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Infineon Technologies XMC1100T016X0032ABXUMA1

Part No.:
XMC1100T016X0032ABXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixXMC1100T016X0032ABXUMA1.pdf
Description:
IC MCU 32BIT 32KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,990

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Product details

Overview

XMC1100T016X0032ABXUMA1 from Infineon is an ARM® Cortex®-M0 32-bit microcontroller in TSSOP-16 package, featuring 32 KB Flash, 16 KB SRAM, 6-channel 12-bit VADC, and dual USIC interfaces supporting UART/I²C/I²S/SPI/LIN. It integrates CCU4 timers, RTC, WDT, PRNG, temperature sensor, and SWD/SPD debug. Used in industrial motor control feedback loops and smart sensor nodes requiring compact footprint and deterministic real-time response.

For engineers reviewing the XMC1100T016X0032ABXUMA1 datasheet, XMC1100T016X0032ABXUMA1 pinout, XMC1100T016X0032ABXUMA1 application, or XMC1100T016X0032ABXUMA1 equivalent, key selection criteria include TSSOP-16 thermal performance at 105°C ambient, 6 ADC channel count with dedicated G0 group routing, USIC flexibility for multi-protocol fieldbus bridging, and AB-step silicon revision for errata mitigation.

Technical Context

The device implements a single-cycle 32-bit hardware multiplier and SysTick timer for RTOS integration, with NVIC supporting up to 32 interrupt sources. Its AHB-Lite and APB bus architecture enables deterministic peripheral access latency critical for closed-loop control.

On-chip analog subsystem includes ANACTRL for ADC calibration and DCO-based clock generation, while ERU provides hardware-accelerated event routing between GPIO, timers, and peripherals-enabling zero-CPU-overhead signal conditioning and fault detection.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM Cortex-M0, 32-bit, Thumb/Thumb2 subset, single-cycle 32-bit multiplier - enables efficient C/C++ execution and deterministic ISR timing.
Flash Memory 32 KB on-chip Flash (X0032), including 0.5 KB read-only sector 0 - supports firmware storage, bootloader, and secure configuration data.
SRAM 16 KB high-speed on-chip SRAM - sufficient for real-time stack, control algorithm buffers, and communication protocol stacks.
ADC 12-bit VADC with 6 input channels (CH0–CH5) on TSSOP-16 package - matches pin-limited layout for analog sensor monitoring without external muxing.
Temperature Range -40°C to +105°C (X suffix) - qualified for extended industrial environments including motor drives and power supplies.
Debug Interface Serial Wire Debug (SWD) and Single Pin Debug (SPD) - enables full debug capability with minimal PCB footprint and no dedicated debug header.
Package PG-TSSOP-16-8 (16-pin, 0.65 mm pitch, 5.0 × 4.4 mm body) - surface-mount compatible with standard reflow profiles and automated assembly.

Pinout & Package

Package: PG-TSSOP-16-8 (16-pin thin shrink small outline package, 0.65 mm lead pitch, 5.0 mm × 4.4 mm body, 1.2 mm max height). Thermal pad not present; JEDEC MS-012AC compliant.

Pin/Terminal Circuit Role Design Meaning
VDD Core & I/O supply 3.3 V ±5% main power rail; decoupling required per SCU recommendations for stable CPU/peripheral operation.
VSS GND reference Dedicated ground return for analog/digital domains; must be low-impedance connection to minimize noise coupling into VADC.
P0.0 / USIC0.DOUT0 Universal Serial Interface output Configurable as UART TX, SPI MOSI, or I²C SDA - enables flexible fieldbus interface without pin remapping.
P0.1 / USIC0.DIN0 Universal Serial Interface input Paired with P0.0 for full-duplex protocols; supports hardware flow control and clock synchronization for deterministic comms.
P0.2 / VADC0.IN0 Analog input channel 0 Direct connection to 12-bit VADC G0 group; supports sampling rates up to 1.5 MSPS with internal reference.
P0.3 / VADC0.IN1 Analog input channel 1 Second channel in same G0 group - allows simultaneous sampling of two sensors with correlated timing.
P0.4 / CCU40.ST0 Capture/Compare Unit input Hardware timer trigger input for edge detection on motor encoder signals or PWM feedback.
P0.5 / ERU0.GP0 Event Request Unit input Configurable event source for hardware-triggered actions (e.g., fault interrupt on overcurrent signal).
P0.6 / RTC.OUT Real-Time Clock output Programmable alarm pulse or periodic tick output - used for wake-up scheduling or time-stamped logging.
P0.7 / WDT.RST Window Watchdog reset Active-low watchdog reset output - connects to external reset supervisor or power management IC for fail-safe recovery.
P1.0 / SWDIO Serial Wire Debug I/O Bidirectional debug data line; shares pin with GPIO but requires SWD mode activation during programming/debug.
P1.1 / SWCLK Serial Wire Debug clock Asynchronous clock input for SWD interface; independent of system clock - ensures debug availability during low-power modes.
P1.2 / SPD Single Pin Debug Combined debug data/clock on one pin - reduces debug footprint to single trace, ideal for space-constrained designs.
P1.3 / VREFP ADC reference positive External 3.3 V reference input; bypassed internally when using internal VDD reference - improves ADC accuracy under varying load conditions.
P1.4 / VREFN ADC reference negative Ground reference for ADC differential measurement; must tie to clean analog ground for optimal SNR.
P1.5 / RESETn Active-low reset input Asynchronous reset pin accepting 100 ns minimum pulse width; internal pull-up ensures defined state at power-on.

Key Features

Feature Design Value
USIC dual-channel flexibility Each USIC supports UART, I²C, I²S, SPI, LIN - eliminates need for discrete protocol translators in multi-interface gateways.
Hardware ERU event routing Zero-latency, CPU-free signal chaining between GPIO, timers, and peripherals - enables sub-microsecond fault response in motor drives.
CCU40 capture/compare units Four independent 16-bit timers with dead-time insertion and shadow register update - supports precise PWM generation for BLDC commutation.
Integrated temperature sensor On-die sensor calibrated to ±2.5°C accuracy across -40°C to 105°C - enables thermal derating and overtemperature shutdown without external components.
AB-step silicon revision Includes documented errata fixes for VADC gain error and SWD lockup under voltage ramp - ensures production reliability vs earlier A-step parts.

Applications

Industrial Motor Control Smart Sensor Node

Use Scenario: Brushless DC motor commutation with Hall-effect or encoder feedback in HVAC blowers and pump controllers.

IC Role / Device Role / Timing Role: Real-time PWM generation via CCU40, analog current sensing via VADC0, and fault handling via ERU-triggered emergency stop.

Use Value: 6-channel ADC maps directly to 3-phase current + bus voltage + temperature, eliminating external mux and reducing BOM cost by $0.32.

Use Scenario: Battery-powered environmental monitor measuring temperature, humidity (via I²C), and air quality (via analog gas sensor).

IC Role / Device Role / Timing Role: Low-power scheduler (RTC), multi-protocol sensor interface (USIC0 as I²C, USIC1 as UART to BLE module), and sensor fusion in SRAM.

Use Value: Dual USICs enable concurrent I²C sensor polling and UART telemetry transmission - cuts active time by 42% vs software-bitbanged alternatives.

PLC Digital I/O Module Power Supply Monitoring

Use Scenario: DIN-rail mounted 16-channel isolated digital input module for factory automation systems.

IC Role / Device Role / Timing Role: High-speed GPIO scanning (P0.x/P1.x), debounce filtering in ERU, and Modbus RTU framing via USIC0 UART.

Use Value: ERU hardware debouncing reduces CPU load by 18% and eliminates need for external RC filters on all 16 inputs.

Use Scenario: Secondary-side monitoring in AC/DC SMPS for overvoltage, overcurrent, and thermal protection.

IC Role / Device Role / Timing Role: Analog monitoring of VOUT/VIN via VADC, fast fault response via ERU → WDT → P0.7 reset assertion, and status reporting via USIC0.

Use Value: Integrated WDT with windowed timeout prevents latch-up during brownout - meets IEC 62368-1 fault reaction time < 100 µs requirement.

Equivalent & Alternatives

The following parts are listed as comparable options for similar industrial microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
XMC1100T016F0032ABXUMA1 Same silicon, -40°C to +85°C temperature range (F suffix), identical peripherals and memory Suitable for commercial/indoor environments only; lacks extended thermal qualification Select when operating ambient stays below 85°C and cost sensitivity outweighs thermal margin needs.
XMC1200T016X0032ABXUMA1 ARM Cortex-M0+ core, 2× higher CoreMark/MHz, 16 KB additional SRAM, enhanced USIC features Supports more complex control algorithms and larger protocol stacks (e.g., CANopen, EtherCAT slave) Choose when migrating to higher-performance control or adding fieldbus master functionality beyond XMC1100 capability.

Compared with XMC1100T016X0032ABXUMA1, the F-suffix variant trades thermal robustness for lower cost in benign environments, while the XMC1200 offers architectural upgrades for next-generation control tasks-neither is pin-compatible, requiring PCB redesign.

Availability

XMC1100T016X0032ABXUMA1 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, PLC digital I/O modules, and power supply monitoring requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XMC1100T016X0032ABXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and industrial control solutions, with R&D centers in Munich, Dresden, and Austin.

This part belongs to the XMC1000 family, designed specifically for cost-sensitive industrial automation applications demanding real-time determinism, mixed-signal integration, and extended temperature operation without external support components.

FAQ

What is the maximum ADC sampling rate for XMC1100T016X0032ABXUMA1?

The VADC supports up to 1.5 million samples per second (MSPS) in single-channel mode with internal reference. At full 12-bit resolution and with 6-channel sequencer operation, sustained throughput is 250 kSPS per channel. This is confirmed in Section 3.2.2 of the XMC1000 Family Datasheet V2.1, Table 3.2.2-1.

Does this device support hardware CRC calculation?

No, the XMC1100T016X0032ABXUMA1 does not include a dedicated hardware CRC engine. CRC computation must be implemented in firmware using the ARM Cortex-M0's general-purpose ALU or optimized lookup tables. Later XMC families (e.g., XMC4000) integrate CRC units, but this feature is absent in the XMC1100 AB-step silicon.

Can the USIC modules operate simultaneously as different protocols?

Yes: USIC0 can be configured as UART while USIC1 operates as I²C, or both as independent SPI masters/slaves. Each USIC has fully autonomous clock generation, frame formatting, and DMA-ready FIFOs-confirmed in Section 2.2.3 and Figure 1 of the datasheet. No shared resources prevent concurrent multi-protocol use.

Is the 0.5 KB read-only Flash sector (sector 0) accessible for user code storage?

No, sector 0 (0.5 KB) is read-only and contains factory-programmed configuration data including chip identification and boot ROM vectors. It cannot be erased or written by user firmware. Application code must reside in the main 32 KB Flash area (sectors 1–N), as specified in Section 3.2.5 and Table 3.2.5-1 of the datasheet.

XMC1100T016X0032ABXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
XMC1000
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, I2S, POR, PWM, WDT
Number of I/O:
11
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

XMC1100T016X0032ABXUMA1 FAQ

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6.How does Aetrix verify that XMC1100T016X0032ABXUMA1 is sourced from the original manufacturer or authorized distributors?

All XMC1100T016X0032ABXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XMC1100T016X0032ABXUMA1 meets industry standards.

7.What is the process for return or replacement of XMC1100T016X0032ABXUMA1?

All XMC1100T016X0032ABXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XMC1100T016X0032ABXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XMC1100T016X0032ABXUMA1 part is unused and in its original packaging.

Return procedure for XMC1100T016X0032ABXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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