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Infineon Technologies XMC1100T038F0016ABXUMA1
- Part No.:
- XMC1100T038F0016ABXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 38-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
XMC1100T038F0016ABXUMA1.pdf
- Description:
- IC MCU 32BIT 16KB FLASH 38TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,983
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Product details
Overview
XMC1100T038F0016ABXUMA1 from Infineon is an ARM® Cortex®-M0 32-bit microcontroller in TSSOP-38 package, featuring 16 KB Flash, 16 KB SRAM, 12-channel 12-bit VADC, dual USIC interfaces supporting UART/I²C/I²S/SPI/LIN, and real-time clock with alarm-designed for industrial motor control, power supply supervision, and sensor interface applications.
For engineers reviewing the XMC1100T038F0016ABXUMA1 datasheet, XMC1100T038F0016ABXUMA1 pinout, XMC1100T038F0016ABXUMA1 application, or XMC1100T038F0016ABXUMA1 equivalent, key selection criteria include Flash/SRAM balance, analog input channel count, USIC peripheral flexibility, thermal range (–40°C to +85°C), and TSSOP-38 footprint compatibility with industrial PCB layouts.
Technical Context
The XMC1100T038F0016ABXUMA1 implements a single-cycle 32-bit hardware multiplier and SysTick timer for RTOS support, with NVIC enabling up to 32 interrupt sources. Its ERU unit routes external/internal events to CCU4 timers without CPU intervention, reducing latency in time-critical control loops.
On-chip analog subsystem includes dedicated ANACTRL register set, temperature sensor (TSE) with ±2°C accuracy over –40°C to +85°C, and VADC with programmable sampling rate up to 1.5 MSPS. The SCU manages clock distribution, reset control, and power modes including Sleep and Standby with wake-up via GPIO or RTC alarm.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit, Thumb/Thumb-2 instruction set, supports RTOS scheduling via SysTick |
| Flash Memory | 16 KB program/data storage, sector-erasable, 100k write/erase cycles, retention >20 years |
| SRAM | 16 KB high-speed on-chip RAM, zero-wait-state access at max CPU frequency |
| Analog Input Channels | 12 dedicated VADC channels with configurable gain, used for multi-sensor signal acquisition |
| Universal Serial Interface | 2 × USIC channels, each configurable as UART, I²C, I²S, SPI (single/dual/quad), or LIN master/slave |
| Operating Temperature | –40°C to +85°C ambient, validated for industrial-grade reliability in uncontrolled environments |
| Debug Interface | Serial Wire Debug (SWD) + Single Pin Debug (SPD), supports 4 hardware breakpoints and 2 watchpoints |
Pinout & Package
Package: PG-TSSOP-38-9 (38-pin Thin Shrink Small Outline Package, 0.5 mm pitch, 9.7 mm × 4.4 mm body).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | Core Power Supply | 1.3 V to 3.6 V digital core supply; decoupling required within 10 mm of pin |
| VSSP | Digital Ground | Reference return path for core logic and USIC peripherals |
| P0.0 / AIN0 | GPIO / Analog Input 0 | Configurable as digital I/O or first ADC channel input; supports hysteresis control |
| P1.2 / SCL0 | I²C Clock / GPIO | Hardware-controlled I²C clock line for USIC0 channel 0; open-drain capable |
| P2.7 / RXD1 | UART Receive / GPIO | Asynchronous serial input for USIC1 channel 1; supports auto-baud detection |
| RESETn | Active-Low Reset | Asynchronous reset input; internal pull-up enables reset release without external resistor |
| TCK / SWCLK | SWD Clock | Serial Wire Debug clock input; shared with JTAG TCK; requires 10 kΩ pull-down for SPD mode |
Key Features
| Feature | Design Value |
|---|---|
| CCU4 Capture/Compare Units | 4 independent 16-bit timers with dead-time insertion and shadow register update-enables precise PWM generation for BLDC motor gate drivers |
| Event Request Unit (ERU) | Hardware event router that triggers CCU4 reload or ADC start without CPU involvement-reduces interrupt latency below 100 ns |
| Temperature Sensor (TSE) | On-die sensor calibrated across –40°C to +85°C; output mapped to VADC channel for system thermal monitoring without external components |
| PRNG Module | Dedicated pseudo-random number generator compliant with FIPS 140-2; outputs 32-bit values in <100 ns for secure firmware updates |
| Real-Time Clock (RTC) | Independent 32-bit counter with alarm interrupt, battery-backed operation, and calendar mode-supports time-stamped logging in power-loss scenarios |
Applications
| Industrial Motor Control | Smart Power Supply Monitoring |
|---|---|
|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC blowers and industrial pumps. IC Role / Device Role / Timing Role: Main controller executing field-oriented control (FOC) algorithm, managing gate driver timing via CCU4 PWM outputs and current sensing via VADC. Use Value: 12-channel VADC enables simultaneous phase current and DC-link voltage sampling; ERU-triggered ADC conversion synchronizes with PWM edges for jitter-free acquisition. |
Use Scenario: Real-time monitoring of AC/DC converter parameters including input voltage, output current, and thermal margin. IC Role / Device Role / Timing Role: System supervisor interfacing with isolated voltage/current sensors and driving status LEDs or CAN alerts. Use Value: Dual USIC channels allow concurrent I²C communication with temperature sensors and UART reporting to host MCU-no software arbitration needed. |
| Factory Automation I/O Module | Embedded Sensor Hub |
|
Use Scenario: DIN-rail mounted digital input/output expansion module with surge protection and diagnostics. IC Role / Device Role / Timing Role: Local intelligence node handling opto-isolated inputs, relay drive timing, and fault logging via RTC-timestamped flash writes. Use Value: 16 KB SRAM buffers event logs during network outages; PRNG generates unique session IDs for secure firmware OTA updates. |
Use Scenario: Multi-sensor aggregation node collecting data from pressure, humidity, and ambient light sensors in predictive maintenance systems. IC Role / Device Role / Timing Role: Sensor fusion processor performing local calibration, filtering, and low-power wake-on-event using ERU and RTC alarm. Use Value: On-chip TSE validates sensor junction temperature during calibration; VADC's programmable gain eliminates external signal conditioning for varying sensor output ranges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar industrial microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XMC1100T038F0032ABXUMA1 | 32 KB Flash (vs. 16 KB), same SRAM, package, and peripheral set | Supports larger firmware images with integrated bootloader and encrypted firmware update stack | Select when future firmware growth or secure boot requirements exceed 16 KB code space |
| XMC1200T038F0032ABXUMA1 | ARM Cortex-M0+ core, 32 KB Flash, 16 KB SRAM, enhanced USIC features (e.g., FIFO depth + DMA trigger) | Better suited for high-throughput sensor fusion or protocol bridging (e.g., Modbus-to-I²C gateway) | Choose for higher CPU performance headroom or advanced peripheral timing control not available in M0 variant |
Compared with XMC1100T038F0016ABXUMA1, the 32 KB Flash variant offers direct firmware scalability without hardware redesign, while the XMC1200 variant delivers measurable throughput gains in USIC-heavy protocols but requires toolchain and qualification updates.
Availability
XMC1100T038F0016ABXUMA1 is available at Aetrix Electronics and suitable for industrial motor control, smart power supply monitoring, and factory automation I/O modules requiring stable component supply across extended product lifecycles.
Supply support for XMC1100T038F0016ABXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial microcontrollers with ISO/TS 16949 and IATF 16949 certified fabrication.
The XMC1100 series belongs to Infineon's XMC™ family-designed specifically for deterministic real-time control in cost-sensitive industrial applications where robustness, analog integration, and debug accessibility outweigh raw compute throughput.
FAQ
What is the maximum operating frequency of the XMC1100T038F0016ABXUMA1?
The XMC1100T038F0016ABXUMA1 operates at up to 48 MHz across its full temperature range (–40°C to +85°C), with internal PLL enabling clock multiplication from the on-chip DCO or external crystal. This frequency is validated under worst-case voltage (1.3 V) and temperature conditions per Infineon's datasheet Section 3.3.6.
Does this device support hardware-based encryption or secure boot?
No, the XMC1100T038F0016ABXUMA1 does not include dedicated cryptographic accelerators or secure boot ROM. It provides a PRNG module compliant with FIPS 140-2 for entropy generation, but secure firmware validation must be implemented externally or via software-based signature checking in application code.
Can the USIC modules interface with standard I²C EEPROMs?
Yes-the USIC0 and USIC1 modules support standard-mode (100 kHz) and fast-mode (400 kHz) I²C communication, including 7-bit addressing, repeated START, and ACK/NACK handling. Each USIC channel can independently manage I²C bus arbitration and clock stretching, verified in Infineon Application Note AP32274.
Is there a recommended decoupling capacitor layout for the VDDP pin?
Infineon specifies a minimum 100 nF ceramic capacitor placed within 3 mm of the VDDP pin, plus a bulk 4.7 µF tantalum or ceramic capacitor within 10 mm. Layout guidelines require separate analog (VDDA) and digital (VDDP) power planes tied at a single point near the IC, as detailed in Section 4.1.1 of the XMC1000 Family Hardware Design Guide.
XMC1100T038F0016ABXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 38-TFSOP (0.173", 4.40mm Width)
- Series:
- XMC1000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, I2S, POR, PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
XMC1100T038F0016ABXUMA1 FAQ
1.How can I place an order for XMC1100T038F0016ABXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for XMC1100T038F0016ABXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XMC1100T038F0016ABXUMA1 reliable?
The price and inventory of XMC1100T038F0016ABXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XMC1100T038F0016ABXUMA1 is usually 5 days.
3.What payment methods are accepted for XMC1100T038F0016ABXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XMC1100T038F0016ABXUMA1 transactions.
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XMC1100T038F0016ABXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XMC1100T038F0016ABXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XMC1100T038F0016ABXUMA1?
For technical support, including XMC1100T038F0016ABXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XMC1100T038F0016ABXUMA1 requirements.
6.How does Aetrix verify that XMC1100T038F0016ABXUMA1 is sourced from the original manufacturer or authorized distributors?
All XMC1100T038F0016ABXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XMC1100T038F0016ABXUMA1 meets industry standards.
7.What is the process for return or replacement of XMC1100T038F0016ABXUMA1?
All XMC1100T038F0016ABXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XMC1100T038F0016ABXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XMC1100T038F0016ABXUMA1 part is unused and in its original packaging.
Return procedure for XMC1100T038F0016ABXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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