capture/Compare Unit 4) modules, each providing two complementary PWM outputs with programmable dead-time insertion, shadow register update, and synchronization to external events. These are directly usable for 3-phase BLDC or PMSM motor gate drive control without external timers or gate drivers.

Can the on-chip temperature sensor be used for system thermal protection?

Yes - the factory-calibrated on-die temperature sensor delivers ±2.5 °C accuracy from –40 °C to +105 °C and connects directly to the VADC. Its output is accessible via dedicated SFRs, enabling firmware to trigger thermal throttling or shutdown before critical junction temperatures are reached - eliminating need for external thermal ICs.

Is the XMC1100Q040F0032ABXUMA1 supported by Infineon's DAVE™ development environment?

Yes - DAVE™ v4.x fully supports the XMC1100 series, providing graphical configuration tools for USIC, CCU4, VADC, and ERU peripherals, along with auto-generated C code and example projects. DAVE™ also integrates with Keil MDK and GCC toolchains, and supports debugging via SWD using standard J-Link or CMSIS-DAP probes.

XMC1100Q040F0032ABXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
40-VFQFN Exposed Pad
Series:
XMC1000
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, I2S, POR, PWM, WDT
Number of I/O:
27
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

XMC1100Q040F0032ABXUMA1 FAQ

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For technical support, including XMC1100Q040F0032ABXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XMC1100Q040F0032ABXUMA1 requirements.

6.How does Aetrix verify that XMC1100Q040F0032ABXUMA1 is sourced from the original manufacturer or authorized distributors?

All XMC1100Q040F0032ABXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XMC1100Q040F0032ABXUMA1 meets industry standards.

7.What is the process for return or replacement of XMC1100Q040F0032ABXUMA1?

All XMC1100Q040F0032ABXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XMC1100Q040F0032ABXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XMC1100Q040F0032ABXUMA1 part is unused and in its original packaging.

Return procedure for XMC1100Q040F0032ABXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XMC1100Q040F0032ABXUMA1 Tags

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