Infineon Technologies XMC1100T016X0016ABXUMA1

Overview

XMC1100T016X0016ABXUMA1 from Infineon is an ARM® Cortex®-M0 32-bit microcontroller in TSSOP-16 package, featuring 16 KB Flash, 16 KB SRAM, and industrial-grade temperature range (−40°C to +105°C). It integrates a 12-bit VADC with 6 input channels, two USIC channels supporting UART/I²C/I²S/SPI, CCU4 timers, RTC, WDT, and temperature sensor - deployed in motor control feedback loops, industrial sensor nodes, and PLC I/O modules.

For engineers reviewing the XMC1100T016X0016ABXUMA1 datasheet, XMC1100T016X0016ABXUMA1 pinout, XMC1100T016X0016ABXUMA1 application, or XMC1100T016X0016ABXUMA1 equivalent, key selection criteria include Flash/SRAM sizing for firmware footprint, ADC channel count for analog sensing density, USIC flexibility for fieldbus interface adaptation, and −40°C to +105°C operation for harsh ambient deployment.

Technical Context

The device implements a single-core ARM Cortex-M0 CPU with Thumb/Thumb-2 instruction set support, 32-bit hardware multiplier, and SysTick timer. Its memory subsystem includes 8 KB ROM (for boot and library functions), 16 KB SRAM, and 16 KB Flash with sector 0 read-only protection.

Peripherals are organized via AHB-Lite and APB buses: two USIC modules provide configurable serial protocols; VADC0 supports up to 6 channels with 12-bit resolution; CCU40 delivers capture/compare timing; ERU enables event-driven interrupt routing; and SCU manages clock gating, reset, and power modes including sleep and idle states.

Key Specifications

Pinout & Package

Package: PG-TSSOP-16-8 (16-pin Thin Shrink Small Outline Package, 8 mm × 4.4 mm body, 0.65 mm lead pitch).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with XMC1100T016X0016ABXUMA1, the F0016 variant trades thermal robustness for lower cost in benign environments, while the T038X0016 variant expands analog and serial capability at the expense of board area - making the original optimal for space-constrained, thermally demanding industrial edge nodes with moderate I/O needs.

Availability

XMC1100T016X0016ABXUMA1 is available at Aetrix Electronics and suitable for motor control subsystems, industrial sensor nodes, and PLC digital I/O modules requiring stable component supply across extended product lifecycles.

Supply support for XMC1100T016X0016ABXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial microcontrollers with ISO/TS 16949-certified production.

The XMC1100 series belongs to the XMC1000 family, designed specifically for cost-sensitive industrial automation applications requiring real-time responsiveness, analog integration, and extended temperature resilience.

FAQ

Does XMC1100T016X0016ABXUMA1 support CAN communication?

No, the XMC1100T016X0016ABXUMA1 does not integrate a CAN controller or transceiver. Its USIC peripherals support UART, I²C, I²S, SPI, and LIN only. For CAN-based fieldbus connectivity, designers must add an external CAN transceiver (e.g., TJA1042) interfaced via GPIO or USIC UART with custom protocol framing.

What is the maximum operating frequency of the ARM Cortex-M0 core in this device?

The XMC1100T016X0016ABXUMA1 operates its ARM Cortex-M0 core at up to 32 MHz, as confirmed by the device's system clock tree configuration and AC timing specifications in Section 3.3 of the datasheet. This frequency is achievable across the full −40°C to +105°C range with 3.3 V ±5% supply.

Is there hardware support for cryptographic operations such as AES or SHA?

No, the XMC1100T016X0016ABXUMA1 lacks dedicated cryptographic accelerators. It provides only a pseudo-random number generator (PRNG) in ROM for seed generation. Secure firmware updates or data encryption must be implemented in software using libraries optimized for Cortex-M0's 32-bit multiplier and limited RAM.

Can the internal temperature sensor be used for system-level thermal monitoring?

Yes, the on-die temperature sensor (TSE) delivers calibrated readings with ±3°C accuracy from −40°C to +105°C, accessible via VADC0 channel 15. It is intended for board-level thermal trend analysis and overtemperature warning - not for ambient air measurement due to self-heating effects during sustained CPU/peripheral activity.