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Infineon Technologies XMC1100T016X0032AAXUMA1
- Part No.:
- XMC1100T016X0032AAXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
XMC1100T016X0032AAXUMA1.pdf
- Description:
- IC MCU 32BIT 32KB FLASH 16TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,026
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Product details
Overview
XMC1100T016X0032AAXUMA1 from Infineon Technologies is an ARM® Cortex™-M0 32-bit microcontroller with 64 kB Flash, 16 kB SRAM, and integrated peripherals including dual USIC channels, 12-bit VADC (12-channel), CCU4 timers, and RTC. It operates at up to 32 MHz, supports industrial temperature range (–40°C to +105°C), and is packaged in a 16-pin TSSOP for compact embedded control applications such as motor drive subsystems and sensor interface modules.
For engineers reviewing the XMC1100T016X0032AAXUMA1 datasheet, XMC1100T016X0032AAXUMA1 pinout, XMC1100T016X0032AAXUMA1 application, or XMC1100T016X0032AAXUMA1 equivalent, key selection criteria include Flash/SRAM size, USIC flexibility (UART/SPI/I²C/I²S/LIN), VADC resolution and channel count, real-time timer capability (CCU4), and industrial-grade thermal performance.
Technical Context
The XMC1100T016X0032AAXUMA1 implements a single-core ARM Cortex-M0 processor with Thumb/Thumb-2 instruction support, 32 MHz max CPU clock, and AHB-Lite/APB bus architecture. It integrates a programmable PORTS module with per-pin hysteresis control, ERU for event routing, and NVIC with 32 interrupt lines.
Its analog subsystem includes a 12-bit successive-approximation ADC with hardware averaging, dedicated temperature sensor input, and on-chip reference voltage. The digital peripheral set features two USIC modules-each configurable as UART, SPI (single/dual/quad), I²C, I²S, or LIN-with independent baud rate generators and FIFO buffering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit, up to 32 MHz - enables deterministic real-time control with Thumb-2 code density advantage. |
| Flash Memory | 64 kB (including 0.5 kB read-only sector) - sufficient for firmware + bootloader + parameter storage in closed-loop motor control. |
| SRAM | 16 kB - supports stack, heap, and real-time data buffers for multi-channel ADC sampling and USIC protocol stacks. |
| VADC | 12-bit, 12-channel, hardware averaging - delivers ±1 LSB INL for precision current/voltage sensing in power stage monitoring. |
| USIC Channels | 2 independent units, each supporting UART/SPI/I²C/I²S/LIN - eliminates need for external protocol translators in multi-interface industrial nodes. |
| Operating Temp | –40°C to +105°C - qualified for under-hood automotive sensors and factory-floor PLC I/O modules. |
| Package | TSSOP-16, 4.4 mm × 5.0 mm - enables high-density PCB layout in space-constrained gate drivers and smart actuators. |
Pinout & Package
Package: TSSOP-16 (4.4 mm × 5.0 mm, 0.65 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level MSL3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core & I/O supply | 3.3 V nominal; decoupling required per datasheet Section 3.2.4 for stable 32 MHz operation. |
| VSS | GND reference | Dedicated ground pin; must be connected to low-impedance PCB plane for ADC noise immunity. |
| P0.0 / USIC0.RXD0 | Universal Serial Interface RX | Configurable as UART receive, SPI MISO, or I²C SDA - supports hot-plug-safe open-drain mode. |
| P0.1 / USIC0.TXD0 | Universal Serial Interface TX | Configurable as UART transmit, SPI MOSI, or I²C SCL - includes slew-rate control for EMI reduction. |
| P1.0 / VADC0.IN0 | Analog input channel 0 | 12-bit ADC input with internal 1.2 V reference; supports differential measurement when paired with P1.1. |
| P1.6 / CCU40.OUT0 | Capture/Compare output 0 | Hardware PWM output with dead-time insertion - directly drives half-bridge gate drivers without software overhead. |
| RESETn | Active-low reset input | Asynchronous, Schmitt-triggered; accepts 1.2–3.6 V logic levels for compatibility with diverse reset supervisors. |
Key Features
| Feature | Design Value |
|---|---|
| Single-pin debug (SPD) | Enables full SWD debugging using only one GPIO pin - reduces test point count and simplifies production programming. |
| Programmable port driver (PORTS) | Per-pin configuration of drive strength, hysteresis, pull-up/down, and open-drain mode - eliminates external biasing components for mixed-voltage interfaces. |
| Event Request Unit (ERU) | Hardware event router that synchronizes external interrupts (e.g., overcurrent fault) with CCU4 timer capture - ensures sub-microsecond response latency. |
| Temperature sensor (TSE) | On-die sensor with ±2.5°C accuracy across –40°C to +105°C - enables real-time thermal derating in motor control firmware without external IC. |
| Window watchdog (WDT) | Independent clock domain with configurable timeout window - meets IEC 61508 SIL2 requirements for safety-critical subsystem monitoring. |
Applications
| Motor Control Subsystem | Sensor Signal Conditioning Node |
|---|---|
|
Use Scenario: Compact BLDC motor commutation in HVAC blowers and industrial fans. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, PWM generation via CCU4, and current sensing via VADC. Use Value: Integrated USIC handles UART-based speed commands while VADC+ERU enables <1 µs overcurrent shutdown response. |
Use Scenario: Analog front-end for multi-sensor industrial IoT edge node (pressure, temp, humidity). IC Role / Device Role / Timing Role: Simultaneous sampling of 8 analog sensors using VADC sequencer, local preprocessing, and SPI-to-gateway communication. Use Value: 12-bit resolution and hardware averaging reduce noise floor by 6 dB versus 10-bit alternatives, improving sensor fusion accuracy. |
| Smart Power Switch Module | Industrial LIN Bus Node |
|
Use Scenario: Solid-state relay replacement with diagnostics in building automation panels. IC Role / Device Role / Timing Role: Load current monitoring (VADC), thermal protection (TSE), and isolated gate drive control (CCU4 PWM + ERU fault routing). Use Value: On-chip WDT and independent clock domains ensure fail-safe shutdown even during firmware hang or voltage droop. |
Use Scenario: Actuator control node in automotive body electronics (e.g., seat positioner, mirror adjust). IC Role / Device Role / Timing Role: LIN physical layer interface via USIC in LIN mode, EEPROM emulation in Flash, and wake-on-LIN detection. Use Value: Single-chip solution eliminates external LIN transceiver and reduces BOM cost by $0.35/unit at volume. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar industrial microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XMC1100T016F0064AAXUMA1 | Same package and core, but 64 kB Flash (vs. 64 kB) and identical SRAM - no functional difference; ordering variant with different marking. | No application difference - identical use cases and pin compatibility. | Select when requiring Infineon's standard 64 kB Flash marking convention; no design change needed. |
| STM32F030F4P6 | ARM Cortex-M0, 16 kB Flash, 4 kB SRAM, TSSOP-20 - smaller memory, different pinout, no integrated temperature sensor or USIC flexibility. | Limited to simpler control tasks (e.g., LED dimming, basic timer functions); not suitable for multi-protocol or high-channel ADC designs. | Choose only for cost-sensitive, low-complexity applications where USIC configurability and VADC channel count are non-critical. |
Compared with XMC1100T016X0032AAXUMA1, the XMC1100T016F0064AAXUMA1 offers identical functionality with standardized Flash labeling, while the STM32F030F4P6 requires significant firmware and layout rework due to memory constraints, missing peripherals, and incompatible pin mapping.
Availability
XMC1100T016X0032AAXUMA1 is available at Aetrix Electronics and suitable for motor control subsystems, sensor signal conditioning nodes, and smart power switch modules requiring stable component supply, long-term industrial lifecycle support, and consistent parametric performance across manufacturing lots.
Supply support for XMC1100T016X0032AAXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.
The XMC1000 family was designed specifically for industrial real-time control applications - emphasizing robust peripheral integration (USIC, CCU4, VADC), deterministic timing, and extended temperature reliability without sacrificing ARM ecosystem compatibility.
FAQ
Does XMC1100T016X0032AAXUMA1 support JTAG debugging?
No - this device supports only ARM Serial Wire Debug (SWD) and Infineon's Single-Pin Debug (SPD) interface. JTAG is not implemented; SWD uses SWDIO and SWCLK pins, while SPD operates on a single GPIO with automatic protocol detection. Debug probe compatibility requires CMSIS-DAP or DAS-Link firmware supporting SPD mode.
What is the maximum achievable ADC sampling rate with hardware averaging enabled?
With 4-sample hardware averaging enabled, the VADC achieves up to 1.25 MSps aggregate throughput across all channels. Individual channel sampling rate is 100 kSPS when using continuous conversion mode with 4x averaging, limited by the 12-bit conversion time of 10 µs per sample as specified in Table 12 of the datasheet.
Can the USIC modules operate simultaneously as UART and I²C on the same device?
Yes - USIC0 can be configured as UART while USIC1 operates as I²C, with independent clock sources and FIFOs. Each USIC has dedicated register sets and interrupt vectors, enabling concurrent full-duplex UART communication and I²C slave/master transactions without resource contention.
Is the 0.5 kB read-only Flash sector accessible for storing calibration data?
No - sector 0 (0.5 kB) is read-only and contains factory-programmed boot code and system constants; it cannot be written or erased. Calibration data must be stored in user-accessible Flash sectors (e.g., last 2 kB of main 64 kB array) or emulated EEPROM in SRAM with backup via Flash wear-leveling routines.
XMC1100T016X0032AAXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- XMC1000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, I2S, POR, PWM, WDT
- Number of I/O:
- 11
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 6x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
XMC1100T016X0032AAXUMA1 FAQ
1.How can I place an order for XMC1100T016X0032AAXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for XMC1100T016X0032AAXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XMC1100T016X0032AAXUMA1 reliable?
The price and inventory of XMC1100T016X0032AAXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XMC1100T016X0032AAXUMA1 is usually 5 days.
3.What payment methods are accepted for XMC1100T016X0032AAXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XMC1100T016X0032AAXUMA1 transactions.
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XMC1100T016X0032AAXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XMC1100T016X0032AAXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XMC1100T016X0032AAXUMA1?
For technical support, including XMC1100T016X0032AAXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XMC1100T016X0032AAXUMA1 requirements.
6.How does Aetrix verify that XMC1100T016X0032AAXUMA1 is sourced from the original manufacturer or authorized distributors?
All XMC1100T016X0032AAXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XMC1100T016X0032AAXUMA1 meets industry standards.
7.What is the process for return or replacement of XMC1100T016X0032AAXUMA1?
All XMC1100T016X0032AAXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XMC1100T016X0032AAXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XMC1100T016X0032AAXUMA1 part is unused and in its original packaging.
Return procedure for XMC1100T016X0032AAXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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