Infineon Technologies XMC1100T038F0064ABXUMA1
- Part No.:
- XMC1100T038F0064ABXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 38-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
XMC1100T038F0064ABXUMA1.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 38TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,697
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XMC1100T038F0064ABXUMA1 from Infineon is an ARM® Cortex®-M0 32-bit microcontroller in TSSOP-38 package, featuring 64 KB Flash, 16 KB SRAM, 12-channel 12-bit VADC, dual USIC interfaces (configurable as UART/I²C/I²S/SPI), and CCU4 timer units. It targets industrial motor control, sensor signal conditioning, and programmable logic I/O subsystems requiring deterministic real-time response.
For engineers reviewing the XMC1100T038F0064ABXUMA1 datasheet, XMC1100T038F0064ABXUMA1 pinout, XMC1100T038F0064ABXUMA1 application, or XMC1100T038F0064ABXUMA1 equivalent, key selection criteria include Flash size vs. peripheral count trade-offs, TSSOP-38 thermal performance in convection-cooled enclosures, USIC flexibility for multi-protocol fieldbus bridging, and CCU4 resolution for PWM-driven actuator timing.
Technical Context
The XMC1100T038F0064ABXUMA1 implements a single-core ARM Cortex-M0 CPU with Thumb/Thumb-2 instruction support, 32-bit hardware multiplier, and SysTick timer. Its memory subsystem includes 8 KB ROM (bootloader, drivers), 16 KB SRAM, and 64 KB Flash with sector 0 read-only protection.
Peripherals are organized via AHB-Lite and APB buses: two USIC channels support simultaneous UART + I²C or dual SPI masters; VADC provides 12-bit conversion across 12 pins with configurable sampling windows; CCU4 delivers four independent 16-bit timers with dead-time insertion for motor gate drive.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit, 48 MHz max operation - enables deterministic interrupt latency under 12 cycles for safety-critical I/O servicing. |
| Flash Memory | 64 KB on-chip Flash with ECC and sector 0 read-only - supports secure bootloader storage and firmware update partitioning. |
| SRAM | 16 KB high-speed SRAM - sufficient for real-time control stacks, PID buffers, and dual-buffered USIC DMA transfers. |
| Analog Input | 12-channel 12-bit VADC with hardware oversampling - achieves effective 14-bit resolution for precision current sensing in BLDC drives. |
| Serial Interfaces | 2 × USIC modules, each configurable as UART/I²C/I²S/SPI/LIN - eliminates external protocol translators in multi-sensor industrial nodes. |
| Timer System | CCU4 with four 16-bit timers, capture/compare, dead-time generation - directly controls three-phase inverter gate drivers without FPGA assistance. |
| Debug Interface | SWD + single-pin SPD - enables in-system debugging with minimal PCB footprint and no dedicated debug header. |
Pinout & Package
Package: PG-TSSOP-38-9 (38-pin Thin Shrink Small Outline Package, 0.5 mm pitch, 9.7 mm × 4.4 mm body, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0 | GPIO / USIC0_CH0_TXD / CCU40_OUT0 | Multi-function pin supporting UART transmit, I²C SDA, or PWM output - selectable per application need without external muxing. |
| P0.1 | GPIO / USIC0_CH0_RXD / CCU40_OUT1 | Configurable as UART receive, I²C SCL, or complementary PWM - enables synchronous half-duplex or full-duplex serial links. |
| P1.0 | VADC0_IN0 / ERU0_PD0 | Analog input channel 0 with 12-bit resolution and hardware trigger from event request unit - allows precise timing of current sampling relative to PWM edges. |
| P1.1 | VADC0_IN1 / ERU0_PD1 | Analog input channel 1 with identical timing and trigger capability - supports differential voltage measurement across shunt resistors. |
| P2.0 | CCU40_ST0 / USIC1_CH1_SCLK | CCU4 start trigger input or USIC1 clock output - synchronizes ADC sampling with PWM period start or drives external SPI peripherals. |
| VDDP | Digital Power Supply (2.7–5.5 V) | Single-supply operation compatible with 3.3 V or 5 V industrial rails - reduces BOM count versus split-rail MCUs. |
| VSS | Digital Ground | Dedicated ground pin adjacent to VDDP - minimizes supply noise coupling into analog and digital domains. |
| VREFP | ADC Reference Voltage Input | Accepts external 2.5 V reference or internal VDDP - enables ratiometric or absolute voltage measurements per system requirement. |
Key Features
| Feature | Design Value |
|---|---|
| USIC Flexibility | Each USIC supports concurrent UART + I²C or dual SPI masters - enables one chip to manage both sensor I²C bus and RS-485 fieldbus interface. |
| VADC Hardware Triggering | Direct linkage between CCU4 PWM events and VADC start - eliminates software overhead and jitter in motor phase current sampling. |
| CCU4 Dead-Time Insertion | Programmable 1–255 ns dead time per channel - prevents shoot-through in half-bridge MOSFET drivers without external logic. |
| SPD Single-Pin Debug | Full SWD functionality over single bidirectional pin - saves PCB space and routing complexity in space-constrained industrial modules. |
| Temperature Sensor | Integrated die temperature sensor with ±2°C accuracy - enables thermal derating of motor control algorithms without external components. |
Applications
| Brushless DC Motor Control | Industrial IO-Link Master Node |
|---|---|
|
Use Scenario: Closed-loop commutation of 3-phase BLDC motors in HVAC blowers and pump drives. IC Role / Device Role / Timing Role: Real-time PWM generation, current sensing via VADC, and position feedback decoding using CCU4 capture inputs. Use Value: Integrated dead-time control and hardware-triggered ADC sampling reduce current ripple by >15% versus software-timed alternatives. |
Use Scenario: Field device connectivity hub aggregating up to 8 IO-Link sensors with diagnostics and parameterization. IC Role / Device Role / Timing Role: Dual USIC channels operate as physical layer transceivers (one as UART-to-IO-Link PHY, one as I²C master for local sensor config). Use Value: Eliminates discrete transceiver ICs and reduces bill-of-materials cost by $0.85 per node while maintaining IEC 61131-9 compliance. |
| Programmable Logic Relay Module | Smart Temperature Transmitter |
|
Use Scenario: DIN-rail mounted relay controller executing ladder logic for machine safety interlocks and sequencing. IC Role / Device Role / Timing Role: GPIO bit manipulation with sub-microsecond edge control, watchdog supervision, and RTC-based time-stamped event logging. Use Value: Deterministic 100 ns GPIO toggle ensures EN/STB signal integrity for solid-state relays, meeting SIL-2 timing requirements. |
Use Scenario: 4–20 mA loop-powered transmitter for RTD/thermocouple inputs in process instrumentation. IC Role / Device Role / Timing Role: Precision VADC with internal reference, temperature-compensated linearization, and HART modem support via USIC UART. Use Value: On-chip temperature sensor calibrates ADC offset drift, achieving ±0.1°C total error over –40°C to +85°C without external compensation circuitry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar industrial microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XMC1100T038F0128ABXUMA1 | 128 KB Flash, same package/peripherals - doubles firmware headroom for OTA updates and dual-bank bootloading. | Required where field-upgradable safety firmware mandates redundant image storage. | Select when future-proofing against feature creep or regulatory recertification cycles. |
| XMC1200T038F0200ABXUMA1 | ARM Cortex-M0+, 200 KB Flash, enhanced CCU8 timers, higher clock (64 MHz) - adds floating-point assist and advanced PWM synchronization. | Suitable for servo drives needing vector control math acceleration and multi-axis phase alignment. | Choose only if existing codebase requires M0+ ISA extensions or >48 MHz timing resolution is mandatory. |
Compared with XMC1100T038F0064ABXUMA1, the 128 KB variant offers immediate scalability within identical pinout and thermal envelope, while the XMC1200 introduces architectural upgrades that increase power consumption and toolchain complexity without benefit for fixed-function industrial I/O tasks.
Availability
XMC1100T038F0064ABXUMA1 is available at Aetrix Electronics and suitable for industrial motor control, IO-Link master nodes, and programmable logic relay modules requiring stable component supply across multi-year production programs.
Supply support for XMC1100T038F0064ABXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
The XMC1100 series belongs to Infineon's XMC™ microcontroller family, designed specifically for deterministic real-time control in harsh industrial environments-emphasizing robust peripheral integration, low-power operation, and functional safety readiness.
FAQ
What is the maximum operating frequency and voltage range for XMC1100T038F0064ABXUMA1?
The XMC1100T038F0064ABXUMA1 operates at up to 48 MHz with a supply voltage range of 2.7 V to 5.5 V. This wide voltage window supports direct connection to both 3.3 V logic systems and legacy 5 V industrial rails without level-shifting circuitry. The core frequency is derived from an internal PLL locked to the on-chip DCO or external crystal, and all peripherals remain fully functional across the entire voltage and temperature range (–40°C to +85°C).
Does this MCU support hardware-based cryptographic functions?
No, the XMC1100T038F0064ABXUMA1 does not include dedicated cryptographic accelerators such as AES or SHA engines. It relies on software libraries for encryption tasks. However, its PRNG (pseudo-random number generator) module provides entropy for key derivation, and the Flash memory supports write-protection and read-out protection features to safeguard firmware IP. For applications requiring certified crypto operations, Infineon's OPTIGA™ Trust family or XMC4000-series MCUs with CORDIC engines are recommended alternatives.
Can the USIC modules handle simultaneous UART and I²C communication?
Yes - each USIC channel can be independently configured: one USIC may run as a full-duplex UART (e.g., for host PC communication), while the other operates as an I²C master (e.g., for reading local sensor registers). Both protocols run concurrently without CPU intervention, using separate DMA channels and dedicated FIFOs. Pin multiplexing is resolved at initialization via the PORTx_IOCR register, and no resource conflict occurs because USIC0 and USIC1 have fully independent clock domains and control logic.
Is there a qualified alternative package for reflow-sensitive applications?
Yes - the same XMC1100-T038 derivative is also offered in PG-VQFN-38-13 (38-pin VQFN, 5 mm × 5 mm, 0.5 mm pitch), which provides superior thermal dissipation and lower profile than TSSOP. This package is RoHS-compliant, halogen-free, and qualified for lead-free reflow per J-STD-020D.3. While pinout differs slightly (e.g., VDDP/VSS placement), the electrical characteristics and peripheral mapping remain identical, enabling drop-in replacement in thermally constrained designs like sealed enclosure controllers.
XMC1100T038F0064ABXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 38-TFSOP (0.173", 4.40mm Width)
- Series:
- XMC1000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, I2S, POR, PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
XMC1100T038F0064ABXUMA1 FAQ
1.How can I place an order for XMC1100T038F0064ABXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for XMC1100T038F0064ABXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XMC1100T038F0064ABXUMA1 reliable?
The price and inventory of XMC1100T038F0064ABXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XMC1100T038F0064ABXUMA1 is usually 5 days.
3.What payment methods are accepted for XMC1100T038F0064ABXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XMC1100T038F0064ABXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XMC1100T038F0064ABXUMA1?
XMC1100T038F0064ABXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XMC1100T038F0064ABXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XMC1100T038F0064ABXUMA1?
For technical support, including XMC1100T038F0064ABXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XMC1100T038F0064ABXUMA1 requirements.
6.How does Aetrix verify that XMC1100T038F0064ABXUMA1 is sourced from the original manufacturer or authorized distributors?
All XMC1100T038F0064ABXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XMC1100T038F0064ABXUMA1 meets industry standards.
7.What is the process for return or replacement of XMC1100T038F0064ABXUMA1?
All XMC1100T038F0064ABXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XMC1100T038F0064ABXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XMC1100T038F0064ABXUMA1 part is unused and in its original packaging.
Return procedure for XMC1100T038F0064ABXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XMC1100T038F0064ABXUMA1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
